Forno di raffreddamento a aria calda verticale

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Forno di raffreddamento a aria calda verticale

Macchine per la manipolazione dei PCB

November 25, 2024

Connessione Categoria: Macchine per la manipolazione dei PCB

Chiacchierare Contattici

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#Forno di raffreddamento ad aria calda #Forno a reflusso di aria calda #Saldatrice selettivo di Wave

Breve: Discover the GSKL-650 Vertical Hot Air Curing Oven, designed for PCB curing with 67KW power. Featuring PID closed-loop control, 4 temperature zones, and large hot air circulation, this oven ensures precise temperature distribution (±3.0°C) and efficient curing for consumer electronics.

Caratteristiche del prodotto correlate:

PID closed-loop control + SSR drive ensures precise temperature management.
Large hot air circulation with two-side blowing and top return air for uniform heating.
Automatic rail width adjustment (80~460mm) for versatile PCB handling.
Intelligent fault layer shielding enhances efficiency by isolating malfunctioning layers.
Needle roller active transportation prevents jamming and plate damage.
Energy-saving small cycle actions reduce operational costs.
60-layer capacity with 20mm spacing for high-volume production.
Compact dimensions (2150x2050x2150mm) and <2000KG weight for easy integration.

Domande frequenti:

What is the temperature range of the GSKL-650 Vertical Hot Air Curing Oven?

The oven offers a temperature setting range from room temperature up to 200°C, suitable for various curing applications.
How does the oven minimize jamming risks during PCB transportation?

The oven features an innovative needle roller active transportation system, eliminating jamming and plate damage compared to traditional chain-driven systems.
Can the oven operate with a reduced number of layers for energy efficiency?

Yes, the adjustable operation range allows energy-saving small cycle actions without requiring products to pass through the top layer, optimizing power usage.