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GSKL-650 Vertical Hot Air Curing Oven for PCB 67KW

Product Details

Place of Origin: China

Brand Name: GS

Model Number: GSKL-650

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 PCS

Price: USD+negotiable+pcs

Packaging Details: 2300*2100*2250mm

Delivery Time: 1-7 days

Payment Terms: T/T

Supply Ability: 1+pcs+per days

Get Best Price
Product Details
Highlight:

Hot Air Curing Oven 67KW

,

Vertical Hot Air Curing Oven

Model:
GSKL-650
Applicable Production Range:
Curing After Dispensing Or Pasting Of Consumer Electronincs
Dimensions(mm):
2150(L)*2050(W)*2150(H)
Weight(Kg):
<2000KG
Heating Time:
10minute
Temperature Setting Range:
Room Temperature – 200°C
Control Method:
PID Closed-loop Control +SSR Drive
Number Of Temperature Zones:
4
Heating Mode:
Large Circulation Of Hot Air, Two Sides Blowing And Top Return Air
PCB Boad Temperature Distribution Deviation:
±3.0°C
Min Beat:
15S
PCB Maximum Size(mm):
650(L)×460(W)
Rail Width Adjustment Range:
80~460mm
Track Width Adjustment:
Automatic Width Adjustment, And Fixed Track Near The Operating Surface
Product Flow:
From Left To Right
Layer Spacing:
20mm
Transport Height(mm):
950±30mm
Number Of Layers:
60 Layers
Installed Power:
67KW
Model:
GSKL-650
Applicable Production Range:
Curing After Dispensing Or Pasting Of Consumer Electronincs
Dimensions(mm):
2150(L)*2050(W)*2150(H)
Weight(Kg):
<2000KG
Heating Time:
10minute
Temperature Setting Range:
Room Temperature – 200°C
Control Method:
PID Closed-loop Control +SSR Drive
Number Of Temperature Zones:
4
Heating Mode:
Large Circulation Of Hot Air, Two Sides Blowing And Top Return Air
PCB Boad Temperature Distribution Deviation:
±3.0°C
Min Beat:
15S
PCB Maximum Size(mm):
650(L)×460(W)
Rail Width Adjustment Range:
80~460mm
Track Width Adjustment:
Automatic Width Adjustment, And Fixed Track Near The Operating Surface
Product Flow:
From Left To Right
Layer Spacing:
20mm
Transport Height(mm):
950±30mm
Number Of Layers:
60 Layers
Installed Power:
67KW
Product Description
Material Frame Vertical Hot Air Curing Oven 67KW
Product Specifications
Model GSKL-650
Applicable production range Curing after dispensing or pasting of consumer electronics
Dimensions (mm) 2150(L)*2050(W)*2150(H)
Weight (Kg) <2000KG
Heating time 10 minute
Temperature setting range Room temperature – 200°C
Control method PID closed-loop control +SSR drive
Number of temperature zones 4
Heating mode Large circulation of hot air, two sides blowing and top return air
PCB board temperature distribution deviation ±3.0°C
Min beat 15S
PCB maximum size (mm) 650(L)×460(W)
Rail width adjustment range 80~460mm
Track width adjustment Automatic width adjustment, and fixed track near the operating surface
Product flow From left to right
Layer spacing 20mm
Transport height (mm) 950±30mm
Number of layers 60 layers
Installed power 67KW
Product Features
  • The transmission design minimizes jamming risk with no internal connection points for smooth transportation
  • Intelligent fault layer shielding improves efficiency by allowing selective disabling of malfunctioning layers without affecting overall operation
  • Adjustable operation range enables energy-saving small cycle actions without requiring products to pass through the top layer
  • Innovative needle roller active transportation prevents jamming and plate damage, unlike traditional chain-driven systems
GSKL-650 Vertical Hot Air Curing Oven for PCB 67KW 0
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