Global Soul Limited Company News

According to media reports, Zhang Minggang, deputy general manager of Huawei's French branch, revealed that Huawei's first overseas factory has been determined to land in France and is expected to be put into operation by the end of 2025. Zhang Minggang said that Huawei's French factory is located in the Rhine province of Brumart town, covering an area of about 8 hectares (about 80,000 square meters). The project is expected to invest 200 million euros (about 1.54 billion yuan), while the annual output value can reach 1 billion euros (about 7.72 billion yuan), the rate of return is quite high, while creating 800 jobs, of which 300 in the near future and 500 in the long term. The plant is expected to produce 1 billion devices a year, but not smartphones, but chipsets, motherboards and other components needed for 4G/5G base stations, which can supply the entire European market. Huawei entered France in 2003 and now has six research and development centers in Paris and one global design center, providing nearly 10,000 jobs. France used to be Huawei's largest overseas market (annual revenue of 2.5 billion euros in 2021), and was even regarded as Ren Zhengfei's second home, as early as 2019, Huawei announced that it would set up a factory in France, originally planned to put into production in early 2023, but because of environmental protection and other reasons, it has been delayed for a long time.

From plug and play to sophisticated automation platforms, innovative intelligent solutions create new value. At IPC APEX 2024, April 9-11 (Booth 2405), Global Instruments will demonstrate a range of electronic assembly automation solutions, including: Industry standard Fuzion® mounters, versatile Uflex® automation platform, cost-effective Omni™ inserts, and IQ360™ Smart factory software. The Fuzion Mounter family delivers low single mount costs for any portfolio, from conventional to complex board assembly, from shapes to a wide range of semiconductor applications, and can handle a range of production environments, including ultra-high capacity (XC) models with up to 272 feeder stations that support a wide variety of new product introduction solutions. And with a 30-axis mount head, high-speed models up to 66,500 cph can be achieved. Uflex operates a wide range of processes and supports a variety of feeders to complete virtually any automated process. It supports up to four independent cantilevers on a single gantry, and features include vacuum or pneumatic mounting, screw drive, UV curing, dispensing and more. For more basic automation tasks, Omni inserts offer simplified operating processes and the efficiency of a single process. It utilizes a linear motor positioning system and a range of intelligent functions to enable precise, high-speed insertion of axial, radial and other special-shaped components. IQ360 Intelligent Factory software is a complete set of intelligent factory management modules, the purpose is to control, monitor and improve production efficiency. The software package includes: IQ360 product design and new product introduction module, IQ360 material management module, IQ360 production control module and IQ360 monitoring and analysis module, and can provide specific module combinations for individual plant needs to create a true "connected factory" production environment. "The surface mount process is already highly automated, but the end-of-the-line process is largely manual and extremely inefficient," said Glenn Farris, vice president of Global customer operations and corporate marketing at Global Instruments. Farris continued, "According to a typical high-volume manufacturer, these back-end processes represent less than 5% of the total process, but account for the majority of the rework effort. Therefore, we need to mitigate these inefficiencies by finding intelligent solutions that match the level of front-line operator automation experience. From basic users to advanced users, we provide plug-and-play solutions for complex automated tasks with highly configurable solutions." .

For a long time, the industry's understanding of the cleaning process was not sufficient. Mainly because the previous PCBA assembly density is low, the adverse effects of pollutants such as flux residues on electrical performance are not easy to be detected. Nowadays, with the development of the design of PCBA to miniaturization, the device size and the spacing between the devices have become smaller, and the short-circuit and electrochemical migration caused by small particle residues have attracted widespread attention. In order to adapt to market trends and improve product reliability, more and more SMT manufacturers have started a journey of learning about the cleaning process. The cleaning process is a process that combines the static cleaning force of the cleaning agent and the dynamic cleaning force of the cleaning equipment to finally remove the pollutants. PCBA cleaning is divided into SMT (SMT) and plug-in (THT) two stages, through cleaning can remove the accumulation of surface pollutants during the processing of products, reduce the risk of surface contamination and reduce reliability of products. In the electronics manufacturing and semiconductor processing industries, choosing the right cleaning agent with the right cleaning equipment is very important. The factors that affect the stability of PCBA cleaning process mainly include: cleaning object, cleaning equipment, cleaning agent and process control. Under normal circumstances, the cleaning object is the solder paste and flux residue, which will cause electrochemical migration, corrosion and short circuit, which brings a great threat to the reliability of the product, but it does not exclude large particle pollution, oil stains and sweat stains on the surface of the circuit board. The material properties and surface conditions of different PCBA are also different. The ZESTRON Technical Center conducts free cleaning tests every day, and in many cases the customer's product cannot be flooded and therefore is not suitable for the immersion cleaning process! In addition, some components are made of sensitive metals, which are very fragile and cannot be cleaned using ultrasonic waves, otherwise those bubbles will shatter the components when they explode. There are also some components that must be treated "gently" with a pH neutral cleaning solution! Usually the surface of the circuit board has a very complex geometric structure, and the integrated density is also very high. When the distance between the device and the substrate is very small, the water droplets of deionized water can not drill into the small gap, and it is unable to remove the pollutants at the bottom of the device, and chemical cleaning agents are needed to help. Cleaning agent Choosing a special cleaning agent is very important. The ZESTRON database stores more than 2,500 formulations and related raw materials, with a rich portfolio of water-based, semi-water-based and solvent-based products designed for different contaminants. Material compatibility is often overlooked but vital part of the cleaning process, such as: the power module package has a variety of metal materials such as copper, nickel or aluminum, improper cleaning process can easily lead to corrosion or oxidation of the surface of aluminum chips and copper, and some characters fall off. Therefore, the material incompatibility between the cleaning agent and the cleaning object, and between the cleaning agent and the cleaning equipment may lead to product scrap, or cause the blockage of the equipment pipeline. As a chemical used in the production line and may directly contact the human body, improper operation may cause personal injury and economic loss. ZESTRON has been a green and safe cleaning product since 1989, when it developed the first alternative to CFCS. At all times, ZESTRON is committed to compliance with REACH, the RoHS Directive and the WEEE Directive. ZESTRON cleaning agent does not contain ODS ozone layer destroying components and VOC content meets national standards. Cleaning equipment A complete cleaning process usually includes cleaning, rinsing and drying these three processes, in the cleaning process, cleaning agent and pollutants contact each other, cleaning agent will separate the pollutants from the surface of the cleaning object; The rinsing and drying process is mainly to further remove contaminants, but also to ensure that there is no residue of cleaning agent on the surface of the components. The ZESTRON Technical Center houses more than 100 cleaning equipment from the world's leading cleaning equipment manufacturers. From off-line batch cleaning equipment, such as ultrasonic cleaning equipment, submerged cleaning equipment, centrifugal cleaning equipment, to online spray equipment, customers can choose from a variety of common cleaning mechanics. ZESTRON can test your products under real production conditions and evaluate cleaning applications, cleaning equipment, and cleaning agents according to customer requirements. Cleaning process control With the increase of cleaning time, the continuous entry of pollutants in the cleaning solution will have a negative impact on the cleaning efficiency. When should I change the fluid? When is the latest fluid change? How to adjust the cleaning parameters when the environment/product changes? These questions are directly related to the customer's cost and output, and the key to finding answers lies in the collection of cleaning data, including: time, movement, concentration and temperature. Among them, the cleaning solution will be affected by many factors in the process of use, such as: residue in the liquid, the evaporation of the liquid, the addition of deionized water, etc., and its concentration will often fluctuate. Therefore, in the circuit cleaning process, the concentration monitoring is directly related to the stability of the cleaning effect.

Only an AI computer can save HP. HP on Wednesday after the bell reported second-quarter results, revenue of $12.8 billion, EPS of 82 cents are higher than expected, including PC sales for the first time in two years to achieve growth, which is inseparable from the recent fire AI computers. HP shares rose more than 2 percent in after-hours trading. AI computers will be the next key growth point for HP, especially this financial report showed that HP's home printer sales fell 16%, and commercial printer sales fell 12%. HP CEO Enrique Lores said on Wednesday that existing computer equipment is aging, and both small and large companies are realizing the need to update their AI computers. AI computers are expected to account for 10 percent of the company's computer shipments in the second half of this fiscal year. HP launched the first generation of AI computer products powered by Intel and AMD chips in early May, and will launch a new Copilot+ product powered by Qualcomm's Snapdragon X processor in June. Lores said that the new shipments will last from early May to November, because the mass production of these powerful AI computers "will take some time." In the early days, it is mainly individual consumers who buy AI computers, while institutional customers need more time to evaluate the performance of AI computers before making large purchases, and the demand for AI computers will grow significantly in the next few years. "We expect AI computers to account for 40 to 50 percent of total PC shipments in the next three years," he said confidently. "AI computers will become very important." According to data analysis firms IDC and Gartner, HP and its foundry will ship about 50 million AI computers globally this year, which will account for 22% of global PC shipments in 2024. Lores stressed that as AI computer hardware upgrades and Microsoft will end updates and support for Windows 10 in October 2025, customers are moving to Windows 11, and Win 11 is an AI system with Copilot embedded. These factors are driving customers to buy AI computers. He also said: "At present, some customers are still waiting to update AI computers, and they will speed up the cycle of updating computers in the future, after all, AI computers are very valuable to improve production efficiency."

A team from Tsinghua University's brain-like Computing Research Center recently developed the world's first brain-like complementary vision chip, "Tianmou Core," which was published as a cover article in the international academic journal Nature on May 30. In the open world, intelligent systems not only have to deal with huge amounts of data, but also need to deal with extreme events such as sudden dangers in driving scenes, drastic light changes at the mouth of the tunnel and strong flash interference at night, said Shi Luping, corresponding author of the paper and professor of the Department of precision Instruments at Tsinghua University. In the face of such scenes, traditional visual perception chips often have distortion, failure or high delay, which limits the stability and security of the system. In order to better address the above problems, a team from the Research Center of brain-like Computing at Tsinghua University focused on brain-like visual perception chip technology and proposed a new paradigm of brain-like visual perception based on complementary dual-pathway visual primitives. The picture shows "Tianmou Core". (Department of Precision Instruments, Tsinghua University) "This paradigm draws on the basic principles of the human visual system, disassembles the open world visual information into information representations based on visual primitives, and through organic combination of these primitives, imitates the features of the human visual system, forming two complementary advantages and complete information visual perception pathways." Shi Luping said. Based on this new paradigm, the team further developed the world's first brain-like complementary vision chip "Tianmaicin", which realizes high-speed, high-precision and high-dynamic range visual information acquisition at the cost of extremely low bandwidth and power consumption, and can effectively cope with various extreme scenarios to ensure the stability and security of the system. At the same time, based on the "Tianmou core", the team also independently developed high-performance software and algorithms, and conducted performance verification on the open environment vehicle platform. In a variety of extreme scenarios, the system realizes real-time perceptual reasoning with low latency and high performance, showing its application potential in the field of intelligent unmanned systems. Zhao Rong, the corresponding author of the paper and a professor at the Department of precision Instrumentation at Tsinghua University, said that Tianmou Core opens up a new way for important applications such as autonomous driving and embodied intelligence. Combined with the team's technology accumulation in the application of brain-like computing chip "day movement", brain-like software tool chain and brain-like robot, the addition of "Tianmouxin" will be able to further improve the brain-like intelligence ecology and effectively promote the development of artificial general intelligence. According to reports, this is the second time that the team has appeared on the cover of Nature after the heterogeneous fusion brain-like computing "Day movement", marking a basic breakthrough in both directions of brain-like computing and brain-like perception.

AIM Solder, the world's leading manufacturer of solder assembly materials, is proud to announce that it has joined the International Alliance of Electronic Manufacturers (iNEMI). This strategic alliance underscores AIM Solder's commitment to advancing the electronics manufacturing industry through collaboration and innovation. iNEMI is a non-profit consortium that brings together the world's leading electronics manufacturers, suppliers, associations, government agencies and universities. Its mission is to anticipate and accelerate improvements in electronics manufacturing, addressing technology and infrastructure gaps through high-impact projects and proactive forums. iNEMI implements a global agenda focused on bridging gaps in technology and infrastructure through collaborative projects and industry forums. For more information, please visit www.inemi.org. "Joining iNEMI aligns perfectly with our mission to provide innovative and reliable product solutions to the electronics industry," said Tim O 'Neill, Director of product Management at AIM Solder. "We are excited to partner with other industry leaders to drive progress and support the development of cutting-edge technologies." As part of iNEMI, AIM Solder will be involved in various projects focusing on key areas related to solder materials, electronics manufacturing, sustainable electronics and more. These initiatives not only benefit AIM Solder's product development efforts, but also contribute to the overall advancement of the global electronics manufacturing industry.

TRI, a supplier of test and inspection systems for the electronics manufacturing industry, announced the completion and opening of the Linkou Phase II Manufacturing Center building. Teletech is committed to developing new technologies and inspection solutions and entering the semiconductor and advanced packaging industry applications. The newly completed Manufacturing Center building is an extension of the Linkou Manufacturing Center base in Taiwan, consisting of 10 floors above ground and 4 floors below ground, with dedicated exhibition halls and seminar Spaces. It has greatly increased the production capacity, product development/verification space, and the display area of various product lines and smart factory applications. The company offers one-stop solutions for PCBA board assembly and advanced package testing and inspection, including 3D solder Paste Printing Inspection (SPI), 3D Automatic Optical Inspection (AOI), 3D CT Automatic X-ray Inspection (AXI) and high-performance Applied Circuit Testing (ICT). Our solution portfolio has a wide range of advanced and advanced features to meet current and future production line requirements. Celebrate the 35th anniversary of Delu Technology with you to celebrate the 35th anniversary of Delu Technology! Delu will continue to focus on AI-driven test and inspection solutions at exhibitions and workshops throughout 2024. Delu's success reflects a commitment to excellence and a continuous journey of growth with our valued customers.

In today's rapidly changing technology, especially the rapid development of high-voltage systems (such as 800V power modules) led by the new energy automobile industry, the electronics industry has put forward unprecedented high requirements for the protection performance of electronic components. Humidity, ion pollution, particle residue and other factors have become a major hidden danger affecting insulation performance, resulting in leakage and equipment damage. In order to improve the protective ability of electronic components, the industry generally uses Conformal coating technology (commonly known as three anti-paint). After the coating process, the electronic products are like wearing a layer of "invisible armor," which not only strengthens the ability to resist external infringement, but also promotes the reduction of conductor spacing in the circuit board design, so as to effectively maintain the stability of electrical insulation. The performance of the coating technology in wet environment is evaluated in many aspects, including dielectric constant, thermal properties, flammability, coating creep, chemical compatibility and chemical resistance. Through the insight of practical application scenarios, this paper extracts three performance evaluation indicators that are often ignored in wet environments, aiming to provide valuable reference information for industry peers to promote a more comprehensive and in-depth consideration of material properties. 1. Hydrolytic stability Hydrolytic stability is a measure of the ability of the coating to maintain its original physical and chemical properties in a humid environment. In high humidity environments (usually relative humidity greater than 60%), the coating may experience performance degradation if it does not have good hydrolysis stability. Submicron dust particles in the atmosphere may be acidic or alkaline. At humidity ≥80%, the thickness of the water layer can reach 10 molecules, at which time the material deposited in the atmosphere begins to dissolve, resulting in a free-flowing ion stream. These ions can penetrate the coating and cause circuit short circuit, corrosion and dendrite growth, which can lead to the failure of the entire electronic system. 2. Water vapor permeability Water vapor permeability refers to the ability of water vapor to be coated through the coating. Due to the small size of water molecules, almost all polymer substrates can penetrate, so all coating materials have a certain degree of water vapor permeability, but the penetration rate and degree are different. The chemical composition, thickness, degree of cure, and environmental factors such as temperature and humidity all affect the water vapor permeability of the coating. Although a certain degree of air permeability is conducive to the natural drying of the PCB in the non-working state, excessive penetration may increase the risk of leakage current, accelerate corrosion and reduce insulation performance. Therefore, when selecting the coating, it is necessary to balance its moisture-proof and breathability to ensure that it can effectively block moisture and does not affect the natural recovery and drying ability of the circuit board. 3. Ion penetrability Ion penetrability is a direct indicator to evaluate the defense ability of the coating against ionic contaminants, especially in the environment of contaminants such as flux residue and salt spray. Ions can enter the coating through the coating defects, micropores or directly through the molecular chain, leading to electrochemical reactions that lead to corrosion and insulation degradation. Surface insulation resistance (SIR) testing, sequential electrochemical reduction analysis (SERA), and diffusion cell measurement are widely used to test the resistance of coated coatings to ion penetration. The SIR Test directly assesses the resistance change at the substrate interface under the shape coating, the SERA test focuses on the oxidation state of the metal under the shape coating, and the diffusion cell experiment directly monitors the dynamics of specific contaminants through the shape coating by simulating the environment. The comprehensive application of these test methods shows that ions have penetration, and also provides scientific basis for the selection and improvement of the coating shape, to ensure that the selected coating shape can effectively prevent the penetration of harmful ions, and maintain the electrical safety of the circuit. In practical application, the selection of shape coating should consider the cost benefit, environmental adaptability and safety. In order to ensure the reliability and long-term stability of electronic devices in wet environments, the performance evaluation of the coating is particularly important. Users should be aware of the different assessment test methods and applicability of surface cleanliness, as well as advanced technical experience in the field of reliability and surface technology, such as the reliability of shape coatings. With cutting-edge instrumental analysis technology and rich experience in the field of process technology and reliability, ZESTRON R&S is able to conduct comprehensive and accurate characterization and evaluation of electronic product surfaces, providing customers with analytical services such as Coating reliability test CoRe test, Coating Layer Test, coating layer test, etc. Help customers solve complex reliability and surface technology problems.

KYZEN, a global leader in innovative and environmentally friendly chemical cleaning agents, will be exhibiting at the SMTA Queretaro Expo and Technical Forum on June 6. The KYZEN cleaning team will present the steel mesh bottom cleaning agent KYZEN E5631J and the water-based cleaning solution AQUANOX A4618. Both KYZEN E5631J and AQUANOX A4618 are formulated to effectively clean solder at different stages of PCB production. KYZEN E5631J is a ready-to-use solution proven to be compatible with common steel mesh, cleaning equipment and printer manufacturers for the removal of solder paste from steel mesh. This cost-effective solution cleans all types of solder paste quickly and efficiently during both online and offline cleaning processes. AQUANOX A4618 is a water-based cleaning agent designed to clean lead-free flux residues, including no-clean and lead-free residues. The A4618 is suitable for multi-channel applications with an adjusted stabilizer pack for a long tank life. KYZEN products and cleaning experts have been focused on providing quality chemicals, such as KYZEN E5631J and AQUANOX A4618, to alleviate the unique cleaning challenges of PCB manufacturers at all stages of their process. 

The electronics industry often uses resin-based materials (such as semi-curing sheets, solder resistance inks, glues, and three anti-paint) to achieve structural bonding or electrical insulation. Whether the resin material can be fully cured directly affects the binding force of the material, and then affects the quality and reliability of the product. Therefore, in the actual use of the process to ensure that this resin material is completely cured, the monitoring of the curing rate is essential. The curing rate is an index to evaluate the chemical and physical state of the resin material from liquid or semi-solid to solid. By measuring the curing rate, the reaction degree of the cured sample can be observed and the performance of the material can be controlled in actual use. There are many commonly used measurement methods, and FTIR Fourier transform infrared spectroscopy is a simple and easy monitoring technology. The following uses UV-curable adhesive as an example to illustrate the application of FTIR infrared spectroscopy in determining the curing rate. 1.1. Test tools and methods Bruker ALPHA II Fourier transform infrared spectrometer was used to place the sample to be tested on the ATR crystal of the sample table, and the test procedure was started to obtain the infrared spectrum. The test was performed three times in parallel at three different locations of the same sample. 1.2. Wave number range of sample test parameters: 4000-400cm-1; Resolution: 4cm-1; Scanning times: 32 times. 1.3. Curing rate calculation principle Quantitative analysis of infrared spectrum is based on the measurement of the peak area of the characteristic absorption spectrum to calculate the content of each component, the theory is derived from Lamberbier's law. In this test, the relative peak ratio method was adopted, the infrared spectrometer was used to test the infrared spectra of uncured raw materials and cured samples respectively, and the software was used to integrate the selected measurement peak and reference peak, and the curing rate was obtained according to the curing rate calculation formula. Uv-curable adhesive is irradiated by ultraviolet light, where -C=C- is polymerized and reacts to form C-C-. The curing rate can be determined by -c =C- change. The shape of the C-H plane on the carbon-carbon double bond is variable and oscillates between 1010-667cm-1. The common peak of UV glue is 810±5cm-1, and the peak in this area is relatively single, easy to distinguish and strong, so it is calculated as the measurement peak. At the same time, in the curing reaction, C=O and C-O in the UV glue do not participate in the reaction, the content is basically unchanged, and C=O (1720 cm-1) or C-O (1150cm-1) is usually used as a reference peak. Due to the high intensity and obvious characteristics of peak C=O measured in practice, the characteristic peak C=O is selected as the reference peak for calculation. The calculation formula is as follows: M'/R' : the ratio of peak area between the cured measurement peak and the reference peak M/R: the ratio of peak area between the uncured measurement peak and the reference peak 1.4. Curing rate calculation results The same sample was tested in parallel for 3 times in this experiment, and the average value was the curing rate result. Table 1: Sample curing rate test data and results 2. Advantages of FTIR in the determination of UV adhesive curing rate • Non-destructive testing: FTIR is a non-destructive test that does not cause any damage to the sample and is suitable for valuable or more limited samples. • Fast response: FTIR is able to complete tests in a short time to meet the needs of rapid quality control. High sensitivity and specificity: FTIR is able to detect small chemical changes, providing precise quantitative analysis of the curing process. 3. FTIR Determination of UV glue curing rate Summary The use of FTIR testing of UV glue curing rate is simple and fast, reliable results, no pre-treatment, no consumption of chemical reagents, and environmental protection and safety. This test method requires a small sample size, basically non-destructive sample, suitable for sample non-destructive testing. In summary, FTIR testing of curing rate is a very valuable technical means for the evaluation of resin electronic materials and processes. In addition, in failure analysis, the technology can also help resolve failure problems caused by insufficient curing of materials. ZESTRON R&S (Reliability and Surface Technology) has extensive global experience in surface interface analysis, risk analysis, failure analysis and more. At ZESTRON's North Asia Analysis Center, The Technical analysis methods used by R&S include but are not limited to high definition digital microscope eye inspection, ion chromatography IC, ion contamination test ROSE, Fourier transform infrared spectroscopy FTIR, coating reliability test CoRe test, particulate matter determination/technical cleanliness Cleanliness, scanning electron microscope/X-ray Energy Spectrum Analyzer (SEM/EDS), X-ray photoelectron Energy Spectrum XPS, Auger electron Energy Spectrum AES, Coating Layer Test, Flux/Resin Test, contact Angle measurement Contact Angle, surface insulation resistance measurement SIR, differential thermal analysis DTA, etc. R&S experts not only assess the risk of failure and recommend preventive measures, but also analyze validation test failures and field failures at the mechanistic and root cause levels. If you are interested, please contact us at academy-china@zestron.com! .

A few days ago, Celis issued an announcement that the holding subsidiary Celis Automobile intends to acquire 919 series of text and graphic trademarks, as well as 44 related design patents, that have been registered or applied for by Huawei and its affiliates, with a total purchase price of 2.5 billion yuan. In response, Huawei responded that "Huawei will transfer a series of trademarks such as Ask Jie to Celes, and will continue to support Celes in making and selling Good Ask Jie." Recently, Celes signed an agreement with Huawei to further deepen joint business cooperation. The two parties will give full play to the advantages of the joint business to build AITO into a world-class new luxury car leading brand. Under the premise that the original cooperation framework remains unchanged, Celex and Huawei give full play to their respective resources and endowment advantages, focus on the AITO brand under Celex, and jointly design and market to provide users with high-end intelligent electric vehicle products and smart mobility solutions, so as to build AITO into a world-class new luxury car leading brand. Both parties achieve commercial success together. This is also after the signing of the deepening joint business agreement between Celes and Huawei in February 2023, the relevant agreement was signed again, marking the determination of the two sides to firmly develop the joint business model and deepen the building of the AITO brand. In addition, the announcement issued by Celis on July 2 shows that Celis intends to acquire all the global categories of "Ask Jie" and other related trademark rights and application rights, and related design patents held by Huawei, with a total purchase price of 2.5 billion yuan. The transfer of goods and brand assets does not affect the existing cooperation business of the two parties, and further guarantees the long-term development of AITO, and also reflects the initial intention of the two parties to focus on the user as the center, and to do a good job in joint business and AITO products. In order to further deepen the comprehensive cooperation with Huawei, Celis is actively planning to participate in Yinwang (a new company established by Huawei Car BU) strategic investment and cooperation. Since the establishment of cross-border business cooperation between Celes and Huawei in 2021, the two sides have given full play to their respective advantages, opened a new cooperation model of the real economy and the digital economy and entered the market. The cross-border cooperation between the two sides has launched AITO M5, M7, M9 and other series of cooperative models, which have been widely concerned and highly recognized by the market. The sales volume of AITO series has ranked among the top luxury brands in the Chinese market. The latest data show that AITO's monthly delivery exceeded 40,000 in June, a record high. Among them, 17,241 AITO M9 were delivered in June, with a total of more than 100,000 units. AITO's new M7 delivered 18,493 units in June, and the cumulative sales in the first half of the year exceeded 110,000. It is reported that more new AITO products will also be launched within the year.

Recently, Lichun Precision in accepting institutional research said that from the perspective of market prospects and growth, the consumer electronics market is still huge, and it is expected that there is at least 10 years of growth room. The company is confident that it will maintain rapid growth in the consumer electronics sector in the next 3-5 years and maintain steady growth in the next 10 years. In the automotive sector, Lichun Precision believes that large-scale production provides significant opportunities for Chinese companies at the Tier 1 supplier level. While the automotive market may not be as large as consumer electronics in terms of absolute market size, it is growing faster and the profitability of the automotive industry is slightly higher than that of consumer electronics. In the communications industry, Ritsu Precision is expected to achieve rapid growth early next year and maintain steady growth after 3-5 years. In the next 10 years, consumer electronics and automobiles will contribute equally to the company, and the growth of the communications industry will also increase significantly, but perhaps not on the scale of consumer electronics. In summary, the company's three major sectors are expected to achieve rapid growth in the next few years and maintain a steady development trend in the long run. Regarding the impact of geopolitics, Lichun Precision said that in recent years, through going into the front line of overseas markets, it has gradually figured out the limits of geopolitics on business development, and it can be seen that about 3%-5% of the company's original products will indeed be limited by geopolitics, and can only be developed in domestic or friendly countries with China. Similar to ODM communication equipment products, server machines, etc., the company has also shrunk the resources invested in this part. The remaining 95% of the market can be divided into two parts, half of the business is completely unaffected, this part of the product is more advantageous for Chinese enterprises, or competitors have not involved; The other half of the business, although in the process of development need to do better than non-Chinese enterprises, but as long as the team has been in the lead, we can fight for opportunities. So for now, there's a certain amount of pressure.