La série MagicRay 3D SPI-VSP3000 est adaptée à l'inspection 3D de la pâte de soudure après l'impression sur écran SMT

Machines de cueillette et de placement SMT
February 11, 2025
Video Description:
Discover the MagicRay 3D SPI-VSP3000 series, designed for precise 3D solder paste inspection post SMT screen printing. This advanced system ensures accurate height measurement, detects defects like solder bridging, and improves process quality with SPC data analysis. Perfect for enhancing your SMT production efficiency.