Why is 3D SPI indispensable for high-precision solder paste inspection?

Why is 3D SPI indispensable for high-precision solder paste inspection?

Introduction: The "Achilles' heel" in SMT manufacturing - solder paste printing process

In today's booming modern electronic manufacturing industry, surface mount technology (SMT) has become the core process of PCB assembly. With its characteristics of high efficiency and precision, it supports the vast system of large-scale production of electronic products. However, a shocking figure is like a heavy hammer sounding the alarm: According to the Global Surface Mount Association, as many as 74% of the defects generated throughout the SMT process originate from the solder paste printing stage. This step is like the ankle of Achilles in Greek mythology. It may seem insignificant, but it has become the most vulnerable and problem-prone key point in the entire SMT process.

With the continuous upgrading and replacement of electronic products, high density and miniaturization have become significant trends in their development. Traditional 2D detection technology has become inadequate in the face of this new trend and is unable to meet the strict detection requirements of today. Against such a background, this paper will deeply analyze the technical shortcomings of 2D SPI, elaborate in detail the revolutionary breakthroughs brought by 3D SPI, focus on introducing the five core technical advantages of ALeader 3D SPI of Shenzhou Vision, and conduct analysis in combination with practical application cases to understand the key technologies of high-precision solder paste detection.

The fatal flaw of 2D SPI: The limitation of plane detection

The basic principle of 2D detection
Traditional 2D SPI (Solder Paste Inspection), or Solder paste printing inspection, relies mainly on top lighting and camera imaging technology. It is like a "flat detective", only able to observe the state of the solder paste from above, mainly checking whether the area size of the solder paste meets the standard, whether there is any deviation in position, whether there is any missed printing, and whether there is any obvious bridging phenomenon. However, this detection method is like looking at the world through a thin veil, only revealing partial information on the plane, but being powerless against three-dimensional issues such as height and volume.

Undetectable key defects
Why is 3D SPI indispensable for high-precision solder paste inspection?

Take the actual case of a certain automotive electronics manufacturer as an example. After using 2D SPI for detection, the manufacturer considered the product qualified. However, in the subsequent reliability test, a false soldering problem of up to 10% occurred. After in-depth analysis, it was ultimately found that the root cause of the problem was actually the insufficient height of solder paste. This case fully exposes the limitations of 2D SPI in detecting critical defects. It is like an inspector with "visual defects", unable to accurately capture the hidden dangers beneath the plane.

The Technological Revolution of 3D SPI: The Leap from Planar to Three-dimensional

Why is 3D SPI indispensable for high-precision solder paste inspection?

The core parameters of 3D detection

3D SPI technology is like an expert proficient in stereoscopic detection. It can conduct comprehensive and precise detection of solder paste from multiple dimensions. Its core parameters are astonishing:

Height: It features ultra-high resolution and can precisely measure the minute height changes of solder paste, just like using an extremely fine ruler to measure the height of an object.
Volume: It features high measurement accuracy and can accurately calculate the volume of solder paste, ensuring that the amount of solder paste used is just right.
Three-dimensional shape: It can completely reconstruct the three-dimensional outline of the solder paste, allowing us to clearly see the shape and distribution of the solder paste, just like taking a comprehensive "photo" of the solder paste.
Coplanarity: It can precisely measure the height difference of multiple weld points, ensuring the flatness of the welding surface and avoiding welding problems caused by inconsistent heights.

Comparison of Key Technologies
Why is 3D SPI indispensable for high-precision solder paste inspection?

It can be clearly seen from the comparison that 3D SPI has made a qualitative leap in the detection dimension and measurement parameters. It can detect many key defects that 2D SPI cannot detect, and the defect detection rate has also been significantly improved. Meanwhile, it can also adapt to the detection of smaller and more complex micro-components, providing a reliable guarantee for the production of high-density and miniaturized electronic products.

The five core technologies of ALeader 3D SPI of Shenzhou Vision

Dual projection grating technology
This technology employs orthogonal bidirectional grating projection, as if illuminating an object simultaneously from two different directions, effectively eliminating the shadow effect of a single light source. This unique design significantly enhances the measurement accuracy, as if adding a layer of "precision filter" to the measurement results, enabling us to obtain the information of solder paste more accurately.
Why is 3D SPI indispensable for high-precision solder paste inspection?

Adaptive optical system
This system has a strong adaptability and can automatically compensate for the warping of PCBS, just like a considerate "restorer", keeping the PCBS flat during the inspection process. Meanwhile, it can also automatically identify multi-color PCBS. Whether it's green, black or blue PCBS, it can handle them with ease. In addition, its anti-reflective algorithm can avoid sandblasting treatment, which greatly improves the detection efficiency and reduces the production cost.

Why is 3D SPI indispensable for high-precision solder paste inspection?

Intelligent algorithm engine
The defect classification technology based on deep learning endows 3D SPI with a "smart brain", which can classify and identify various defects quickly and accurately. The real-time 3D modeling function can construct an accurate 3D model of solder paste, providing strong support for subsequent analysis and processing. The processing capacity of millions of point cloud data ensures that the system can still operate efficiently when dealing with a large amount of data, without any lag or errors.

Full-process data traceability
The complete 3D data of each PCB will be archived, just like establishing a detailed "growth file" for each PCB. These data can be seamlessly integrated with the MES system to achieve information-based management of the production process. Meanwhile, it supports the IPC-CFX standard, ensuring the universality and compatibility of data and facilitating data sharing and analysis for enterprises.

Intelligent closed-loop control
3D SPI can be linked with the printing press in real time, just like a tacit "partner". When problems are detected in solder paste printing, it can automatically adjust the parameters of the printing machine to achieve preventive quality control. In addition, it can also provide preventive maintenance tips to detect potential hazards of the equipment in advance and avoid production disruptions caused by equipment failures.
Why is 3D SPI indispensable for high-precision solder paste inspection?

ALeader 3D SPI - A must-have for high-quality SMT production

With the continuous development of electronic products towards miniaturization and high density, the requirements for SMT quality control are also getting higher and higher. Due to its technical limitations, 2D SPI has been unable to meet the current production demands. With its leapfrog development from planar to three-dimensional, 3D SPI has advantages such as three-dimensional full-parameter detection, intelligent early warning system and process optimization capabilities. It can completely solve the blind spots of 2D detection, achieve preventive quality control and continuously improve the process level.

As an outstanding representative of 3D SPI technology, ALeader 3D SPI of Shenzhou Vision has helped customers achieve remarkable effects such as reduced defect rate, reduced rework cost and increased straight-through rate through its five core technical advantages. In the future field of electronic manufacturing, 3D SPI will undoubtedly become a must-have for high-quality SMT production, providing strong technical support for the development of the electronic industry.