Global Soul Limited Company News

KYZEN, a global leader in innovative and environmentally friendly chemical cleaning agents, will be exhibiting at the SMTA Queretaro Expo and Technical Forum on June 6. The KYZEN cleaning team will present the steel mesh bottom cleaning agent KYZEN E5631J and the water-based cleaning solution AQUANOX A4618. Both KYZEN E5631J and AQUANOX A4618 are formulated to effectively clean solder at different stages of PCB production. KYZEN E5631J is a ready-to-use solution proven to be compatible with common steel mesh, cleaning equipment and printer manufacturers for the removal of solder paste from steel mesh. This cost-effective solution cleans all types of solder paste quickly and efficiently during both online and offline cleaning processes. AQUANOX A4618 is a water-based cleaning agent designed to clean lead-free flux residues, including no-clean and lead-free residues. The A4618 is suitable for multi-channel applications with an adjusted stabilizer pack for a long tank life. KYZEN products and cleaning experts have been focused on providing quality chemicals, such as KYZEN E5631J and AQUANOX A4618, to alleviate the unique cleaning challenges of PCB manufacturers at all stages of their process. 

The electronics industry often uses resin-based materials (such as semi-curing sheets, solder resistance inks, glues, and three anti-paint) to achieve structural bonding or electrical insulation. Whether the resin material can be fully cured directly affects the binding force of the material, and then affects the quality and reliability of the product. Therefore, in the actual use of the process to ensure that this resin material is completely cured, the monitoring of the curing rate is essential. The curing rate is an index to evaluate the chemical and physical state of the resin material from liquid or semi-solid to solid. By measuring the curing rate, the reaction degree of the cured sample can be observed and the performance of the material can be controlled in actual use. There are many commonly used measurement methods, and FTIR Fourier transform infrared spectroscopy is a simple and easy monitoring technology. The following uses UV-curable adhesive as an example to illustrate the application of FTIR infrared spectroscopy in determining the curing rate. 1.1. Test tools and methods Bruker ALPHA II Fourier transform infrared spectrometer was used to place the sample to be tested on the ATR crystal of the sample table, and the test procedure was started to obtain the infrared spectrum. The test was performed three times in parallel at three different locations of the same sample. 1.2. Wave number range of sample test parameters: 4000-400cm-1; Resolution: 4cm-1; Scanning times: 32 times. 1.3. Curing rate calculation principle Quantitative analysis of infrared spectrum is based on the measurement of the peak area of the characteristic absorption spectrum to calculate the content of each component, the theory is derived from Lamberbier's law. In this test, the relative peak ratio method was adopted, the infrared spectrometer was used to test the infrared spectra of uncured raw materials and cured samples respectively, and the software was used to integrate the selected measurement peak and reference peak, and the curing rate was obtained according to the curing rate calculation formula. Uv-curable adhesive is irradiated by ultraviolet light, where -C=C- is polymerized and reacts to form C-C-. The curing rate can be determined by -c =C- change. The shape of the C-H plane on the carbon-carbon double bond is variable and oscillates between 1010-667cm-1. The common peak of UV glue is 810±5cm-1, and the peak in this area is relatively single, easy to distinguish and strong, so it is calculated as the measurement peak. At the same time, in the curing reaction, C=O and C-O in the UV glue do not participate in the reaction, the content is basically unchanged, and C=O (1720 cm-1) or C-O (1150cm-1) is usually used as a reference peak. Due to the high intensity and obvious characteristics of peak C=O measured in practice, the characteristic peak C=O is selected as the reference peak for calculation. The calculation formula is as follows: M'/R' : the ratio of peak area between the cured measurement peak and the reference peak M/R: the ratio of peak area between the uncured measurement peak and the reference peak 1.4. Curing rate calculation results The same sample was tested in parallel for 3 times in this experiment, and the average value was the curing rate result. Table 1: Sample curing rate test data and results 2. Advantages of FTIR in the determination of UV adhesive curing rate • Non-destructive testing: FTIR is a non-destructive test that does not cause any damage to the sample and is suitable for valuable or more limited samples. • Fast response: FTIR is able to complete tests in a short time to meet the needs of rapid quality control. High sensitivity and specificity: FTIR is able to detect small chemical changes, providing precise quantitative analysis of the curing process. 3. FTIR Determination of UV glue curing rate Summary The use of FTIR testing of UV glue curing rate is simple and fast, reliable results, no pre-treatment, no consumption of chemical reagents, and environmental protection and safety. This test method requires a small sample size, basically non-destructive sample, suitable for sample non-destructive testing. In summary, FTIR testing of curing rate is a very valuable technical means for the evaluation of resin electronic materials and processes. In addition, in failure analysis, the technology can also help resolve failure problems caused by insufficient curing of materials. ZESTRON R&S (Reliability and Surface Technology) has extensive global experience in surface interface analysis, risk analysis, failure analysis and more. At ZESTRON's North Asia Analysis Center, The Technical analysis methods used by R&S include but are not limited to high definition digital microscope eye inspection, ion chromatography IC, ion contamination test ROSE, Fourier transform infrared spectroscopy FTIR, coating reliability test CoRe test, particulate matter determination/technical cleanliness Cleanliness, scanning electron microscope/X-ray Energy Spectrum Analyzer (SEM/EDS), X-ray photoelectron Energy Spectrum XPS, Auger electron Energy Spectrum AES, Coating Layer Test, Flux/Resin Test, contact Angle measurement Contact Angle, surface insulation resistance measurement SIR, differential thermal analysis DTA, etc. R&S experts not only assess the risk of failure and recommend preventive measures, but also analyze validation test failures and field failures at the mechanistic and root cause levels. If you are interested, please contact us at academy-china@zestron.com! .

A few days ago, Celis issued an announcement that the holding subsidiary Celis Automobile intends to acquire 919 series of text and graphic trademarks, as well as 44 related design patents, that have been registered or applied for by Huawei and its affiliates, with a total purchase price of 2.5 billion yuan. In response, Huawei responded that "Huawei will transfer a series of trademarks such as Ask Jie to Celes, and will continue to support Celes in making and selling Good Ask Jie." Recently, Celes signed an agreement with Huawei to further deepen joint business cooperation. The two parties will give full play to the advantages of the joint business to build AITO into a world-class new luxury car leading brand. Under the premise that the original cooperation framework remains unchanged, Celex and Huawei give full play to their respective resources and endowment advantages, focus on the AITO brand under Celex, and jointly design and market to provide users with high-end intelligent electric vehicle products and smart mobility solutions, so as to build AITO into a world-class new luxury car leading brand. Both parties achieve commercial success together. This is also after the signing of the deepening joint business agreement between Celes and Huawei in February 2023, the relevant agreement was signed again, marking the determination of the two sides to firmly develop the joint business model and deepen the building of the AITO brand. In addition, the announcement issued by Celis on July 2 shows that Celis intends to acquire all the global categories of "Ask Jie" and other related trademark rights and application rights, and related design patents held by Huawei, with a total purchase price of 2.5 billion yuan. The transfer of goods and brand assets does not affect the existing cooperation business of the two parties, and further guarantees the long-term development of AITO, and also reflects the initial intention of the two parties to focus on the user as the center, and to do a good job in joint business and AITO products. In order to further deepen the comprehensive cooperation with Huawei, Celis is actively planning to participate in Yinwang (a new company established by Huawei Car BU) strategic investment and cooperation. Since the establishment of cross-border business cooperation between Celes and Huawei in 2021, the two sides have given full play to their respective advantages, opened a new cooperation model of the real economy and the digital economy and entered the market. The cross-border cooperation between the two sides has launched AITO M5, M7, M9 and other series of cooperative models, which have been widely concerned and highly recognized by the market. The sales volume of AITO series has ranked among the top luxury brands in the Chinese market. The latest data show that AITO's monthly delivery exceeded 40,000 in June, a record high. Among them, 17,241 AITO M9 were delivered in June, with a total of more than 100,000 units. AITO's new M7 delivered 18,493 units in June, and the cumulative sales in the first half of the year exceeded 110,000. It is reported that more new AITO products will also be launched within the year.

Recently, Lichun Precision in accepting institutional research said that from the perspective of market prospects and growth, the consumer electronics market is still huge, and it is expected that there is at least 10 years of growth room. The company is confident that it will maintain rapid growth in the consumer electronics sector in the next 3-5 years and maintain steady growth in the next 10 years. In the automotive sector, Lichun Precision believes that large-scale production provides significant opportunities for Chinese companies at the Tier 1 supplier level. While the automotive market may not be as large as consumer electronics in terms of absolute market size, it is growing faster and the profitability of the automotive industry is slightly higher than that of consumer electronics. In the communications industry, Ritsu Precision is expected to achieve rapid growth early next year and maintain steady growth after 3-5 years. In the next 10 years, consumer electronics and automobiles will contribute equally to the company, and the growth of the communications industry will also increase significantly, but perhaps not on the scale of consumer electronics. In summary, the company's three major sectors are expected to achieve rapid growth in the next few years and maintain a steady development trend in the long run. Regarding the impact of geopolitics, Lichun Precision said that in recent years, through going into the front line of overseas markets, it has gradually figured out the limits of geopolitics on business development, and it can be seen that about 3%-5% of the company's original products will indeed be limited by geopolitics, and can only be developed in domestic or friendly countries with China. Similar to ODM communication equipment products, server machines, etc., the company has also shrunk the resources invested in this part. The remaining 95% of the market can be divided into two parts, half of the business is completely unaffected, this part of the product is more advantageous for Chinese enterprises, or competitors have not involved; The other half of the business, although in the process of development need to do better than non-Chinese enterprises, but as long as the team has been in the lead, we can fight for opportunities. So for now, there's a certain amount of pressure.    

As a market leader and innovation leader in SMT production technology, ASMPT has added two new features to its mature DEK printing platform: automatic solder paste transfer and simplified scraper change. With its broad product portfolio, ASMPT covers almost every aspect of the SMT production process, while continuing to drive automation and simplify operations. Rick Goldsmith, Director of Product Management at ASMPT, explains: "Solder paste printing is the most error-prone part of SMT production, and many of these steps are still manual. However, as the recruitment of qualified operators becomes more difficult, our customers are increasingly looking for innovative solutions that reduce labor and material costs while effectively reducing error rates." Solder paste transfer When the Settings of the press need to be changed, the solder paste from the old steel mesh needs to be transferred to the new steel mesh. "Previously, the process was done manually with a scraper," explains Goldsmith. This method often results in part of the solder paste can not be completely transferred, there is always some left in the old steel net. In addition, the solder paste can become contaminated or diverted to the wrong place, which can cause short circuits and other problems." Now, a new solder paste transfer device from DEK TQ simplifies this process. As long as the process parameters are set to allow, the solder paste is automatically transferred whenever the steel mesh is replaced. To do this, the scraper pushes the paste to the transfer device, which then applies the paste to the new steel mesh. Next, the system will use the steel mesh bottom cleaning device to clean the residual solder paste. Solder paste transfer: ASMPT automatically transfers solder paste during mesh replacement and accelerates the transition process. "This fully automated solder paste transfer system eases the workload of scarce operators," Goldsmith notes. Faster, more accurate and more efficient than manual operation. In traditional manual operations, up to 10% solder paste is often left in the steel mesh, and our automatic solder paste transfer system reduces this figure by 5%. This system greatly reduces the cost of solder paste, thus reducing the production cost of each PCB." The new solder paste transfer system can be easily installed on the solder paste presses of the DEK TQ series. Quick Scraper change ASMPT also improves the scraper change process for solder paste presses. Goldsmith explains: "Previously, the scraper was secured with two finger screws, and in order to replace the scraper, the operator needed to loosen the pair of screws and then tighten them again, a process that was time-consuming and often problematic. For example, some operators will screw too tight, subsequent personnel can not loosen. The time factor is also important, and it is not unusual to change knives more than 20 times a day." Quick blade change: Automatic lock and unlock features reduce blade change time by 50% Thanks to the innovative design of the new stand, the blade is automatically unlocked when it needs to be removed from the machine, greatly simplifying the change process. Then it can be easily replaced in one step, and when the scraper is put back into the bracket, the bracket automatically locks. This device reduces the scraper replacement time by 50%. In addition, mechanical pins prevent misinstallation of the scraper. The quick-change scraper unit can be retrofitted in a matter of hours and is compatible with both DEK TQ and NeoHorizon platforms. Goldsmith goes on to add, "SMT production is becoming increasingly competitive, and to stand out in this space requires a continuous drive to automate and simplify operations. ASMPT understands the challenges facing SMT manufacturers and is committed to providing customers with unique solutions to help them win in the fierce market competition." About ASMPT Limited (ASMPT) ASMPT is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronic products. Headquartered in Singapore, ASMPT's products cover semiconductor assembly, packaging and SMT (surface mount technology), from wafer deposition to a wide range of solutions for organizing, assembling and packaging precision electronic components for the manufacture of end-use electronic devices such as electronics, mobile communications devices, computing devices, automotive, industrial and LED (display) devices. Working closely with its customers, ASMPT continues to invest in research and development to develop cost-effective and impactful solutions that contribute to their productivity, reliability and quality. ASMPT (HKEX stock code :0522) is a constituent of the Hang Seng Composite Mid-Cap Index under the Hang Seng Composite Market Cap Index, the Hang Seng Composite Information Technology Industry Index under the Hang Seng Composite Industries Index and the Hang Seng Hong Kong 35 Index. For more information about ASMPT, please visit: https://www.asmpt.com ASMPT SMT Solutions Segment The mission of ASMPT SMT Solutions Segment is to implement and support SMT integrated smart factories for electronics manufacturers worldwide. ASMPT solutions support the networking, automation and optimization of online and factory-level central workflows through hardware, software and services, enabling electronics manufacturers to make a phased transition to the smart factory and significantly improve productivity, flexibility and quality. With its holistic "open automation" philosophy, ASMPT opens the door for customers to cost-effective automation that is modular, flexible and non-proprietary, tailored to their individual needs. The company's portfolio of products and services includes hardware and software such as SIPLACE mounters, DEK presses, inspection and material storage solutions, and intelligent shop floor management suites. With Works, ASMPT provides electronics manufacturers with high-quality software for planning, controlling, analyzing, and optimizing all processes on the shop floor. As maintaining close relationships with customers and partners is a core component of its strategy, ASMPT has established the SMT Smart Network as a platform for active exchange of information between smart factories around the world.

With more than a month to go before the September release, the iPhone 16 is in a critical period for new devices to be ready for stock, and Foxconn is currently hiring on a large scale. According to reports, at present, Zhengzhou Foxconn is recruiting high-priced workers, mainly hourly workers and return workers. The hourly wage will be increased to $26, and rebate workers will get a cash rebate of $7,500 after 90 days of clocking in. For the news of 50,000 people pouring into Foxconn reported by the media, there is an intermediary introduction that the people who interview for the job every day are basically waiting in a long line. "Mass production of the iPhone 16 is imminent," the agency said. According to the news released by the Zhengzhou Fu Labor Federation recruitment public number, Zhengzhou Foxconn refund 7500+500 yuan subsidy is in hot recruitment, the highest price for the year. In addition, the recruitment conditions are further relaxed, since 8/7, A business group 18 to 24 years old entry no longer check non-student certificates (learning network, salary flow are no longer checked), hourly workers, return workers can sign up for employment. Hourly workers and return workers of A business group can enjoy an additional subsidy of 200~500 yuan. It is reported that the rebate model is suitable for more than 3 months of job seekers, 3 months can be estimated to get: (base salary of 2100 yuan + overtime pay) *3 + 7500 yuan rebate + 500 yuan subsidy = 17,500 yuan ~21500 yuan. According to the National Business Daily reported that according to the tradition, Apple launched a new phone in September every year, so the middle of each year is a key time for the new iPhone. At present, the huge Apple supply chain ushered in the annual "Apple season", especially for contract manufacturing giant Foxconn. On August 8, the salary reported by the recruitment agency of Foxconn Zhengzhou Science Park was increased compared with what the reporter learned on July 26, and the hourly wage was increased by 2 yuan to 26 yuan. For the media reports of "50,000 people pouring into Foxconn", the intermediary said that the people who interview for the job every day are basically waiting in a long line. So why is Foxconn hiring so many workers? "Mass production of the iPhone16 is imminent," the agency said. "Basically 90 percent of [people who] sign up for interviews pass. Just looking for infectious diseases, tattoos, priors, smoke scars. But if you have a smaller or inconspicuous tattoo, you can get in. The requirements are not so strict." Intermediary sources said. The agency also revealed: "The entry is mainly to do Apple mobile phone parts assembly, do not do other, after the entry of the post in the early stage are random points." According to another report, in January 2023, the Henan provincial government's official website reprinted a report showing that Foxconn's imports and exports accounted for about 60% of the province's total imports and exports, and 80% of Zhengzhou's total imports and exports. In January 2023, the relevant person in charge of the Comprehensive Free Trade Zone and port Service Bureau of Zhengzhou Aviation Port Area introduced that the production capacity of Foxconn mobile phones at that time rose to 500,000 units per day, which was basically the same as the same period in 2022, and the total import and export volume for the year was more than 460 billion yuan.

With the miniaturization and precision of electronic products, surface mount technology (SMT) is more and more widely used in electronic manufacturing industry. In SMT process, the amount of solder paste directly affects the quality and reliability of solder joints. In some specific cases, in order to meet specific welding requirements, we need to increase the amount of solder paste or solder in a local area. In some cases, it is necessary to increase the amount of solder paste or solder locally, the following are some common reasons: heat dissipation: For components with large heat output, increasing the amount of solder helps to improve the efficiency of heat transfer. Mechanical strength: In the parts subjected to mechanical stress, increasing the amount of solder can form a stronger solder joint. Compensation for dimensional deviations: Due to deviations in component pin and PCB pad sizes, more solder may be required to ensure the reliability of the connection. The following are some methods for locally increasing the amount of solder paste or solder in the SMT process: 1. Adjusting the opening size of the steel mesh By adjusting the opening size of the steel mesh, you can directly control the amount of solder paste deposition. Enlarge the opening: Enlarge the opening size of the steel mesh corresponding to the pad that requires more solder, thereby increasing the amount of solder paste deposition. Use special shape openings: trapezoidal or racetrack openings allow more solder paste to be deposited on the edge of the pad. Advantages: simple, low cost, no need to change the existing process. Disadvantages: If the operation is improper, it may affect the printing quality; Limited to the minimum feature size of the steel mesh. 2. Multiple printing The same PCB is printed multiple times to increase the amount of solder paste deposition. Advantages: The amount of extra solder can be precisely controlled; Suitable for specific areas where more solder is needed. Disadvantages: increase production time and cost; If the alignment is not accurate, it may cause printing problems. 3. Use the solder preform before reflow welding, place the solder preform on the PCB pad. Advantages: The amount of solder can be precisely controlled; Suitable for applications requiring large amounts of solder. Disadvantages: Manual placement is costly and time-consuming; Automated placement may require additional process steps. 4. Solder dip or wave soldering for through-hole components or specific pads, solder dip or wave welding can be used to increase the amount of solder. Advantages: Quickly and effectively add a large amount of solder; Suitable for adjustment after reflow welding. Disadvantages: Not applicable to all SMT applications; If not properly controlled, it may result in solder bridging. 5. Adjust the metal content and rheological properties of the solder paste Using higher metal content or different rheological properties of the solder paste, you can achieve a higher amount of solder after reflux. Advantages: Can be applied to the whole board or selective area; There is no need to change the steel mesh design. Disadvantages: May affect reflux curve and overall process; Requires the use of special solder paste, increase the cost. The decision to locally increase the amount of solder paste or solder in the SMT process should be carefully considered, balancing its advantages and potential drawbacks. Each method has its own applicable scenarios and often requires a combination of methods to achieve the goal. Engineers evaluate the specific requirements of the assembly process, component characteristics, and the impact on production efficiency and cost.  

Married women can't build iphones? Foxconn responds! During a visit to Foxconn's factory in Chennai, India, on Saturday, Foxconn Chairman Liu Yangwei spoke out about the company's alleged refusal to allow married women to assemble iphones. Earlier, foreign media "exposure" Foxconn recruitment refused married women to work in iPhone assembly, the incident caused public concern in the local, the Indian government has ordered an investigation. According to the report, Liu Yangwei said on the same day, "Foxconn's recruitment does not distinguish between genders, and female employees occupy a large proportion here," and "I want to stress that married women have made great contributions to everything we do here." Foxconn acknowledged some omissions in its 2022 hiring process and said it had taken steps to address them, but said it "strongly refutes allegations of employment discrimination." An investigation by the media outlet in June found that Foxconn's main iPhone assembly plant in India systematically excluded married women because they were believed to have more domestic responsibilities than unmarried women. Foxconn's hiring practices have sparked television debates and newspaper editorials. The federal government led by Prime Minister Narendra Modi has ordered Tamil Nadu to provide a detailed report on the matter. Officials from India's labor ministry also went to the iPhone factory to question executives. So far, New Delhi has not released any findings. It has emerged that Foxconn is moving some production back to China from India and Vietnam, and Apple has already moved some production back to domestic contract factories this year. Apple's new phones, the iPhone16 series, will still be assembled in China. In early August, as the iPhone16 series products entered the critical period of stocking, Foxconn began to raise wages and conduct large-scale recruitment in core manufacturing bases such as Zhengzhou and Shenzhen. Since August 3, Zhengzhou Foxconn recruitment public number "Zhengzhou Fu Trade Union recruitment" continued to release the "highest price of the year" recruitment information, saying that "this year's peak season recruitment began in July, so the end will be earlier", the current wage has reached the highest in the year.  

Leading precision components and SMT accessories suppliers. GS-SMT LTD announced the expansion of the NPM SMT chip mounter feeder series. The new high-speed head from Panasonic has increased productivity compared to previous models. GS-SMT LTDfeeders allow this chip mounter to provide higher reliability and performance on the Panasonic NPM platform   On each machine, the Panasonic NPM interchangeable head supports almost all surface mount component types. And to achieve high-speed chip components and special-shaped component placement. EachGS-SMT LTDfeeder has original data and tests. Easy to identify users and machine software.   GS-SMT LTD offer all standard feeders for the following NPM mounters: -12 / 16MM -24 / 32MM -44 / 56MM -72MM -88MM -104MM        We can also provide custom design feeders for OEMs based on customer and application specific requirements.As well as special feeder design for special-shaped components (LEDs, connectors, pins, clamps, fixtures, etc.)For your automated custom component process,We have the ability to make the feeder fit for your application.   All SMT feeders and consumables are guaranteed to work properly with the original equipment.Each of our products produced by our company has a 100% satisfaction  

Leading precision components and SMT accessories suppliers. GS-SMT LTD announced the expansion of the FUJI NXT H24 SMT chip mounter nozzle series. The new high-speed head from Fuji has increased productivity compared to previous models. GS-SMT LTD standard nozzles allow this chip mounter to provide higher reliability and performance on the Fuji NXT III platform. On each machine, the Fuji NXT interchangeable head supports almost all surface mount component types. And to achieve high-speed chip components and special-shaped component placement. EachGS-SMT LTD Fuji NXT nozzle has both raw data two-dimensional code and OEM color two-dimensional code for user and machine software to identify the nozzle. We offer all standard sizes of suction nozzles for the following Fuji NXT mounter. - H01 - 36mm disc (1.0mm - 20.0mm; including standard and MELF) - H04 - 19mm disc (1.0mm - 15.0mm; including ceramic, standard and MELF) - H08 / H12 - 9mm disc (0.3mm - 5.0mm; including ceramic, standard and MELF) - H24 - 4.7mm disc (0.3mm - 2.5mm ceramic nozzle) - H08M & H04S is also available on request          We can also provide custom design nozzles for OEMs based on customer and application specific requirements.As well as special nozzle design for special-shaped components (LEDs, connectors, pins, clamps, fixtures, etc.)For your automated custom component process,We have the ability to make the nozzle fit for your application.   All SMT nozzles and consumables are guaranteed to work properly with the original equipment.Each of our products produced by our company has a 100% satisfaction  

Leading precision components and SMT accessories suppliers. GS-SMT LTD announced the expansion of the new Hitachi G5S / F8S SMT chip mounter nozzle series. Hitachi's new high-speed head increases productivity compared to previous models.Our company's standard nozzle allows this chip mounter to provide higher reliability and performance on the SIGAMA platform.   Hitachi G5S / F8S can be mounted almost all 03015-44MM surface mount component type.And to achieve high-speed chip components and special-shaped component placement.EachGS-SMT LTDmulti-purpose nozzle has a raw data nozzle model for user and machine software to identify the nozzle. Our company offers all standard size nozzles for the following Hitachi G5S / F8S. - HG22C - HG33C - HG52C - HG82C - HB03C - HV03C - HA04C & HA09C Can also be provided on demand.    We can also provide custom design nozzles for OEMs based on customer and application specific requirements.As well as special nozzle design for special-shaped components (LEDs, connectors, pins, clamps, fixtures, etc.)For your automated custom component process,We have the ability to make the nozzle fit for your application.   All SMT nozzles and consumables are guaranteed to work properly with the original equipment.Each of our products produced by our company has a 100% satisfaction guarantee.If any customer is dissatisfied with the performance or quality of the product, we will replace or provide a full refund. www.gs-smt.com.

GS-SMT LTD will attend Nepcon Vienam 2018 . Our stand is P18, wellcome to visit our stand during 2018-10-11~2018-10-13 .