When soldering circuit board components, what phenomena indicate that the soldering is defective?
1. False soldering: The solder joint is not smooth and appears honeycomb-like. The solder joints have poor contact with the pins and pads.
2. Missed soldering: Some pins are soldered without solder.
3. Continuous soldering: Solder bridging, bridging, etc. occur between circuits or solder pads.
4. Overheating: The solder overheats, causing deformation and breakage of components. The solder pads or copper-clad laminates are lifted up; A monument has been erected for surface mount components.
5. Tin-permeable: For double-layer plates and above, through-holes should be tin-permeable and soldered to ensure connection.
6. Dirt: If the flux or cleaning agent is not removed thoroughly, it can easily lead to short circuits or corrosion of the circuit board
7. Less tin; There is less than or equal to 50% of the solder pad.
8. Loopholes When soldering, excessive force was applied and the insulating paint on the surface of the surrounding PCB fell off.
9. Bulge; During soldering, due to moisture inside the PCB, a small area of the PCB bulges.
10. Pinhole There are small holes on the surface of the solder joint or voids exceeding 25% of the pad when inspecting X-R (which can be passed in my standard).