Ventiva introduces a fanless cooling system designed for high-performance ultra-thin laptops

Ventiva, a leader in heat dissipation solutions, has announced that its ICE9 ® Heat dissipation management suite now meets the heat dissipation needs of laptops running up to 40 watts of TDP (thermal design power consumption), enabling thinner, faster and quieter computing devices without sacrificing the heat dissipation performance of traditional fan cooling systems. This allows the ICE9 solution to cool the powerful cpus needed for the next generation of feature-rich, AI-enabled high-performance laptops. The ICE9 thermal management suite is based on Ventiva's patented ion Cooling Engine (ICE ®) technology, which eliminates the need for mechanical fans and instead uses intelligent software controls to achieve the best performance of electronic devices with no moving parts, noise or vibration. The ultra-compact ICE9 solution enables ultra-thin laptop designs less than 12mm thick, comparable to the thinnest laptops on the market today. Its space-saving form factor not only supports sleek, thin designs, but also gives original equipment manufacturers (Oems) the flexibility to integrate additional features into their products. Carl Schlachte, Ventiva Chairman, President and CEO, said: "Our ICE technology is revolutionizing the electronics market, bringing a new silent, intelligent heat conduction thermal management solution to the market. The scalability of the ICE9 device has been significantly demonstrated, from its initial demonstration in thin and light laptops with around 15W TDP to its ability to support higher performance systems, paving the way for silent computing products across the entire product family." Ventiva has released a new white paper, "Achieving High-Performance Silent Computing: A Breakthrough in Laptop Thermal Management," that explores the critical balance between managing heat dissipation and achieving quiet laptop operation. As processors become more powerful, they generate more heat, so innovative cooling solutions are needed without compromising form factor or acoustics. It goes layer by layer, sharing how companies are evaluating these options to support their current and emerging strategies. Ventiva is working with partners to productize the ICE9 thermal management suite with a TDP of up to 40W in 2027. Currently, ICE9 solutions with TDP up to 25W are available.