Global Soul Limited Company News

As a market leader and innovation leader in SMT production technology, ASMPT has added two new features to its mature DEK printing platform: automatic solder paste transfer and simplified scraper change. With its broad product portfolio, ASMPT covers almost every aspect of the SMT production process, while continuing to drive automation and simplify operations. Rick Goldsmith, Director of Product Management at ASMPT, explains: "Solder paste printing is the most error-prone part of SMT production, and many of these steps are still manual. However, as the recruitment of qualified operators becomes more difficult, our customers are increasingly looking for innovative solutions that reduce labor and material costs while effectively reducing error rates." Solder paste transfer When the Settings of the press need to be changed, the solder paste from the old steel mesh needs to be transferred to the new steel mesh. "Previously, the process was done manually with a scraper," explains Goldsmith. This method often results in part of the solder paste can not be completely transferred, there is always some left in the old steel net. In addition, the solder paste can become contaminated or diverted to the wrong place, which can cause short circuits and other problems." Now, a new solder paste transfer device from DEK TQ simplifies this process. As long as the process parameters are set to allow, the solder paste is automatically transferred whenever the steel mesh is replaced. To do this, the scraper pushes the paste to the transfer device, which then applies the paste to the new steel mesh. Next, the system will use the steel mesh bottom cleaning device to clean the residual solder paste. Solder paste transfer: ASMPT automatically transfers solder paste during mesh replacement and accelerates the transition process. "This fully automated solder paste transfer system eases the workload of scarce operators," Goldsmith notes. Faster, more accurate and more efficient than manual operation. In traditional manual operations, up to 10% solder paste is often left in the steel mesh, and our automatic solder paste transfer system reduces this figure by 5%. This system greatly reduces the cost of solder paste, thus reducing the production cost of each PCB." The new solder paste transfer system can be easily installed on the solder paste presses of the DEK TQ series. Quick Scraper change ASMPT also improves the scraper change process for solder paste presses. Goldsmith explains: "Previously, the scraper was secured with two finger screws, and in order to replace the scraper, the operator needed to loosen the pair of screws and then tighten them again, a process that was time-consuming and often problematic. For example, some operators will screw too tight, subsequent personnel can not loosen. The time factor is also important, and it is not unusual to change knives more than 20 times a day." Quick blade change: Automatic lock and unlock features reduce blade change time by 50% Thanks to the innovative design of the new stand, the blade is automatically unlocked when it needs to be removed from the machine, greatly simplifying the change process. Then it can be easily replaced in one step, and when the scraper is put back into the bracket, the bracket automatically locks. This device reduces the scraper replacement time by 50%. In addition, mechanical pins prevent misinstallation of the scraper. The quick-change scraper unit can be retrofitted in a matter of hours and is compatible with both DEK TQ and NeoHorizon platforms. Goldsmith goes on to add, "SMT production is becoming increasingly competitive, and to stand out in this space requires a continuous drive to automate and simplify operations. ASMPT understands the challenges facing SMT manufacturers and is committed to providing customers with unique solutions to help them win in the fierce market competition." About ASMPT Limited (ASMPT) ASMPT is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronic products. Headquartered in Singapore, ASMPT's products cover semiconductor assembly, packaging and SMT (surface mount technology), from wafer deposition to a wide range of solutions for organizing, assembling and packaging precision electronic components for the manufacture of end-use electronic devices such as electronics, mobile communications devices, computing devices, automotive, industrial and LED (display) devices. Working closely with its customers, ASMPT continues to invest in research and development to develop cost-effective and impactful solutions that contribute to their productivity, reliability and quality. ASMPT (HKEX stock code :0522) is a constituent of the Hang Seng Composite Mid-Cap Index under the Hang Seng Composite Market Cap Index, the Hang Seng Composite Information Technology Industry Index under the Hang Seng Composite Industries Index and the Hang Seng Hong Kong 35 Index. For more information about ASMPT, please visit: https://www.asmpt.com ASMPT SMT Solutions Segment The mission of ASMPT SMT Solutions Segment is to implement and support SMT integrated smart factories for electronics manufacturers worldwide. ASMPT solutions support the networking, automation and optimization of online and factory-level central workflows through hardware, software and services, enabling electronics manufacturers to make a phased transition to the smart factory and significantly improve productivity, flexibility and quality. With its holistic "open automation" philosophy, ASMPT opens the door for customers to cost-effective automation that is modular, flexible and non-proprietary, tailored to their individual needs. The company's portfolio of products and services includes hardware and software such as SIPLACE mounters, DEK presses, inspection and material storage solutions, and intelligent shop floor management suites. With Works, ASMPT provides electronics manufacturers with high-quality software for planning, controlling, analyzing, and optimizing all processes on the shop floor. As maintaining close relationships with customers and partners is a core component of its strategy, ASMPT has established the SMT Smart Network as a platform for active exchange of information between smart factories around the world.

With more than a month to go before the September release, the iPhone 16 is in a critical period for new devices to be ready for stock, and Foxconn is currently hiring on a large scale. According to reports, at present, Zhengzhou Foxconn is recruiting high-priced workers, mainly hourly workers and return workers. The hourly wage will be increased to $26, and rebate workers will get a cash rebate of $7,500 after 90 days of clocking in. For the news of 50,000 people pouring into Foxconn reported by the media, there is an intermediary introduction that the people who interview for the job every day are basically waiting in a long line. "Mass production of the iPhone 16 is imminent," the agency said. According to the news released by the Zhengzhou Fu Labor Federation recruitment public number, Zhengzhou Foxconn refund 7500+500 yuan subsidy is in hot recruitment, the highest price for the year. In addition, the recruitment conditions are further relaxed, since 8/7, A business group 18 to 24 years old entry no longer check non-student certificates (learning network, salary flow are no longer checked), hourly workers, return workers can sign up for employment. Hourly workers and return workers of A business group can enjoy an additional subsidy of 200~500 yuan. It is reported that the rebate model is suitable for more than 3 months of job seekers, 3 months can be estimated to get: (base salary of 2100 yuan + overtime pay) *3 + 7500 yuan rebate + 500 yuan subsidy = 17,500 yuan ~21500 yuan. According to the National Business Daily reported that according to the tradition, Apple launched a new phone in September every year, so the middle of each year is a key time for the new iPhone. At present, the huge Apple supply chain ushered in the annual "Apple season", especially for contract manufacturing giant Foxconn. On August 8, the salary reported by the recruitment agency of Foxconn Zhengzhou Science Park was increased compared with what the reporter learned on July 26, and the hourly wage was increased by 2 yuan to 26 yuan. For the media reports of "50,000 people pouring into Foxconn", the intermediary said that the people who interview for the job every day are basically waiting in a long line. So why is Foxconn hiring so many workers? "Mass production of the iPhone16 is imminent," the agency said. "Basically 90 percent of [people who] sign up for interviews pass. Just looking for infectious diseases, tattoos, priors, smoke scars. But if you have a smaller or inconspicuous tattoo, you can get in. The requirements are not so strict." Intermediary sources said. The agency also revealed: "The entry is mainly to do Apple mobile phone parts assembly, do not do other, after the entry of the post in the early stage are random points." According to another report, in January 2023, the Henan provincial government's official website reprinted a report showing that Foxconn's imports and exports accounted for about 60% of the province's total imports and exports, and 80% of Zhengzhou's total imports and exports. In January 2023, the relevant person in charge of the Comprehensive Free Trade Zone and port Service Bureau of Zhengzhou Aviation Port Area introduced that the production capacity of Foxconn mobile phones at that time rose to 500,000 units per day, which was basically the same as the same period in 2022, and the total import and export volume for the year was more than 460 billion yuan.

With the miniaturization and precision of electronic products, surface mount technology (SMT) is more and more widely used in electronic manufacturing industry. In SMT process, the amount of solder paste directly affects the quality and reliability of solder joints. In some specific cases, in order to meet specific welding requirements, we need to increase the amount of solder paste or solder in a local area. In some cases, it is necessary to increase the amount of solder paste or solder locally, the following are some common reasons: heat dissipation: For components with large heat output, increasing the amount of solder helps to improve the efficiency of heat transfer. Mechanical strength: In the parts subjected to mechanical stress, increasing the amount of solder can form a stronger solder joint. Compensation for dimensional deviations: Due to deviations in component pin and PCB pad sizes, more solder may be required to ensure the reliability of the connection. The following are some methods for locally increasing the amount of solder paste or solder in the SMT process: 1. Adjusting the opening size of the steel mesh By adjusting the opening size of the steel mesh, you can directly control the amount of solder paste deposition. Enlarge the opening: Enlarge the opening size of the steel mesh corresponding to the pad that requires more solder, thereby increasing the amount of solder paste deposition. Use special shape openings: trapezoidal or racetrack openings allow more solder paste to be deposited on the edge of the pad. Advantages: simple, low cost, no need to change the existing process. Disadvantages: If the operation is improper, it may affect the printing quality; Limited to the minimum feature size of the steel mesh. 2. Multiple printing The same PCB is printed multiple times to increase the amount of solder paste deposition. Advantages: The amount of extra solder can be precisely controlled; Suitable for specific areas where more solder is needed. Disadvantages: increase production time and cost; If the alignment is not accurate, it may cause printing problems. 3. Use the solder preform before reflow welding, place the solder preform on the PCB pad. Advantages: The amount of solder can be precisely controlled; Suitable for applications requiring large amounts of solder. Disadvantages: Manual placement is costly and time-consuming; Automated placement may require additional process steps. 4. Solder dip or wave soldering for through-hole components or specific pads, solder dip or wave welding can be used to increase the amount of solder. Advantages: Quickly and effectively add a large amount of solder; Suitable for adjustment after reflow welding. Disadvantages: Not applicable to all SMT applications; If not properly controlled, it may result in solder bridging. 5. Adjust the metal content and rheological properties of the solder paste Using higher metal content or different rheological properties of the solder paste, you can achieve a higher amount of solder after reflux. Advantages: Can be applied to the whole board or selective area; There is no need to change the steel mesh design. Disadvantages: May affect reflux curve and overall process; Requires the use of special solder paste, increase the cost. The decision to locally increase the amount of solder paste or solder in the SMT process should be carefully considered, balancing its advantages and potential drawbacks. Each method has its own applicable scenarios and often requires a combination of methods to achieve the goal. Engineers evaluate the specific requirements of the assembly process, component characteristics, and the impact on production efficiency and cost.  

Married women can't build iphones? Foxconn responds! During a visit to Foxconn's factory in Chennai, India, on Saturday, Foxconn Chairman Liu Yangwei spoke out about the company's alleged refusal to allow married women to assemble iphones. Earlier, foreign media "exposure" Foxconn recruitment refused married women to work in iPhone assembly, the incident caused public concern in the local, the Indian government has ordered an investigation. According to the report, Liu Yangwei said on the same day, "Foxconn's recruitment does not distinguish between genders, and female employees occupy a large proportion here," and "I want to stress that married women have made great contributions to everything we do here." Foxconn acknowledged some omissions in its 2022 hiring process and said it had taken steps to address them, but said it "strongly refutes allegations of employment discrimination." An investigation by the media outlet in June found that Foxconn's main iPhone assembly plant in India systematically excluded married women because they were believed to have more domestic responsibilities than unmarried women. Foxconn's hiring practices have sparked television debates and newspaper editorials. The federal government led by Prime Minister Narendra Modi has ordered Tamil Nadu to provide a detailed report on the matter. Officials from India's labor ministry also went to the iPhone factory to question executives. So far, New Delhi has not released any findings. It has emerged that Foxconn is moving some production back to China from India and Vietnam, and Apple has already moved some production back to domestic contract factories this year. Apple's new phones, the iPhone16 series, will still be assembled in China. In early August, as the iPhone16 series products entered the critical period of stocking, Foxconn began to raise wages and conduct large-scale recruitment in core manufacturing bases such as Zhengzhou and Shenzhen. Since August 3, Zhengzhou Foxconn recruitment public number "Zhengzhou Fu Trade Union recruitment" continued to release the "highest price of the year" recruitment information, saying that "this year's peak season recruitment began in July, so the end will be earlier", the current wage has reached the highest in the year.  

Leading precision components and SMT accessories suppliers. GS-SMT LTD announced the expansion of the NPM SMT chip mounter feeder series. The new high-speed head from Panasonic has increased productivity compared to previous models. GS-SMT LTDfeeders allow this chip mounter to provide higher reliability and performance on the Panasonic NPM platform   On each machine, the Panasonic NPM interchangeable head supports almost all surface mount component types. And to achieve high-speed chip components and special-shaped component placement. EachGS-SMT LTDfeeder has original data and tests. Easy to identify users and machine software.   GS-SMT LTD offer all standard feeders for the following NPM mounters: -12 / 16MM -24 / 32MM -44 / 56MM -72MM -88MM -104MM        We can also provide custom design feeders for OEMs based on customer and application specific requirements.As well as special feeder design for special-shaped components (LEDs, connectors, pins, clamps, fixtures, etc.)For your automated custom component process,We have the ability to make the feeder fit for your application.   All SMT feeders and consumables are guaranteed to work properly with the original equipment.Each of our products produced by our company has a 100% satisfaction  

Leading precision components and SMT accessories suppliers. GS-SMT LTD announced the expansion of the FUJI NXT H24 SMT chip mounter nozzle series. The new high-speed head from Fuji has increased productivity compared to previous models. GS-SMT LTD standard nozzles allow this chip mounter to provide higher reliability and performance on the Fuji NXT III platform. On each machine, the Fuji NXT interchangeable head supports almost all surface mount component types. And to achieve high-speed chip components and special-shaped component placement. EachGS-SMT LTD Fuji NXT nozzle has both raw data two-dimensional code and OEM color two-dimensional code for user and machine software to identify the nozzle. We offer all standard sizes of suction nozzles for the following Fuji NXT mounter. - H01 - 36mm disc (1.0mm - 20.0mm; including standard and MELF) - H04 - 19mm disc (1.0mm - 15.0mm; including ceramic, standard and MELF) - H08 / H12 - 9mm disc (0.3mm - 5.0mm; including ceramic, standard and MELF) - H24 - 4.7mm disc (0.3mm - 2.5mm ceramic nozzle) - H08M & H04S is also available on request          We can also provide custom design nozzles for OEMs based on customer and application specific requirements.As well as special nozzle design for special-shaped components (LEDs, connectors, pins, clamps, fixtures, etc.)For your automated custom component process,We have the ability to make the nozzle fit for your application.   All SMT nozzles and consumables are guaranteed to work properly with the original equipment.Each of our products produced by our company has a 100% satisfaction  

Leading precision components and SMT accessories suppliers. GS-SMT LTD announced the expansion of the new Hitachi G5S / F8S SMT chip mounter nozzle series. Hitachi's new high-speed head increases productivity compared to previous models.Our company's standard nozzle allows this chip mounter to provide higher reliability and performance on the SIGAMA platform.   Hitachi G5S / F8S can be mounted almost all 03015-44MM surface mount component type.And to achieve high-speed chip components and special-shaped component placement.EachGS-SMT LTDmulti-purpose nozzle has a raw data nozzle model for user and machine software to identify the nozzle. Our company offers all standard size nozzles for the following Hitachi G5S / F8S. - HG22C - HG33C - HG52C - HG82C - HB03C - HV03C - HA04C & HA09C Can also be provided on demand.    We can also provide custom design nozzles for OEMs based on customer and application specific requirements.As well as special nozzle design for special-shaped components (LEDs, connectors, pins, clamps, fixtures, etc.)For your automated custom component process,We have the ability to make the nozzle fit for your application.   All SMT nozzles and consumables are guaranteed to work properly with the original equipment.Each of our products produced by our company has a 100% satisfaction guarantee.If any customer is dissatisfied with the performance or quality of the product, we will replace or provide a full refund. www.gs-smt.com.

GS-SMT LTD will attend Nepcon Vienam 2018 . Our stand is P18, wellcome to visit our stand during 2018-10-11~2018-10-13 .

The annual Munich electronic production equipment exhibition will be held on November 12-15, 2019 in Messe munchen, Germany. Gs-smt will exhibit the highly anticipated SMT peripheral automatic feeder, new SMT peripheral, suction nozzle and feidar in booth 104-1 of A2 hall. We sincerely invite you to visit and negotiate!

The annual IPC APEX EXPO exhibition will be held on February 4-6, 2020 in San Diego Convention Center,Ca.GS-SMT LTD at HALL D.3347,We sincerely invite you to visit and negotiate.

NEPCON ASIA 2022 will be held from November 30 to December 2 at Shenzhen International Convention and Exhibition Center (Bao 'an New Hall). Multiple exhibitions at the same time, jointly create more than 100,000 square meters of electronic industry super exhibition feast. With the innovative concept of "cross-border + core + intelligent manufacturing", the exhibition will bring together 1,200 enterprises and brands to exhibit new domestic and foreign equipment and advanced technology solutions related to electronic components, PCBA process, intelligent manufacturing, EMS services, semiconductor sealing and testing. With the linkage of the same period, it brings cross-border business opportunities in consumer electronics, home appliances, industrial control, communications, automobiles, touch display, new energy, medical devices, optoelectronics and other fields, blooming new vitality of the Asian electronics industry.

In the wave welding operation, if the wave welding chain jitter will cause the circuit board in the wave welding and the wave welding solder joints are bad, the root cause of the chain jitter in the wave welding operation is friction, the wave welding chain jitter problem has the following reasons: First, wave soldering chain jitter reasons: 1, the chain is too tight; 2, poor lubrication; 3. Whether the tensioning device of the synchronous chain in the transport department is OK; 4, whether the chain claw meets other things; 5, the guide rail has a horn phenomenon; 6, the entrance connection adjustment is not reasonable; 7. The machine on the transmission gear is loose. Second, wave soldering chain jitter treatment method: 1. Adjust the tensioning device at the entrance connection to the appropriate position; 2. Add appropriate amount of high temperature lubricating oil to the chain, once a month; 3. Adjust the tensioning device of the transportation department, be sure to tighten it, and ensure that it is in the same straight line; 4. Check whether all the chain claws have touched other things, especially the washing claw box and the chain claw have touched at the corner, and replace the deformed chain claw; 5, when there is no PCB board on the track, the chain does not shake, and there is a board will shake, it means that the guide rail has a horn phenomenon, must first solve the problem of the guide rail horn, the method is: a, depending on the situation, remove one or both of the gears at the screw; B. Select a standard PCB board, place it on the track, and then turn the screw to adjust the width of the front, middle and back of the track to be consistent; c. Reset and install all gears. 6, A, the entrance of the two guide rails and the two chains of the main rail are not in the same straight line, will increase the tension, causing jitter, adjustment method: take two standard test boards, one on the connection, one on the chain of the main rail, adjust the connection, so that two in the same straight line, in the connection of the two gaps are consistent; B, the connection chain is installed too tight cause shaking, adjustment can be; C. The small sprocket bearing of the connecting chain is damaged or the gasket in the small sprocket is lost, resulting in jitter, which can be replaced and installed to solve the problem. 7. Comprehensively check whether the transmission gear at the entrance and exit is loose, and tighten all the machinery.