• Features 9 heating zones for precise temperature control during soldering.
• Includes 3 upper cooling zones with water cooling for efficient heat dissipation.
• Customizable plate size from 70*50mm to 300*350mm to fit various PCB dimensions.
• High vacuum technology reduces bubbles and voids in soldering surfaces.
• Optimized soldering parameters improve wettability and joint quality.
• Reduces oxidation and minimizes cold solder joints for reliable connections.
• Standard process edge of 5mm, with options for customization.
• Compact design with overall dimensions of 6567*1420*1520mm for space efficiency.

• What are the benefits of vacuum reflow soldering?
  Vacuum reflow soldering reduces voids and bubbles in solder joints, improves wettability, and minimizes oxidation, leading to higher-quality and more reliable connections.
• Can the plate size be customized?
  Yes, the plate size is customizable, ranging from 70*50mm to 300*350mm, to accommodate various PCB dimensions and requirements.
• How does the cooling system work?
  The machine features 3 upper cooling zones with water cooling, supported by an external chiller, ensuring efficient and controlled heat dissipation during the soldering process.