Lenovo has announced that it will open up its low-temperature solder paste technology to all manufacturers for free.

Recently, some netizens reflected that "Lenovo's small new notebook caused product quality problems due to the use of new low temperature solder paste welding." Lenovo has issued a formal response to this problem, saying that the relevant description is seriously inconsistent with the facts, according to the after-sales data of the small new thin book over the years, there is no difference in the repair rate between the models with low temperature solder paste welding technology and the models with normal temperature solder welding technology. On March 8, Lenovo announced that it would open its low-temperature solder paste technology to all manufacturers for free. In February this year, the UP master "notebook maintenance unit" of Station B published a report titled "Lenovo's Planned scrapping Plan? It is estimated that the owner of the phone is countless "video, said that he received a large number of Lenovo small new series notebooks in need of repair, in the video he dismantled the machine on the spot overhaul, he believes that" because Lenovo uses low temperature solder paste welding technology (LTS), resulting in problems such as black screen." After the video was sent out, a large number of netizens left a message below the video, saying that the Lenovo small new computer they bought also had the above problems. As of press time, the video has received 1.48 million views, nearly 3,900 bullet screens and nearly 10,000 comments. Lenovo Xiaoxin official Weibo "Xiaoxin thin book low temperature solder paste welding technology description" said that because the relevant description is seriously inconsistent with the facts, it is special to explain: 1. Low temperature solder paste welding is a mature and more environmentally friendly technology for electronic product production line, which has been widely used in the production of electronic products. 2. Low temperature solder paste welding technology meets national & international standards, and after many years of mass certification, long-term normal use does not have reliability problems. Lenovo said that according to the after-sales data of the small new thin book over the years, there is no difference in the repair rate between the models using low temperature solder paste welding technology and the models using normal temperature solder welding technology. However, the post also sparked discussion. One netizen said, "But in fact? This problem itself will not appear in the short term, but after two or three years, the probability of occurrence will increase greatly. The solid property of low temperature tin and high temperature tin, as well as the thermal expansion and contraction stress of low temperature tin and the thermal expansion and contraction stress of low temperature tin are different, resulting in the low temperature tin ball being more likely to be compressed and burst by the sealing glue leading to virtual welding, or because the solid property is not as good as that of high temperature tin. Daily use is more likely to occur due to its own solid caused by virtual welding." "This argument is clearly unscientific and ignores the impact on the time dimension." Recently, Lenovo held an external observation and exchange activity at Lianbao Technology, its largest PC research and development and manufacturing base in the world. Lenovo said that for electronic components, whether it is a chip or a capacitor resistor, it needs to rely on solder paste to form solder joints on the circuit board and tightly connected, so that each part can play a role. The traditional solder alloy with tin lead as the main component, the highest temperature in the welding process can reach 250℃, not only will have a lot of energy consumption, but also will volatilize a lot of harmful substances. Lenovo said that under the trend of energy conservation and emission reduction, low temperature solder paste has been placed on high hopes as an effective solution to solve the "high heat, high energy consumption and high emissions" of electronic product welding. Compared with the high temperature solder paste, the maximum welding temperature of the low temperature solder paste is only about 180℃, and the peak welding temperature is reduced by 60℃ -70 ℃. This means that during the welding process, the energy consumption of the product manufacturing process can be reduced by about 35%, thus further reducing the CO2 emissions. In addition, the low temperature solder paste removes the harmful component of lead, which fully complies with the EU RoHS standard and is more environmentally friendly. In addition, "low temperature solder paste welding not only has excellent printability, can effectively eliminate the missing sag and caking phenomenon in the printing process, but also good wettability and long paste life." Moreover, low-temperature solder paste welding can also reduce the warping of the motherboard and chip, and is not easy to damage the high-temperature sensitive electronic components. By using the low-temperature solder paste process, the warpage rate of the chip is reduced by 50 percent, and the defect rate per million parts is significantly reduced, further improving the reliability of PC devices." Lenovo said. According to reports, Lianbao Technology has built more than 70 development laboratories with different functions, and each product needs to undergo thousands of performance verification before realizing consumer applications. Since 2017, Lenovo has shipped 45 million laptops manufactured with the new low-temperature solder paste process, and currently, low-temperature solder paste welding has become one of Lenovo's core technologies. Lenovo believes that low temperature solder paste not only in the field of green low-carbon great achievements, can release a huge amount of social value, but also bring production capacity and quality improvement, out of a high-quality development of the road, various factors show that green low carbon will become a win-win move to enhance the competitiveness of enterprises and brand value, Lenovo predicts that low temperature solder paste will become the mainstream welding process in the future industry.​ Lenovo said that it is willing to open this industry-leading, green and environmentally friendly innovation process to all manufacturers free of charge, jointly promote the green and sustainable development of the industry, and drive more manufacturing enterprises to achieve low-carbon transformation.