TRI, a supplier of test and inspection systems for the electronics manufacturing industry, announced the completion and opening of the Linkou Phase II Manufacturing Center building. Teletech is committed to developing new technologies and inspection solutions and entering the semiconductor and advanced packaging industry applications. The newly completed Manufacturing Center building is an extension of the Linkou Manufacturing Center base in Taiwan, consisting of 10 floors above ground and 4 floors below ground, with dedicated exhibition halls and seminar Spaces. It has greatly increased the production capacity, product development/verification space, and the display area of various product lines and smart factory applications. The company offers one-stop solutions for PCBA board assembly and advanced package testing and inspection, including 3D solder Paste Printing Inspection (SPI), 3D Automatic Optical Inspection (AOI), 3D CT Automatic X-ray Inspection (AXI) and high-performance Applied Circuit Testing (ICT). Our solution portfolio has a wide range of advanced and advanced features to meet current and future production line requirements. Celebrate the 35th anniversary of Delu Technology with you to celebrate the 35th anniversary of Delu Technology! Delu will continue to focus on AI-driven test and inspection solutions at exhibitions and workshops throughout 2024. Delu's success reflects a commitment to excellence and a continuous journey of growth with our valued customers.