Several commonly used IPC standards for printed circuit board production

Printed circuit boards are manufactured according to customer or industry requirements, following different IPC standards. The following summarizes the common standards of printed circuit board production for reference.

1)IPC-ESD-2020: Joint standard for the development of electrostatic discharge control procedures. Including electrostatic discharge control program necessary design, establishment, implementation and maintenance. Based on the historical experience of certain military organizations and commercial organizations, it provides guidance for the treatment and protection of electrostatic discharge during sensitive periods.

2)IPC-SA-61A: semi-aqueous cleaning manual after welding. Includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, process, process control, and environmental and safety considerations.

3)IPC-AC-62A: Water cleaning manual after welding. Describe the costs of manufacturing residues, types and properties of water-based cleaners, water-based cleaning processes, equipment and processes, quality control, environmental control, and employee safety and cleanliness measurement and determination.

4)IPC-DRM-40E: Through hole welding point evaluation desktop reference manual. Detailed descriptions of components, hole walls, and weld surfaces as per standard requirements, in addition to computer-generated 3D graphics. It covers filling, contact Angle, tinning, vertical filling, pad covering, and numerous weld point defects.

5)IPC-TA-722: Welding Technology Evaluation Manual. Includes 45 articles on all aspects of welding technology, covering general welding, welding materials, manual welding, batch welding, wave soldering, reflow welding, gas phase welding, and infrared welding.

6)IPC-7525: Template Design Guidelines. Provides guidelines for the design and manufacture of solder paste and surface-mount binder coated formforms.i Also discusses formwork designs that apply surface-mount techniques, and describes hybrid techniques with through-hole or flip-chip components, including overprint, double print, and stage formwork designs.

7)IPC/EIAJ-STD-004: Specification requirements for flux I includes Appendix I. Including rosin, resin and other technical indicators and classification, according to the content of halide in the flux and the degree of activation classification of organic and inorganic flux; It also covers the use of flux, substances containing flux, and low-residue flux used in no-clean processes.

8)IPC/EIAJ-STD-005: Specification requirements for solder paste I includes Appendix I. The characteristics and technical requirements of solder paste are listed, including test methods and standards for metal content, as well as viscosity, collapse, solder ball, viscosity and solder paste sticking properties.

9)IPC/EIAJ-STD-006A: Specification requirements for electronic grade solder alloys, flux and non-flux solid solder. For electronic grade solder alloys, for rod, band, powder flux and non-flux solder, for electronic solder applications, for special electronic grade solder terminology, specification requirements and test methods.

10)IPC-Ca-821: General requirements for thermal conductivity binders. Includes requirements and test methods for thermal conductivity media that will glue components to suitable locations.

11)IPC-3406: Guidelines for Coating binders on conductive surfaces. To provide guidance for the selection of conductive binders as solder alternatives in electronic manufacturing.

12)IPC-AJ-820: Assembly and Welding manual. Contains a description of inspection techniques for assembly and welding, including terms and definitions; Specification reference and outline for printed circuit boards, components and pin types, welding point materials, component installation, design; Welding technology and packaging; Cleaning and laminating; Quality assurance and testing.

13)IPC-7530: Guidelines for temperature curves for batch welding processes (reflow welding and Wave soldering). Various testing methods, techniques and methods are used in temperature curve acquisition to provide guidance for establishing the best graph.

14)IPC-TR-460A: Troubleshooting list for wave soldering of printed circuit boards. A list of recommended corrective actions for faults that may be caused by crest welding.

15)IPC/EIA/JEDECJ-STD-003: weldability test for printed circuit boards.

16)J-STD-013: Ball-foot Lattice array package (SGA) and other high density technology applications. Establish the specification requirements and interactions required for the printed circuit board packaging process to inform high-performance and high-pin number integrated circuit package interconnections, including information on design principles, material selection, board fabrication and assembly techniques, test methods, and reliability expectations based on the end-use environment.

17)IPC-7095: Design and assembly process supplement for SGA devices. Provide a variety of useful operational information for those who are using SGA devices or considering switching to array packaging; Provide guidance on SGA inspection and maintenance and provide reliable information on the SGA field.

18)IPC-M-I08: Cleaning Instruction Manual. Includes the latest version of IPC cleaning guidance to assist manufacturing engineers as they determine the cleaning process and troubleshooting of products.

19)IPC-CH-65-A: Cleaning Guidelines for printed circuit board assembly. Provides references to current and emerging cleaning methods in the electronics industry, including descriptions and discussions of various cleaning methods, explaining the relationships between various materials, processes, and contaminants in manufacturing and assembly operations.

20)IPC-SC-60A: Cleaning manual for solvents after welding. The application of solvent cleaning technology in automatic welding and manual welding is given. The properties of solvent, residues, process control and environmental problems are discussed.

21)IPC-9201: Surface Insulation Resistance Manual. Covers terminology, theory, test procedures, and test methods for surface insulation resistance (SIR), as well as temperature and humidity (TH) tests, failure modes, and troubleshooting.

22)IPC-DRM-53: Introduction to the Electronic Assembly Desktop Reference Manual. Illustrations and photographs used to illustrate through-hole mounting and surface-mount assembly techniques.

23)IPC-M-103: Surface Mount Assembly manual standard. This section includes all 21 IPC files on surface mount.

24)IPC-M-I04: Printed circuit Board Assembly manual standard. Contains the 10 most widely used documents on printed circuit board assembly.

25)IPC-CC-830B: Performance and identification of electronic insulating compounds in printed circuit board assembly. The shape coating meets an industry standard for quality and qualification.

26)IPC-S-816: Surface mount technology process Guide and list. This troubleshooting guide lists all types of process problems encountered in surface mount assembly and how to resolve them, including Bridges, missed welds, uneven placement of components, etc.

27)IPC-CM-770D: Installation Guide for PCB components. Provides effective guidance on the preparation of components in printed circuit board assembly and reviews relevant standards, influences and releases, including assembly techniques (both manual and automatic as well as surface mount and flip-chip assembly techniques) and considerations for subsequent welding, cleaning and laminating processes.

28)IPC-7129: Calculation of Number of failures per million opportunities (DPMO) and manufacturing index of PCB assembly. Agreed benchmark indicators for the calculation of defects and quality related industrial sectors; It provides a satisfactory method for calculating the benchmark of the number of failures per million chances.

29)IPC-9261: Printed circuit board assembly yield estimates and failures per million chances of assembly in progress. A reliable method is defined for calculating the number of failures per million opportunities during PCB assembly and is a measure for evaluation at all stages of the assembly process.

30)IPC-D-279: Design Guide for assembly of printed circuit Boards for Reliable Surface Mount Technology. Reliable manufacturing process guide for surface-mount technology and hybrid technology printed circuit boards, including design ideas.

31)IPC-2546: Combination requirements for conveying key points in printed circuit board assembly. Material movement systems such as actuators and buffers, manual placement, automatic screen printing, automatic binder distribution, automatic surface mount placement, automatic plating through hole placement, forced convection, infrared reflux furnace, and wave soldering are described.

32)IPC-PE-740A: Troubleshooting in printed circuit board manufacturing and assembly. It includes case records and correction activities of problems occurring in the design, manufacture, assembly and testing of printed circuit products.

33)IPC-6010: Printed Circuit Board Quality Standards and Performance specifications series manual. Includes the quality standards and performance specifications set by the American Printed Circuit Board Association for all printed circuit boards.

34)IPC-6018A: Inspection and testing of microwave finished printed circuit boards. Includes performance and qualification requirements for high frequency (microwave) printed circuit boards.

35)IPC-D-317A: Guidelines for the design of electronic packages using high-speed technology. Provides guidance on the design of high-speed circuits, including mechanical and electrical considerations and performance testing