Product Details
Place of Origin: Korea
Brand Name: Hanwha
Model Number: HM520h
Payment & Shipping Terms
Minimum Order Quantity: 1 PCS
Price: USD+negotiable+pcs
Packaging Details: 10*10*5 cm
Delivery Time: 1-7 days
Payment Terms: T/T
Supply Ability: 1+pcs+per days
Machine Type: |
High Speed Mini LED Machine |
Alignment: |
Fix Camera / LED Polarity Camera |
The Number Of Spindles: |
20 Spindles X 2 Gantry (Rotary Type) |
Placement Speed (Optimum) Wafer: |
65,000 CPH |
Placement Speed (Optimum) Chip: |
78,000 CPH |
Placement Accuracy Wafer: |
±20um @ Cpk ≥ 1.0 |
Placement Accuracy: |
+25 Um@ Cpk ≥1.0 |
Component Range Size: |
0201~6mm |
Component Range Max.Height: |
2.1 Mm |
Parts Supply Wafer: |
6"Hoof Ring(9 Step)x 2set |
Parts Supply Reel (8 Mm Standard): |
4 Slot X 2set |
PCB Size(mm) Min: |
L50*W50 |
PCB Size(mm) Max: |
Single Lane:~L510xW580,~L750 X W580(Option);Dual Lane:~L510×W310,~L750xW310 (Option) |
Weight (H900 Mm Standard): |
Apprax.1,670 Kg |
Extemal Dimension (Standard): |
L890 × D2,370xH1,930 Mm |
Condition: |
Used Original |
Machine Type: |
High Speed Mini LED Machine |
Alignment: |
Fix Camera / LED Polarity Camera |
The Number Of Spindles: |
20 Spindles X 2 Gantry (Rotary Type) |
Placement Speed (Optimum) Wafer: |
65,000 CPH |
Placement Speed (Optimum) Chip: |
78,000 CPH |
Placement Accuracy Wafer: |
±20um @ Cpk ≥ 1.0 |
Placement Accuracy: |
+25 Um@ Cpk ≥1.0 |
Component Range Size: |
0201~6mm |
Component Range Max.Height: |
2.1 Mm |
Parts Supply Wafer: |
6"Hoof Ring(9 Step)x 2set |
Parts Supply Reel (8 Mm Standard): |
4 Slot X 2set |
PCB Size(mm) Min: |
L50*W50 |
PCB Size(mm) Max: |
Single Lane:~L510xW580,~L750 X W580(Option);Dual Lane:~L510×W310,~L750xW310 (Option) |
Weight (H900 Mm Standard): |
Apprax.1,670 Kg |
Extemal Dimension (Standard): |
L890 × D2,370xH1,930 Mm |
Condition: |
Used Original |
High productivity
一, Optimization of Mini LED Production
This is a highly precise equipment that uses 20 Spindle Rotary Head and can produce Mini LEDs with a size of 0.2x0.1mm. The Wafer Handling Unit is utilized to achieve a maximum production capacity of 65,000 CPH.
二, High-speed and High-precision LED Ejecting
The ejector is precisely controlled by a lightweight and high-precision motor along the X/Y/Z axes. When the suction nozzle at the head sucks the LED, the ejector moves along the X/Y/Z axes and supports the LED bottom surface of the Wafer.
三, Optimizing the Supply of Mini LED (Hoof Ring + Reel Feeder)
This is a device that can use both Hoof Ring WaferType and Reel Feeder simultaneously. There are 4 Feeder Slots in the Reel Feeder.
It is equipped with a Reel Cutter, making it easy to manage the discarded round material discs.
※ Reel Feeder: Option
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