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Home > Products > SMT PCB Manufacturing > Four Layers PCB with Blind Buried Holes and Ceramic Substrate for High-reliability Applications
Four Layers PCB with Blind Buried Holes and Ceramic Substrate for High-reliability Applications
Four Layers PCB with Blind Buried Holes and Ceramic Substrate for High-reliability Applications
Four Layers PCB with Blind Buried Holes and Ceramic Substrate for High-reliability Applications

Four Layers PCB with Blind Buried Holes and Ceramic Substrate for High-reliability Applications

Product Details

Place of Origin: China

Brand Name: GS

Model Number: GS4CMMKB

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 PCS

Price: USD+negotiable+pcs

Packaging Details: 20*20*10cm

Delivery Time: 5-15 days

Payment Terms: T/T

Supply Ability: 1+pcs+per days

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Product Details

Product Description
Product Details
Highlight:

Blind Buried Holes PCB manufacturing

,

Four layers PCB manufacturing

Product Description
PCB Manufacturing Four Layers Of Blind Buried Holes
Four Layers PCB with Blind Buried Holes and Ceramic Substrate for High-reliability Applications 0
Product Description

Specialized PCB manufacturing featuring four layers with blind and buried vias technology for advanced circuit board applications.

Key Features
  • Four-layer PCB construction with blind/buried vias
  • High-density interconnect technology
  • Enhanced signal integrity and reliability
  • Space-saving multilayer design
Applications
  • High-frequency PCBs
  • Impedance controlled circuits
  • RF circuit boards
  • Advanced electronic systems
Related Technologies
Specialty PCB Heavy copper PCB Ceramic PCB Flexible circuit boards Metal core PCB High-temperature PCBs Custom PCB design Thick copper PCB High-reliability PCBs Advanced PCB fabrication

Tags:

High Performance SMT PCB Manufacturing,

SMT PCB Manufacturing,

1 level HDI board

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Contacts: Mr. Yi Lee
Tel: 86-755-27962186
Fax: 86-0755-27678283
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