Seri MagicRay 3D SPI-VSP3000 cocok untuk inspeksi pasta solder 3D setelah pencetakan layar SMT

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Seri MagicRay 3D SPI-VSP3000 cocok untuk inspeksi pasta solder 3D setelah pencetakan layar SMT

Mesin SMT Pick and Place

February 11, 2025

Koneksi Kategori: Mesin SMT Pick and Place

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#SMT Elektronik Pick And Place Mesin #peralatan perakitan pcb pick and place #Peralatan SMT pick and place

Singkat: Discover the MagicRay 3D SPI-VSP3000 series, designed for precise 3D solder paste inspection post SMT screen printing. This advanced system ensures accurate height measurement, detects defects like solder bridging, and improves process quality with SPC data analysis. Perfect for enhancing your SMT production efficiency.

Fitur Produk terkait:

Intelligent zero reference point technology ensures accurate height measurement.
Detects solder bridging, solder breakage, and icicle defects effectively.
Works efficiently with PCBs of different color variations.
Automatic solder pad compensation enhances height and volume measurement accuracy.
SPC data analysis aids in improving overall process quality.
Three Point Checks software quickly identifies root causes of solder paste issues.

Pertanyaan:

What is the primary function of the MagicRay 3D SPI-VSP3000 series?

The MagicRay 3D SPI-VSP3000 series is designed for 3D solder paste inspection after SMT screen printing, ensuring precision and quality in the production process.
How does the MagicRay 3D SPI-VSP3000 series improve measurement accuracy?

It uses intelligent zero reference point technology and automatic solder pad compensation to enhance the accuracy of both solder paste height and volume measurements.
Can the MagicRay 3D SPI-VSP3000 series detect PCB color variations?

Yes, it is effective in detecting PCBs with different color variations, ensuring consistent inspection quality across various board types.