Die MagicRay 3D SPI-VSP3000-Serie eignet sich für die 3D-Lötpasteinspektion nach dem SMT-Druck

SMT-Pick-and-Place-Maschinen
February 11, 2025
Video Description:
Discover the MagicRay 3D SPI-VSP3000 series, designed for precise 3D solder paste inspection post SMT screen printing. This advanced system ensures accurate height measurement, detects defects like solder bridging, and improves process quality with SPC data analysis. Perfect for enhancing your SMT production efficiency.