The design structure of the material receiving guide belt

The receiving tape is an important component in the semiconductor packaging process, and its design structure directly affects the packaging efficiency and product quality. This article will introduce the design structure and features of the material receiving guide belt.

Receiving tape is usually made of high-strength and high-temperature resistant materials, such as polyimide (PI) or polyamide (PA), to ensure good stability and durability during the packaging process. These materials possess excellent mechanical properties and chemical stability, and can maintain a stable form at high temperatures without easily deform ing or melting.

The design structure of the material receiving guide belt usually consists of two main parts: the material receiving head and the guide belt body. The receiving head is used to connect the packaging substrate and the lead tape body. It is usually made of metal materials or materials with good electrical conductivity to ensure good electrical conductivity and connection stability. The lead body is the part that connects the material receiving head and the chip. Its design structure should take into account the specific requirements of the chip packaging, such as lead layout and lead spacing.

The layout of the incoming material guide tape directly affects the welding efficiency and quality during the packaging process. Linear or grid-type lead belt layout is usually adopted to ensure the accuracy and consistency of the spacing and position between the leads. At the same time, the lead band layout should also take into account the packaging structure of the chip and the connection method of the leads to improve the packaging efficiency and soldering quality.

The size of the incoming material lead tape should be designed based on the specific requirements of the packaged chip, including the number of leads, lead spacing, and lead diameter, etc. If the size is too large or too small, it will affect the welding accuracy and connection stability of the leads. Therefore, it is necessary to make a reasonable design according to the specific packaging requirements.

As an important component in the semiconductor packaging process, the design structure of the receiving tape directly affects the packaging efficiency and product quality. By rationally selecting materials, designing structures, lead tape layouts and dimensions and other parameters, the packaging efficiency can be effectively improved, costs can be reduced, and the reliability and stability of the products can be ensured.