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Recently, some netizens reflected that "Lenovo's small new notebook caused product quality problems due to the use of new low temperature solder paste welding." Lenovo has issued a formal response to this problem, saying that the relevant description is seriously inconsistent with the facts, according to the after-sales data of the small new thin book over the years, there is no difference in the repair rate between the models with low temperature solder paste welding technology and the models with normal temperature solder welding technology. On March 8, Lenovo announced that it would open its low-temperature solder paste technology to all manufacturers for free. In February this year, the UP master "notebook maintenance unit" of Station B published a report titled "Lenovo's Planned scrapping Plan? It is estimated that the owner of the phone is countless "video, said that he received a large number of Lenovo small new series notebooks in need of repair, in the video he dismantled the machine on the spot overhaul, he believes that" because Lenovo uses low temperature solder paste welding technology (LTS), resulting in problems such as black screen." After the video was sent out, a large number of netizens left a message below the video, saying that the Lenovo small new computer they bought also had the above problems. As of press time, the video has received 1.48 million views, nearly 3,900 bullet screens and nearly 10,000 comments. Lenovo Xiaoxin official Weibo "Xiaoxin thin book low temperature solder paste welding technology description" said that because the relevant description is seriously inconsistent with the facts, it is special to explain: 1. Low temperature solder paste welding is a mature and more environmentally friendly technology for electronic product production line, which has been widely used in the production of electronic products. 2. Low temperature solder paste welding technology meets national & international standards, and after many years of mass certification, long-term normal use does not have reliability problems. Lenovo said that according to the after-sales data of the small new thin book over the years, there is no difference in the repair rate between the models using low temperature solder paste welding technology and the models using normal temperature solder welding technology. However, the post also sparked discussion. One netizen said, "But in fact? This problem itself will not appear in the short term, but after two or three years, the probability of occurrence will increase greatly. The solid property of low temperature tin and high temperature tin, as well as the thermal expansion and contraction stress of low temperature tin and the thermal expansion and contraction stress of low temperature tin are different, resulting in the low temperature tin ball being more likely to be compressed and burst by the sealing glue leading to virtual welding, or because the solid property is not as good as that of high temperature tin. Daily use is more likely to occur due to its own solid caused by virtual welding." "This argument is clearly unscientific and ignores the impact on the time dimension." Recently, Lenovo held an external observation and exchange activity at Lianbao Technology, its largest PC research and development and manufacturing base in the world. Lenovo said that for electronic components, whether it is a chip or a capacitor resistor, it needs to rely on solder paste to form solder joints on the circuit board and tightly connected, so that each part can play a role. The traditional solder alloy with tin lead as the main component, the highest temperature in the welding process can reach 250℃, not only will have a lot of energy consumption, but also will volatilize a lot of harmful substances. Lenovo said that under the trend of energy conservation and emission reduction, low temperature solder paste has been placed on high hopes as an effective solution to solve the "high heat, high energy consumption and high emissions" of electronic product welding. Compared with the high temperature solder paste, the maximum welding temperature of the low temperature solder paste is only about 180℃, and the peak welding temperature is reduced by 60℃ -70 ℃. This means that during the welding process, the energy consumption of the product manufacturing process can be reduced by about 35%, thus further reducing the CO2 emissions. In addition, the low temperature solder paste removes the harmful component of lead, which fully complies with the EU RoHS standard and is more environmentally friendly. In addition, "low temperature solder paste welding not only has excellent printability, can effectively eliminate the missing sag and caking phenomenon in the printing process, but also good wettability and long paste life." Moreover, low-temperature solder paste welding can also reduce the warping of the motherboard and chip, and is not easy to damage the high-temperature sensitive electronic components. By using the low-temperature solder paste process, the warpage rate of the chip is reduced by 50 percent, and the defect rate per million parts is significantly reduced, further improving the reliability of PC devices." Lenovo said. According to reports, Lianbao Technology has built more than 70 development laboratories with different functions, and each product needs to undergo thousands of performance verification before realizing consumer applications. Since 2017, Lenovo has shipped 45 million laptops manufactured with the new low-temperature solder paste process, and currently, low-temperature solder paste welding has become one of Lenovo's core technologies. Lenovo believes that low temperature solder paste not only in the field of green low-carbon great achievements, can release a huge amount of social value, but also bring production capacity and quality improvement, out of a high-quality development of the road, various factors show that green low carbon will become a win-win move to enhance the competitiveness of enterprises and brand value, Lenovo predicts that low temperature solder paste will become the mainstream welding process in the future industry.​ Lenovo said that it is willing to open this industry-leading, green and environmentally friendly innovation process to all manufacturers free of charge, jointly promote the green and sustainable development of the industry, and drive more manufacturing enterprises to achieve low-carbon transformation.

H3C recently announced that it will work with Foxconn to build its first overseas plant in Malaysia, which is scheduled to start production in September, followed by plants in the United States, Mexico and Europe in the next two to three years. Yu Yingtao, president and CEO of H3C, made the announcement during the "Zhejiang-Taiwan Cooperation Week 2024". Under the Malaysia project, H3C will leverage its expertise in artificial intelligence (AI), Internet of Things, cloud computing, big data and information security to provide digital solutions and technical support, which will be used to facilitate Malaysia's digital transformation and provide comprehensive solutions and services. The move is in line with H3C's overseas expansion strategy, which has deployed UIS hyperconverged infrastructure across major hospitals in Malaysia and supported hospital data centers through PACS/HIS system virtualization. According to the industry, this deployment enhances the digital management, retrieval, distribution and realisation of local medical image documents, thereby contributing to digital transformation and economic development in Malaysia and Southeast Asia. The two sides will take advantage of Taiwan's precision manufacturing advantages to enter and expand overseas markets. H3c will use Foxconn's chip manufacturing facilities in Malaysia. This follows Foxconn's acquisition of about 5.03% stake in Dagang Nexchange Bhd of Malaysia (DNex), which holds a 60% stake in SilTerra. As a result, the investment will give Foxconn indirect control of an 8-inch wafer fab in Malaysia with a monthly capacity of about 40,000 wafers using 28nm and 40nm process nodes. At the same time, FII, a Foxconn subsidiary, has benefited from a surge in demand for computing facilities, with artificial intelligence (AI) servers becoming a new growth engine and AI computing accounting for 30% of its business revenue. It is reported that Industrial Fulian has received orders from large customers such as Alibaba, Amazon and Apple, and is expected to account for 40% of the company's AI business revenue in 2024, and the share of its AI servers in the global market will increase to 40%. ​​

As DRAM miniaturization continues to advance, companies such as SK Hynix and Samsung Electronics are focusing on the development and application of new materials. According to TheElec, SK Hynix plans to use Inpria's next generation metal oxide photoresist (MOR) in the production of 6th generation (1c process, about 10nm) DRAM, which is the first time MOR has been applied to the DRAM mass production process.   SK Hynix's mass-produced 1c DRAM has five extreme ultraviolet (EUV) layers on it, one of which will be drawn using MOR, the sources said. "Not only SK Hynix but also Samsung Electronics will pursue such inorganic PR materials," he added. Inpria is a subsidiary of Japanese chemical company JSR and a leader in the field of inorganic photoresist. MOR is considered the next generation of chemically amplified photoresist (CAR) currently used in advanced chip lithography. In addition, the company has been working with SK Hynix on MOR research since 2022. SK Hynix has previously said that the use of Sn (base) oxide photoresist will help improve the performance of next-generation DRAM and reduce costs. The TheElec report also noted that Samsung Electronics is also considering applying MOR to 1c DRAM, and currently Samsung Electronics applies six to seven EUV layers on 1c DRAM, while Micron only applies one layer.

Recently, TSMC founder and Alibaba Group Chairman Joe Tsai held a roundtable dialogue in New York, the United States, mainly focused on "leadership in a fragmented world" and other topics. Chang said in the dialogue that the United States wants to slow down China's semiconductor development, but "decoupling" may eventually slow down everyone. "At the end of the day I think it could hurt everybody. If we work together, maybe we can accelerate [innovation]." Mr Tsai echoed similar sentiments. He pointed out that in a complex geopolitical environment, communication is extremely important, and he believes that the Chinese and American business communities need to communicate. Because communication can enhance mutual understanding, build mutual trust, and ultimately contribute to world peace. Lack of communication can lead to misunderstanding, distrust, and conflict. "I still believe that 99 per cent of the world's people love peace and want prosperity for everyone, not just for themselves." "Mr Tsai said. Alibaba Group Chairman Joe Tsai (left) and TSMC founder Morris Chang (right) (photo credit: It is reported that Morris Chang, 92, was born in Yinxian, Ningbo, Zhejiang Province, moved to Nanjing in 1932, and moved to Guangzhou in 1937, studied in the United States Harvard University, Stanford University, and the Massachusetts Institute of Technology mechanical engineering degrees, doctoral degrees, with American citizenship. In 1987, after working at Texas Instruments (TI) for more than 20 years, he returned to Taiwan to found TSMC - one of the world's largest semiconductor manufacturers, known as the "godfather of semiconductors", and was chairman of TSMC before retiring as chairman in 2018. TSMC's customers include Apple, Nvidia and Qualcomm. According to the Forbes list of Taiwan's 50 richest people released in April 2023, Chang's net worth reached 2.3 billion US dollars, ranking 24th and ranking 1312th in the world's richest list. Joe Tsai's ancestral home is Shuanglin Town, Nanxun District, Huzhou City, Zhejiang Province. He was born in 1964 in Taiwan Province, China. He is a Chinese Canadian and a permanent resident of Hong Kong, China. Mr. Tsai holds a Bachelor's degree in Economics and East Asian Studies from Yale University, a Juris Doctor degree from Yale Law School and a bar license in the State of New York. In 1999, Tsai joined Alibaba founded by Jack Ma as chief financial officer, and then promoted Alibaba to get investment from Goldman Sachs and SoftBank Group, and completed IPO listing on NASDAQ in the United States and Hong Kong in China. In September 2023, Ali Group announced that Tsai Chongxin served as chairman and director of the Board of directors of Alibaba Holding Group, member of Alibaba Group Capital Management Committee, chairman of Cainiao Group, director of Taotian Group, member of the investment committee of Alibaba Group and Ant Group, one of the founding partners of Ali Group, and member of the board of directors of NBA China. The conversation between Tsai and Chang focused on topics such as technology, economy and education. When asked what keeps him awake at night, Mr Chang initially says no, then confides that he is particularly worried about "decoupling" and the way countries around the world seem to be complaining about each other. "It looks like countries are getting angry with each other, and that worries me." Chang believes that only cooperation can accelerate innovation, and his advice to U.S. business leaders to communicate more with China and Asian countries has been ignored by many. Chang also cited Harvard professor Graham Allison's international best-selling book Destined for War: Can China and the United States Escape Thucydides's Trap, which he said was accurate: "The situation was that the existing power was pitted against the rising power." He noted that Allison's book gave 18 examples of existing powers confronting emerging powers that led to war, "but we hope that nothing more serious will arise between China and the United States." In this regard, Tsai Chongxin said that the two "hot wars" between Russia and Ukraine and the Israeli-Palestinian conflict made him worried. He called the current world "very dangerous and unpredictable" and expressed hope that "the world's two largest economies will not accidentally or intentionally enter into a bitter conflict." At the same time, Tsai also praised China's vocational education system and predicted that China would remain a manufacturing powerhouse despite recent economic difficulties. "But probably not to the point of making very high-end chips." Tsai stressed that China, like the rest of Asia, remains a "very dynamic place" for investors, with a large workforce and advanced technology talent. "You're looking at about 800 million people in the labor force, and 200 million of them are highly educated, highly skilled workers." "Mr Tsai said. Chang stressed that for a country to become a successful manufacturing hub, it does not need a lot of geniuses, but it does need "a lot of disciplined people" with technical skills. It is reported that in December 2022, TSMC announced that it began to build the second phase of 3nm wafer fab in Arizona, the United States, which is expected to be produced in 2026, plus the current phase of 4nm plant, the total investment of the second phase of the project is about $40 billion (about 279.572 billion yuan), which is one of the largest foreign direct investment cases in the history of the United States. Mr. Chang, now retired, has been giving public speeches recently. He said on Oct. 14 that globalization in the semiconductor industry no longer exists and there is no more free trade. And the immediate priority is national security. "I see this global race going on. Our competitors could take advantage of this environmental trend to beat us." Chang stressed that after 20 years, China's Taiwan chip industry is afraid of losing its advantages, and TSMC's future challenges will be more severe. On October 25, Chang returned to Massachusetts Institute of Technology (MIT) to give a speech at his Alma mater. According to the official website of MIT News, Chang pointed out in his speech that why TSMC can succeed, because TSMC has obtained many excellent and well-trained technical personnel from local vocational schools. In learning by doing, chipmakers can reduce costs by improving processes, but only if production is centralized in one place. He stressed that because of the relatively tense relations between China and the United States, chip manufacturing has become one of the areas of industrial competition between the two countries. "In a broader sense, the prominence of semiconductor manufacturing seems to be related to international and regional economic developments. Frankly speaking, the advantages that China's Taiwan region enjoys today...... What the United States enjoyed in the 1950s and 1960s." In the next few decades, India, Vietnam or Indonesia may be more suitable for developing semiconductor manufacturing, but it also depends on how the environment evolves. "Without national security, we will lose everything we hold dear," Chang stressed, "and we want to avoid a Cold War at all costs if we can.

According to media reports, Zhang Minggang, deputy general manager of Huawei's French branch, revealed that Huawei's first overseas factory has been determined to land in France and is expected to be put into operation by the end of 2025. Zhang Minggang said that Huawei's French factory is located in the Rhine province of Brumart town, covering an area of about 8 hectares (about 80,000 square meters). The project is expected to invest 200 million euros (about 1.54 billion yuan), while the annual output value can reach 1 billion euros (about 7.72 billion yuan), the rate of return is quite high, while creating 800 jobs, of which 300 in the near future and 500 in the long term. The plant is expected to produce 1 billion devices a year, but not smartphones, but chipsets, motherboards and other components needed for 4G/5G base stations, which can supply the entire European market. Huawei entered France in 2003 and now has six research and development centers in Paris and one global design center, providing nearly 10,000 jobs. France used to be Huawei's largest overseas market (annual revenue of 2.5 billion euros in 2021), and was even regarded as Ren Zhengfei's second home, as early as 2019, Huawei announced that it would set up a factory in France, originally planned to put into production in early 2023, but because of environmental protection and other reasons, it has been delayed for a long time.

From plug and play to sophisticated automation platforms, innovative intelligent solutions create new value. At IPC APEX 2024, April 9-11 (Booth 2405), Global Instruments will demonstrate a range of electronic assembly automation solutions, including: Industry standard Fuzion® mounters, versatile Uflex® automation platform, cost-effective Omni™ inserts, and IQ360™ Smart factory software. The Fuzion Mounter family delivers low single mount costs for any portfolio, from conventional to complex board assembly, from shapes to a wide range of semiconductor applications, and can handle a range of production environments, including ultra-high capacity (XC) models with up to 272 feeder stations that support a wide variety of new product introduction solutions. And with a 30-axis mount head, high-speed models up to 66,500 cph can be achieved. Uflex operates a wide range of processes and supports a variety of feeders to complete virtually any automated process. It supports up to four independent cantilevers on a single gantry, and features include vacuum or pneumatic mounting, screw drive, UV curing, dispensing and more. For more basic automation tasks, Omni inserts offer simplified operating processes and the efficiency of a single process. It utilizes a linear motor positioning system and a range of intelligent functions to enable precise, high-speed insertion of axial, radial and other special-shaped components. IQ360 Intelligent Factory software is a complete set of intelligent factory management modules, the purpose is to control, monitor and improve production efficiency. The software package includes: IQ360 product design and new product introduction module, IQ360 material management module, IQ360 production control module and IQ360 monitoring and analysis module, and can provide specific module combinations for individual plant needs to create a true "connected factory" production environment. "The surface mount process is already highly automated, but the end-of-the-line process is largely manual and extremely inefficient," said Glenn Farris, vice president of Global customer operations and corporate marketing at Global Instruments. Farris continued, "According to a typical high-volume manufacturer, these back-end processes represent less than 5% of the total process, but account for the majority of the rework effort. Therefore, we need to mitigate these inefficiencies by finding intelligent solutions that match the level of front-line operator automation experience. From basic users to advanced users, we provide plug-and-play solutions for complex automated tasks with highly configurable solutions." .

For a long time, the industry's understanding of the cleaning process was not sufficient. Mainly because the previous PCBA assembly density is low, the adverse effects of pollutants such as flux residues on electrical performance are not easy to be detected. Nowadays, with the development of the design of PCBA to miniaturization, the device size and the spacing between the devices have become smaller, and the short-circuit and electrochemical migration caused by small particle residues have attracted widespread attention. In order to adapt to market trends and improve product reliability, more and more SMT manufacturers have started a journey of learning about the cleaning process. The cleaning process is a process that combines the static cleaning force of the cleaning agent and the dynamic cleaning force of the cleaning equipment to finally remove the pollutants. PCBA cleaning is divided into SMT (SMT) and plug-in (THT) two stages, through cleaning can remove the accumulation of surface pollutants during the processing of products, reduce the risk of surface contamination and reduce reliability of products. In the electronics manufacturing and semiconductor processing industries, choosing the right cleaning agent with the right cleaning equipment is very important. The factors that affect the stability of PCBA cleaning process mainly include: cleaning object, cleaning equipment, cleaning agent and process control. Under normal circumstances, the cleaning object is the solder paste and flux residue, which will cause electrochemical migration, corrosion and short circuit, which brings a great threat to the reliability of the product, but it does not exclude large particle pollution, oil stains and sweat stains on the surface of the circuit board. The material properties and surface conditions of different PCBA are also different. The ZESTRON Technical Center conducts free cleaning tests every day, and in many cases the customer's product cannot be flooded and therefore is not suitable for the immersion cleaning process! In addition, some components are made of sensitive metals, which are very fragile and cannot be cleaned using ultrasonic waves, otherwise those bubbles will shatter the components when they explode. There are also some components that must be treated "gently" with a pH neutral cleaning solution! Usually the surface of the circuit board has a very complex geometric structure, and the integrated density is also very high. When the distance between the device and the substrate is very small, the water droplets of deionized water can not drill into the small gap, and it is unable to remove the pollutants at the bottom of the device, and chemical cleaning agents are needed to help. Cleaning agent Choosing a special cleaning agent is very important. The ZESTRON database stores more than 2,500 formulations and related raw materials, with a rich portfolio of water-based, semi-water-based and solvent-based products designed for different contaminants. Material compatibility is often overlooked but vital part of the cleaning process, such as: the power module package has a variety of metal materials such as copper, nickel or aluminum, improper cleaning process can easily lead to corrosion or oxidation of the surface of aluminum chips and copper, and some characters fall off. Therefore, the material incompatibility between the cleaning agent and the cleaning object, and between the cleaning agent and the cleaning equipment may lead to product scrap, or cause the blockage of the equipment pipeline. As a chemical used in the production line and may directly contact the human body, improper operation may cause personal injury and economic loss. ZESTRON has been a green and safe cleaning product since 1989, when it developed the first alternative to CFCS. At all times, ZESTRON is committed to compliance with REACH, the RoHS Directive and the WEEE Directive. ZESTRON cleaning agent does not contain ODS ozone layer destroying components and VOC content meets national standards. Cleaning equipment A complete cleaning process usually includes cleaning, rinsing and drying these three processes, in the cleaning process, cleaning agent and pollutants contact each other, cleaning agent will separate the pollutants from the surface of the cleaning object; The rinsing and drying process is mainly to further remove contaminants, but also to ensure that there is no residue of cleaning agent on the surface of the components. The ZESTRON Technical Center houses more than 100 cleaning equipment from the world's leading cleaning equipment manufacturers. From off-line batch cleaning equipment, such as ultrasonic cleaning equipment, submerged cleaning equipment, centrifugal cleaning equipment, to online spray equipment, customers can choose from a variety of common cleaning mechanics. ZESTRON can test your products under real production conditions and evaluate cleaning applications, cleaning equipment, and cleaning agents according to customer requirements. Cleaning process control With the increase of cleaning time, the continuous entry of pollutants in the cleaning solution will have a negative impact on the cleaning efficiency. When should I change the fluid? When is the latest fluid change? How to adjust the cleaning parameters when the environment/product changes? These questions are directly related to the customer's cost and output, and the key to finding answers lies in the collection of cleaning data, including: time, movement, concentration and temperature. Among them, the cleaning solution will be affected by many factors in the process of use, such as: residue in the liquid, the evaporation of the liquid, the addition of deionized water, etc., and its concentration will often fluctuate. Therefore, in the circuit cleaning process, the concentration monitoring is directly related to the stability of the cleaning effect.

Only an AI computer can save HP. HP on Wednesday after the bell reported second-quarter results, revenue of $12.8 billion, EPS of 82 cents are higher than expected, including PC sales for the first time in two years to achieve growth, which is inseparable from the recent fire AI computers. HP shares rose more than 2 percent in after-hours trading. AI computers will be the next key growth point for HP, especially this financial report showed that HP's home printer sales fell 16%, and commercial printer sales fell 12%. HP CEO Enrique Lores said on Wednesday that existing computer equipment is aging, and both small and large companies are realizing the need to update their AI computers. AI computers are expected to account for 10 percent of the company's computer shipments in the second half of this fiscal year. HP launched the first generation of AI computer products powered by Intel and AMD chips in early May, and will launch a new Copilot+ product powered by Qualcomm's Snapdragon X processor in June. Lores said that the new shipments will last from early May to November, because the mass production of these powerful AI computers "will take some time." In the early days, it is mainly individual consumers who buy AI computers, while institutional customers need more time to evaluate the performance of AI computers before making large purchases, and the demand for AI computers will grow significantly in the next few years. "We expect AI computers to account for 40 to 50 percent of total PC shipments in the next three years," he said confidently. "AI computers will become very important." According to data analysis firms IDC and Gartner, HP and its foundry will ship about 50 million AI computers globally this year, which will account for 22% of global PC shipments in 2024. Lores stressed that as AI computer hardware upgrades and Microsoft will end updates and support for Windows 10 in October 2025, customers are moving to Windows 11, and Win 11 is an AI system with Copilot embedded. These factors are driving customers to buy AI computers. He also said: "At present, some customers are still waiting to update AI computers, and they will speed up the cycle of updating computers in the future, after all, AI computers are very valuable to improve production efficiency."

A team from Tsinghua University's brain-like Computing Research Center recently developed the world's first brain-like complementary vision chip, "Tianmou Core," which was published as a cover article in the international academic journal Nature on May 30. In the open world, intelligent systems not only have to deal with huge amounts of data, but also need to deal with extreme events such as sudden dangers in driving scenes, drastic light changes at the mouth of the tunnel and strong flash interference at night, said Shi Luping, corresponding author of the paper and professor of the Department of precision Instruments at Tsinghua University. In the face of such scenes, traditional visual perception chips often have distortion, failure or high delay, which limits the stability and security of the system. In order to better address the above problems, a team from the Research Center of brain-like Computing at Tsinghua University focused on brain-like visual perception chip technology and proposed a new paradigm of brain-like visual perception based on complementary dual-pathway visual primitives. The picture shows "Tianmou Core". (Department of Precision Instruments, Tsinghua University) "This paradigm draws on the basic principles of the human visual system, disassembles the open world visual information into information representations based on visual primitives, and through organic combination of these primitives, imitates the features of the human visual system, forming two complementary advantages and complete information visual perception pathways." Shi Luping said. Based on this new paradigm, the team further developed the world's first brain-like complementary vision chip "Tianmaicin", which realizes high-speed, high-precision and high-dynamic range visual information acquisition at the cost of extremely low bandwidth and power consumption, and can effectively cope with various extreme scenarios to ensure the stability and security of the system. At the same time, based on the "Tianmou core", the team also independently developed high-performance software and algorithms, and conducted performance verification on the open environment vehicle platform. In a variety of extreme scenarios, the system realizes real-time perceptual reasoning with low latency and high performance, showing its application potential in the field of intelligent unmanned systems. Zhao Rong, the corresponding author of the paper and a professor at the Department of precision Instrumentation at Tsinghua University, said that Tianmou Core opens up a new way for important applications such as autonomous driving and embodied intelligence. Combined with the team's technology accumulation in the application of brain-like computing chip "day movement", brain-like software tool chain and brain-like robot, the addition of "Tianmouxin" will be able to further improve the brain-like intelligence ecology and effectively promote the development of artificial general intelligence. According to reports, this is the second time that the team has appeared on the cover of Nature after the heterogeneous fusion brain-like computing "Day movement", marking a basic breakthrough in both directions of brain-like computing and brain-like perception.

AIM Solder, the world's leading manufacturer of solder assembly materials, is proud to announce that it has joined the International Alliance of Electronic Manufacturers (iNEMI). This strategic alliance underscores AIM Solder's commitment to advancing the electronics manufacturing industry through collaboration and innovation. iNEMI is a non-profit consortium that brings together the world's leading electronics manufacturers, suppliers, associations, government agencies and universities. Its mission is to anticipate and accelerate improvements in electronics manufacturing, addressing technology and infrastructure gaps through high-impact projects and proactive forums. iNEMI implements a global agenda focused on bridging gaps in technology and infrastructure through collaborative projects and industry forums. For more information, please visit www.inemi.org. "Joining iNEMI aligns perfectly with our mission to provide innovative and reliable product solutions to the electronics industry," said Tim O 'Neill, Director of product Management at AIM Solder. "We are excited to partner with other industry leaders to drive progress and support the development of cutting-edge technologies." As part of iNEMI, AIM Solder will be involved in various projects focusing on key areas related to solder materials, electronics manufacturing, sustainable electronics and more. These initiatives not only benefit AIM Solder's product development efforts, but also contribute to the overall advancement of the global electronics manufacturing industry.

TRI, a supplier of test and inspection systems for the electronics manufacturing industry, announced the completion and opening of the Linkou Phase II Manufacturing Center building. Teletech is committed to developing new technologies and inspection solutions and entering the semiconductor and advanced packaging industry applications. The newly completed Manufacturing Center building is an extension of the Linkou Manufacturing Center base in Taiwan, consisting of 10 floors above ground and 4 floors below ground, with dedicated exhibition halls and seminar Spaces. It has greatly increased the production capacity, product development/verification space, and the display area of various product lines and smart factory applications. The company offers one-stop solutions for PCBA board assembly and advanced package testing and inspection, including 3D solder Paste Printing Inspection (SPI), 3D Automatic Optical Inspection (AOI), 3D CT Automatic X-ray Inspection (AXI) and high-performance Applied Circuit Testing (ICT). Our solution portfolio has a wide range of advanced and advanced features to meet current and future production line requirements. Celebrate the 35th anniversary of Delu Technology with you to celebrate the 35th anniversary of Delu Technology! Delu will continue to focus on AI-driven test and inspection solutions at exhibitions and workshops throughout 2024. Delu's success reflects a commitment to excellence and a continuous journey of growth with our valued customers.

In today's rapidly changing technology, especially the rapid development of high-voltage systems (such as 800V power modules) led by the new energy automobile industry, the electronics industry has put forward unprecedented high requirements for the protection performance of electronic components. Humidity, ion pollution, particle residue and other factors have become a major hidden danger affecting insulation performance, resulting in leakage and equipment damage. In order to improve the protective ability of electronic components, the industry generally uses Conformal coating technology (commonly known as three anti-paint). After the coating process, the electronic products are like wearing a layer of "invisible armor," which not only strengthens the ability to resist external infringement, but also promotes the reduction of conductor spacing in the circuit board design, so as to effectively maintain the stability of electrical insulation. The performance of the coating technology in wet environment is evaluated in many aspects, including dielectric constant, thermal properties, flammability, coating creep, chemical compatibility and chemical resistance. Through the insight of practical application scenarios, this paper extracts three performance evaluation indicators that are often ignored in wet environments, aiming to provide valuable reference information for industry peers to promote a more comprehensive and in-depth consideration of material properties. 1. Hydrolytic stability Hydrolytic stability is a measure of the ability of the coating to maintain its original physical and chemical properties in a humid environment. In high humidity environments (usually relative humidity greater than 60%), the coating may experience performance degradation if it does not have good hydrolysis stability. Submicron dust particles in the atmosphere may be acidic or alkaline. At humidity ≥80%, the thickness of the water layer can reach 10 molecules, at which time the material deposited in the atmosphere begins to dissolve, resulting in a free-flowing ion stream. These ions can penetrate the coating and cause circuit short circuit, corrosion and dendrite growth, which can lead to the failure of the entire electronic system. 2. Water vapor permeability Water vapor permeability refers to the ability of water vapor to be coated through the coating. Due to the small size of water molecules, almost all polymer substrates can penetrate, so all coating materials have a certain degree of water vapor permeability, but the penetration rate and degree are different. The chemical composition, thickness, degree of cure, and environmental factors such as temperature and humidity all affect the water vapor permeability of the coating. Although a certain degree of air permeability is conducive to the natural drying of the PCB in the non-working state, excessive penetration may increase the risk of leakage current, accelerate corrosion and reduce insulation performance. Therefore, when selecting the coating, it is necessary to balance its moisture-proof and breathability to ensure that it can effectively block moisture and does not affect the natural recovery and drying ability of the circuit board. 3. Ion penetrability Ion penetrability is a direct indicator to evaluate the defense ability of the coating against ionic contaminants, especially in the environment of contaminants such as flux residue and salt spray. Ions can enter the coating through the coating defects, micropores or directly through the molecular chain, leading to electrochemical reactions that lead to corrosion and insulation degradation. Surface insulation resistance (SIR) testing, sequential electrochemical reduction analysis (SERA), and diffusion cell measurement are widely used to test the resistance of coated coatings to ion penetration. The SIR Test directly assesses the resistance change at the substrate interface under the shape coating, the SERA test focuses on the oxidation state of the metal under the shape coating, and the diffusion cell experiment directly monitors the dynamics of specific contaminants through the shape coating by simulating the environment. The comprehensive application of these test methods shows that ions have penetration, and also provides scientific basis for the selection and improvement of the coating shape, to ensure that the selected coating shape can effectively prevent the penetration of harmful ions, and maintain the electrical safety of the circuit. In practical application, the selection of shape coating should consider the cost benefit, environmental adaptability and safety. In order to ensure the reliability and long-term stability of electronic devices in wet environments, the performance evaluation of the coating is particularly important. Users should be aware of the different assessment test methods and applicability of surface cleanliness, as well as advanced technical experience in the field of reliability and surface technology, such as the reliability of shape coatings. With cutting-edge instrumental analysis technology and rich experience in the field of process technology and reliability, ZESTRON R&S is able to conduct comprehensive and accurate characterization and evaluation of electronic product surfaces, providing customers with analytical services such as Coating reliability test CoRe test, Coating Layer Test, coating layer test, etc. Help customers solve complex reliability and surface technology problems.