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Company News About When soldering circuit board components, what phenomena indicate that the soldering is defective?

When soldering circuit board components, what phenomena indicate that the soldering is defective?

2025-06-30

Latest company news about When soldering circuit board components, what phenomena indicate that the soldering is defective?

When soldering circuit board components, what phenomena indicate that the soldering is defective?

False soldering: The solder joint is not smooth and appears honeycomb-like. The solder joints have poor contact with the pins and pads.
Missed soldering: Some pins are soldered without solder.
Continuous soldering: Solder bridging, bridging, etc. occur between circuits or solder pads.
Overheating: The solder overheats, causing deformation and breakage of components. The solder pads or copper-clad laminates are lifted up; A monument has been erected for surface mount components.
Tin-permeable: For double-layer plates and above, through-holes should be tin-permeable and soldered to ensure connection.
Dirt: If the flux or cleaning agent is not removed thoroughly, it can easily lead to short circuits or corrosion of the circuit board
Less tin; There is less than or equal to 50% of the solder pad.
Loopholes When soldering, excessive force was applied and the insulating paint on the surface of the surrounding PCB fell off.
Bulge; During soldering, due to moisture inside the PCB, a small area of the PCB bulges.
Pinhole There are small holes on the surface of the solder joint or voids exceeding 25% of the pad when inspecting X-R (which can be passed in my standard).

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