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What is the significance of SMT first tester for enterprises In today's society, all kinds of electrical appliances are filled in all aspects of our lives, and people are increasingly relying on these electronic products, especially digital products and smart phones, which are a typical example. The production of these products cannot be separated from the core component - the circuit board. Because the demand for electrical appliances continues to rise, the production of PCB SMT electronics factory also continues to increase. The increase of production enterprises will inevitably bring greater competitive pressure, and only in the hands of many competitors, can enterprises survive and grow. In today's increasing competition, the rapid development of an enterprise cannot be separated from efficient work efficiency, that is, the work efficiency of employees can not be ignored. And an important factor that affects the work efficiency of employees is the quality of equipment. This requires enterprises to pay a certain cost to buy equipment. For example, the emerging SMT first tester, many companies do not think there is a need to buy, because only manual can complete the work, and then pay an additional cost is not cost-effective. However, as long as you understand this product in detail, you can know that the benefits that SMT intelligent first part tester can bring to the enterprise are in all aspects.   smt first tester company   First, the SMT first tester only needs one inspector to operate, the enterprise saves labor costs, and the operation of the SMT first tester is not complicated, and the inspector can quickly get familiar with it; Second, the speed of the first detection is improved, and the average detection of a component can be 3 seconds, further speeding up the production progress; Third, the high accuracy of the first detection can find the problem as early as possible, so as to solve the problem; Fourthly, the detection report is automatically generated, and the report is paperless to avoid accidents in data preservation. At the same time, standardized reports can bring better reading experience and enhance customers' impression of enterprise management; Fifth, the first detector can be connected with the enterprise's current ERP or MES system. In traditional SMT first detection, inspectors are often only equipped with multimeters, capacitance meters, magnifying glasses, and such simple equipment can be used in the case of fewer components, but once there are slightly more components, because of the limitations of the equipment, the energy of the staff is limited, and the difficulty of detection increases sharply. In the case of increased difficulty, the increase in detection time and error rate is inevitable. Under the current flow operation mode, the abnormal occurrence of the first detection will inevitably affect the operation of the entire production line. Especially in the case of frequent wire change, each change must be carried out a first piece detection, at this time the detection efficiency will more affect the production. There are many defects in the traditional manual SMT first detection, and the following detection report is a headache, and the manual report format is chaotic and data errors often occur. The first piece of detector will not appear such a situation, the system automatically collects test data to avoid various errors that occur when manual recording. After the test is completed, the system automatically generates the report, and can export the report in Excle format, which is very convenient for audit.

SMT basic process components include: screen printing (or dispensing), mounting (curing), reflow welding, cleaning, testing, repair. 1. Screen printing: Its role is to leak the solder paste or patch glue onto the solder pad of the PCB to prepare for the welding of components. The equipment used is a screen printing machine (screen printing machine), located at the forefront of the SMT production line. 2, dispensing: it is the glue drops to the fixed position of the PCB, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment. 3, mounting: Its role is to accurately install the surface assembly components to the fixed position of the PCB. The equipment used is the SMT machine, which is located behind the screen printing machine in the SMT production line. 4, curing: its role is to melt the patch glue, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing furnace, which is located behind the SMT machine in the SMT production line. 5, reflow welding: its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is a reflow furnace, which is located behind the SMT machine in the SMT line. 6. Cleaning: Its role is to remove welding residues such as flux that are harmful to the human body on the assembled PCB. The equipment used is a cleaning machine, the position can not be fixed, can be online, or not online. 7, detection: its role is to assemble the PCB board welding quality and assembly quality detection. The equipment used includes magnifying glass, microscope, on-line tester (ICT), flying needle tester, automatic Optical inspection (AOI), X-RAY inspection system, function tester, etc. Location According to the need of detection, it can be configured in the appropriate place of the production line. 8, repair: its role is to detect the failure of the PCB board rework. The tools used are soldering iron, repair workstation, etc. Configures anywhere in the production line.

What external environmental factors will affect the first SMT tester As a high-precision precision instrument, any small external factors may bring measurement accuracy errors, then which external factors have a greater impact on the instrument, should be understood and paid attention to? The following Xiaobian to give you a detailed introduction. 1. Ambient temperature As we all know, temperature is the main factor in the measurement accuracy of the first tester, because the first tester is a precision instrument, so some of the production materials will be affected by thermal expansion and contraction, such as grating ruler, marble and other parts. Generally, there are strict requirements for the measurement of temperature, and the temperature is generally floating two degrees above and below 20 ° C, and there will be some changes in the accuracy beyond this range. Therefore, the machine room using the first tester must be equipped with air conditioning, and pay attention to the use of air conditioning. An air conditioner should be able to turn on 24 hours, otherwise try to ensure that it is on within 8 hours of work; Second, ensure that the first tester is used under constant temperature conditions, and then measure after the temperature of the machine room is stable; Three air conditioning mouth do not blow against the instrument. Second, environmental humidity Many companies may not pay attention to the impact of humidity on the first tester, because the instrument has a large range of acceptable humidity, and the general humidity can be between 45% and 75%. However, it should be noted that many parts of precision instruments are easy to rust, and once rust will greatly cause precision error. Therefore, pay attention to air humidity control and try to keep the equipment in a more suitable humidity environment. Pay attention especially during the rainy season or in areas that are already wet.   Production of SMT first tester 3. Environmental vibration Vibration is a common problem for the first tester, and it is difficult to avoid air compressors, presses and other heavy equipment with large vibrations. Attention should be paid to controlling the distance between these vibration sources and the first tester. There are also some small amplitude vibration sources that need attention, and if the small amplitude is close to the vibration frequency of the first tester, it is a very serious problem. However, enterprises generally install shockproof equipment on the first tester, so as to reduce the interference of vibration on the first tester and improve the measurement accuracy. 4. Environmental health The first tester this precision instrument has high environmental health requirements, if the health is poor, dust and dirty things will be left on the first tester and measurement workpiece, which will lead to measurement errors. Especially in the working machine room there are some oil, coolant, etc., be careful not to let these liquids stick to the workpiece. Usually pay attention to cleaning the machine room health, in and out of the personnel should also pay attention to health, to wear clean clothes, in and out to change shoes, reduce the outside dust oil stains into the machine room. 5. Other external factors There are also many external factors that may affect the measurement accuracy of the first tester, such as the power supply voltage, etc., the first tester needs a stable voltage when working, and the general enterprise will install equipment to control the voltage, similar to a regulator to control the voltage. The above content is the introduction of what external environmental factors affect the first tester, the first tester is based on the CCD digital image, relying on the computer screen measurement technology and the powerful software ability of space geometry. After the computer is installed with the special control and graphic measurement software, it becomes the measurement brain with the software soul, which is the main body of the whole device. Efficiency Technology SMT intelligent first detector is a high-tech product independently developed and designed by Efficiency Technology company with independent intellectual property rights. It is an innovative solution for SMT first part confirmation to achieve efficiency reduction.

1. Wave soldering is to dissolve the tin strip into a liquid state through the tin tank, and use the motor to stir to form a wave peak, so that the PCB and the parts are welded together, which is generally used for the welding of the hand plug-in and the SMT glue board. Reflow welding is mainly used in the SMT industry, which melts and welds the solder paste printed on the PCB through hot air or other thermal radiation conduction. 2. Different processes: wave soldering should first spray flux, and then go through preheating, welding, and cooling zone. Reflow welding through preheating zone, reflow zone, cooling zone. In addition, wave soldering is suitable for hand insert board and dispensing board, and all components are required to be heat-resistant, over the crest surface can not have the SMT solder paste components, SMT solder paste board can only be reflow soldering, can not use wave soldering.   Let's explain it in the simplest way possible Reflow soldering: Mechanical and electrical connections between surface-attached component terminals or pins and printed circuit board pads are achieved by remelting paste paste pre-allocated to the printed circuit board pads. It is a step in SMT (Surface Mount Technology). Wave soldering: wave soldering is a kind of automatic soldering equipment through high temperature heating to weld plug-in components, from the function, wave welding is divided into lead wave welding, lead-free wave welding and nitrogen wave welding, from the structure, a wave welding is divided into spray, preheating, tin furnace, cooling four parts.

Daily, weekly and monthly maintenance of reflow soldering Reflow daily maintenance content: (1) Check whether there is grease in the transmission chain, and add grease in time if necessary. (2) Check that there is no running edge in the transport network, and notify HB in time if there is running edge. (3) Check the reflow furnace inlet mesh belt drive wheel is not shifted, if there is a shift can be adjusted by loosening the screw - adjusting - locking the screw step. (4) Check whether the net belt drive roller at the outlet of reflow furnace is loose, if it is loose, it can be adjusted according to the steps of loosening the screws - adjusting - locking screws. (5) Check whether the high temperature oil in the oil cup is appropriate, the oil surface should be 5mm from the mouth of the cup, if necessary, add high temperature oil in time. Reflow maintenance content: (1) Check the surface of the transport network belt for dirt adhesion, if there is loot adhesion in time with alcohol scrub. (2) Check the guide rail chain groove for foreign bodies, if there are foreign bodies in time to remove the chain with alcohol scrub. (3) Check whether the bearings of the driven gear of the transport chain are flexible, and add lubricating oil in time when necessary. (5) Check whether there is grease on the surface of the lead rod of the head component and no foreign matter, wipe it clean in time when necessary, and add grease. (6) Check whether there is FLUX and dust on the rectifier plate in each area of the furnace, and clean it with alcohol in time if there is dust. (7) Check whether the lifting motor of the furnace lifting system is running without vibration and noise, if there is vibration or noise, it should be replaced in time (8) Check whether the filter of the exhaust device is blocked, if there is blockage, alcohol should be used to clean. (9) Check whether there is FLUX adsorption on the rectifier plate in the cooling area of the cooling system. If there is FLUX, it should be cleaned with alcohol in time. (10) Check that the surface of the photoelectric switch at the transport entrance has dust-free accumulation. If there is dust accumulation, it should be wiped clean with a soft dry rag in time. (11) Check whether the surface of the PC and UPS is clean. If there is dust accumulation, it should be wiped with a soft dry cloth in time. Monthly maintenance contents of reflow welding: (1) Check whether there is vibration and noise in the transportation process, and notify HB in time if necessary. (2) Check whether the transport motor fixing screw is loose, if it is loose, lock the screw. (3) Check whether the tension of the transmission chain is appropriate, and adjust the motor positioning screw in time if necessary. (4) Check whether there is coke and black powder on the transport chain, if there is, it should be removed in time and cleaned with diesel oil. (5) Check the positioning of the synchronous shaft of the width adjustment in the track of the active end, and whether the fixed block is loose. If it is loose, it should be locked in time. (6) Check whether the hot air motor positioning screw is loose, if loose, it should be locked in time. (7) Check whether there is dust and foreign matter in the control box of the electrical system. If there is foreign matter, blow out dust and foreign matter with the same pressure air after power off.

Wave soldering refers to the melting of soft brazing material (lead-tin alloy), through the electric pump or electromagnetic pump jet into the design requirements of the solder crest, can also be formed by injecting nitrogen into the solder pool, so that the printed board pre-equipped with components through the solder crest, to achieve the mechanical and electrical connection between the component welding end or pin and the printed board welding pad. Wave soldering process: Insert the component into the corresponding component hole → pre-apply flux → preheat (temperature 90-100℃, length 1-1.2m) → Wave soldering (220-240℃) cooling → remove excess pin → Check.   Wave soldering with the enhancement of people's awareness of environmental protection has a new welding process. In the past, tin-lead alloy was used, but lead is a heavy metal that has great harm to the human body. Therefore, the lead-free process is promoted, the use of * tin silver copper alloy * and special flux, and the welding temperature requires higher preheating temperature. In most of the products that do not require miniaturization and high power are still using perforated (TH) or mixed technology circuit boards, such as televisions, home audio and video equipment and digital set-top boxes, are still using perforated components, so the need for wave soldering. From a process point of view, wave soldering machines can only provide a few of the most basic equipment operating parameters adjustment.

Many people are not familiar with reflow welding, because they have not operated or seen it, the concept of reflow welding is very vague, then what is reflow welding?   Reflow is the soldering of mechanical and electrical connections between the solder ends or pins of surface-assembled components and the printed board solder pad by remelting the paste solder preallocated to the printed board pad. Reflow welding is to weld the components to the PCB board, and reflow welding is to mount the devices on the surface. Reflow welding is based on the action of hot gas flow on the solder joint. The gel flux reacts physically under certain high temperature air flow to achieve SMD welding. The reason why it is called "reflow welding" is because the gas circulates in the welding machine to produce high temperature to achieve the purpose of welding. Reflow technology is not new in the field of electronics manufacturing. The components on the various boards used in our computers are welded to the circuit board through this process. This device has a heating circuit inside the device, and the air or nitrogen is heated to a high enough temperature to blow to the board that has been attached to the components, so that the solder on both sides of the components is melted and bonded to the motherboard. The advantages of this process are that the temperature is easy to control, oxidation can be avoided during welding, and manufacturing costs are easier to control. There are several categories of reflow welding: hot plate conduction reflow, infrared reflow, gas phase reflow, hot air reflow, infrared + hot air reflow, hot wire reflow, hot gas reflow, laser reflow, beam reflow, induction reflow, polyinfrared reflow, table reflow, vertical reflow, nitrogen reflow.

Golden snake, happy Spring Festival! Global Soul Limited holiday notice Global Soul Limited users, partners, friends: The Spring Festival is approaching, thank you for your support and companionship for Global Soul Limited! Spring Festival holiday, the company will be closed from January 26, 2024 (27th of the twelfth month) to February 4, 2024 (7th of the first month), and February 5, (8th of the first month). Global Soul Limited wishes you all a happy and auspicious New Year of the Snake!

What is SMT? A SMT is Surface assembly Technology (short for Surface Mounted Technology), is the most popular technology and process in the electronic assembly industry. It compresses traditional electronic components into only a few tens of the volume of the device, thus realizing the assembly of electronic products of high density, high reliability, miniaturization, low cost, and production automation. This miniaturized component is called: SMY device (or SMC, chip device). The process of assembling components onto a print (or other substrate) is called the SMT process. The associated assembly equipment is called SMT equipment. At present, advanced electronic products, especially in computers and communication electronic products, have widely adopted SMT technology. The international output of SMD devices has increased year by year, while the output of traditional devices has decreased year by year, so with the passage of SMT technology will become more and more popular. SMT features: 1, high assembly density, small size of electronic products, light weight, the size and weight of the patch components is only about 1/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products reduced by 40% to 60%, the weight reduced by 60% to 80%. 2, high reliability, strong vibration resistance. Low defect rate of solder joint. 3, good high-frequency characteristics. Reduced electromagnetic and radio frequency interference. 4, easy to achieve automation, improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc. Why use Surface Mount Technology (SMT)? 1, the pursuit of miniaturization of electronic products, previously used perforated plug-in components have been unable to shrink 2, electronic products function more complete, the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ics, have to use surface patch components. 3, product mass, production automation, the factory to low cost and high output, produce quality products to meet customer needs and strengthen market competitiveness 4, the development of electronic components, integrated circuit (IC) development, semiconductor materials of multiple applications 5, electronic technology revolution is imperative, chasing the international trend. What are the features of QSMT? A High assembly density, small size and light weight of electronic products, the volume and weight of the patch components are only about 1/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%. High reliability and strong vibration resistance. Low defect rate of solder joint. Good high frequency characteristics. Reduced electromagnetic and radio frequency interference. Easy to automate and improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc. Q Why use SMT A Electronic products pursue miniaturization, and previously used perforated plug-in components can no longer be reduced The function of electronic products is more complete, and the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ics, and surface patch components have to be used Product mass, production automation, manufacturers to low cost and high output, produce high-quality products to meet customer needs and strengthen market competitiveness Development of electronic components, development of integrated circuits (ics), multiple applications of semiconductor materials The revolution of electronic science and technology is imperative, and the pursuit of international trends Q Why use lead-free process A Lead is a toxic heavy metal, excessive absorption of lead by the human body will cause poisoning, intake of low amounts of lead may have an impact on human intelligence, nervous system and reproductive system, the global electronic assembly industry consumes about 60,000 tons of solder every year, and is increasing year by year, the resulting lead-salt industrial slag seriously polluted the environment. Therefore, reducing the use of lead has become the focus of worldwide attention, many large companies in Europe and Japan are vigorously accelerating the development of lead-free alternative alloys, and have planned to gradually reduce the use of lead in the assembly of electronic products in 2002. It will be completely eliminated by 2004. (The traditional solder composition of 63Sn/37Pb, in the current electronic assembly industry, lead is widely used). Q What are the requirements for lead-free alternatives A 1, price: Many manufacturers require that the price cannot be higher than 63Sn/37Pn, but at present, the finished products of lead-free alternatives are 35% higher than 63Sn/37Pb. 2, the melting point: most manufacturers require a minimum solid phase temperature of 150 ° C to meet the working requirements of electronic equipment. The liquid phase temperature depends on the application. Electrode for wave soldering: For successful wave soldering, the liquid phase temperature should be below 265 ° C. Solder wire for manual welding: liquid phase temperature should be lower than the working temperature of the soldering iron 345℃. Solder paste: liquid phase temperature should be lower than 250℃. 3. Electrical conductivity. 4, good thermal conductivity. 5, small solid-liquid coexistence range: most experts recommend that this temperature range be controlled within 10 ° C, in order to form a good solder joint, if the alloy solidification range is too wide, it is possible to crack the solder joint, so that electronic products premature damage. 6, low toxicity: the alloy composition must be non-toxic. 7, with good wettability. 8, good physical properties (strength, tensile, fatigue) : the alloy must be able to provide the strength and reliability that Sn63/Pb37 can achieve, and there will be no protruding fillet welds on the passing device. 9, the production of repeatability, solder joint consistency: because the electronic assembly process is a mass manufacturing process, requires its repeatability and consistency to maintain a high level, if some alloy components can not be repeated in mass conditions, or its melting point in mass production due to changes in the composition of the larger changes, it can not be considered. 10, solder joint appearance: solder joint appearance should be close to the appearance of tin/lead solder. 11. Supply ability. 12, compatibility with lead: due to the short term will not immediately be fully transformed into a lead-free system, so lead may still be used on the PCB pad and component terminals, such as mixing such as drilling in the solder, may make the melting point of the solder alloy drop very low, the strength is greatly reduced.

According to the latest forecast data released by market research firm Gartner, the total global semiconductor revenue in 2024 will be $626 billion, an increase of 18.1%. Among the top 10 semiconductor manufacturers in the world in 2024, Samsung, Intel and Nvidia rank the top three. At the same time, Gartner expects that, driven by the demand for AI, total global semiconductor revenue will increase by 12.6% year-on-year to reach $705 billion in 2025. While this forecast is lower than Future Horizons' 15 percent forecast, it is higher than the World Semiconductor Trade Organization's 11.2 percent estimate and Semiconductor Intelligence's 6 percent estimate. "Graphics processing units (Gpus) and AI processors used in data center applications (servers and accelerator cards) are key drivers for the chip industry in 2024," said George Brocklehurst, vice president analyst at Gartner. "The growing demand for artificial intelligence and Generative Artificial Intelligence (GenAI) workloads has led to data centers becoming the second largest semiconductor market after smartphones in 2024. Data center semiconductor revenue totaled $112 billion in 2024, up from $64.8 billion in 2023." Looking at specific vendor performance, only eight of the top 25 semiconductor suppliers by revenue in 2024 experienced a decline in semiconductor revenue, while 11 suppliers achieved double-digit percentage growth. Among the top 10 manufacturers, only Infineon's semiconductor revenue declined year-on-year, and the rest achieved year-on-year growth. ● Samsung Electronics' semiconductor revenue in 2024 is expected to be $66.5 billion, up 62.5% year on year, mainly due to the growth in demand for memory chips and a strong rebound in prices, successfully helping Samsung Electronics regain the top position from Intel and extend its lead over the company. Samsung Electronics' financial report also shows that in 2024, Samsung Electronics' DS division, which is mainly engaged in semiconductor business including memory and wafer foundry, generated annual revenue of 111.1 trillion won, an increase of 67%. Samsung also attributed the increase to higher average selling prices of DRAM and increased sales of HBM and high-density DDR5. Its HBM3E products have already been mass-produced and sold in the third quarter of 2024, and in the fourth quarter of 2024, HBM3E has been supplied to several GPU vendors and data center vendors, and sales have exceeded HBM3. HBM sales for the full fourth quarter were up 190% sequentially, but this was still lower than previously expected. "The 16-layer HBM3E is in the phase of customer sample delivery, and the sixth generation HBM4 is expected to be mass-produced in the second half of 2025," a Samsung official said. Intel's 2024 semiconductor revenue is expected to be $49.189 billion, up only 0.1% year over year, ranking second in the world. While the AI PC market and its Core Ultra chipset appear to be seeing decent growth, its AI accelerator products and overall x86 business are doing so-so. Intel's latest earnings report shows that its overall revenue in the 2024 fiscal year was $53.1 billion, down 2% from the same period last year. After the outbreak of Intel's financial crisis in September 2024, Intel announced that it would reduce its global workforce by 15%, cut capital expenditures (by $10 billion in capital expenditures by 2025), and suspend the construction of factories in Germany and Poland. Although Intel's performance has improved in the next two quarters, it is still not optimistic. Looking at full-year 2024 performance by segment, its customer computing group revenue increased only 3.5% year-over-year to $30.29 billion, and data center and Artificial intelligence (AI) group revenue increased only 1.4% year-over-year to $12.817 billion. In contrast, Nvidia, AMD and other chip manufacturers have benefited from the growth of AI demand, and their AI business revenue has a high double-digit percentage increase. Nvidia's 2024 semiconductor revenue jumped 84% year over year to $46 billion. Due to the strong demand for its AI chips, it moved up two places in the ranking, ranking third globally. According to Nvidia's previously announced financial results for the third quarter of fiscal year 2025 ending on October 27, 2024, revenue for the quarter reached $35.1 billion, up 94% year-on-year and up 17% sequentially. For the fourth quarter, Nvidia expects revenue of $37.5 billion, plus or minus 2 percent, up 70 percent sequentially from the third quarter. SK Hynix semiconductor revenue in 2024 is expected to reach $42.824 billion, up 86% year-on-year, and its ranking has also risen two places to fourth in the world. SK Hynix's growth was mainly due to strong growth in its High bandwidth (HBM) business. SK Hynix's latest financial report shows that its revenue in 2024 was 66.1930 trillion won, up 102% year-on-year, a new high in revenue over the past year, and its operating profit exceeded the performance of the ultra-prosperous memory chip market in 2018. SK Hynix also announced that it achieved its highest annual performance thanks to industry-leading HBM technology strength and profitable business activities amid strong demand for semiconductor memory for AI. Among them, HBM, which showed a high growth trend in the fourth quarter of 2024, accounted for more than 40% of the entire DRAM sales (30% in the third quarter), and enterprise solid state drive (eSSD) sales continued to increase. The company has established a stable financial position based on profitable operations based on the competitiveness of differentiated products, thus continuing to maintain the trend of performance improvement. Qualcomm's 2024 semiconductor revenue was $32.358 billion, up 10.7% year-over-year and dropping two places to fifth. Although Qualcomm's revenue growth is much lower than Samsung, Nvidia, SK Hynix and other leading manufacturers, but thanks to the help of its Snapdragon 8 extreme mobile platform, its revenue growth is still better than the growth of the smartphone market (market research agency Canalys data show that the global smartphone market in 2024 strong rebound shipments reached 1.22 billion units, Year-on-year growth of 7%). However, Qualcomm's energy-consuming Snapdragon X series platform for the PC market is not successful, data show that Qualcomm Snapdragon X series PC only shipped 720,000 units in the third quarter, with a market share of only 0.8%. According to Qualcomm's financial report for the fiscal year 2024, which ended on September 29, 2024, Qualcomm's revenue for the fiscal year was $38.962 billion, an increase of 9% compared to $35.82 billion in the previous fiscal year. In terms of revenue sources, 46% came from customers based in China. Driven by the Snapdragon 8 Extreme mobile platform, Qualcomm expects revenue for the first quarter of fiscal 2025 (equivalent to the fourth quarter of Natural year 2024) to be between $10.5 billion and $11.3 billion, with a median of $10.9 billion, higher than the average market analyst estimate of $10.54 billion. Micron's semiconductor revenue in 2024 is expected to be $27.843 billion, up 72.7% year on year, and moving up six places to sixth. The growth of Micron's revenue and ranking is also mainly due to the strong demand for HBM in the AI market. According to Micron's financial report for the fiscal year 2024, which ended on August 29, 2024, its revenue for the fiscal year 2024 reached $25.111 billion, a year-on-year increase of 61.59%. Micron pointed out that as one of Micron's highest margin products, its HBM revenue for AI data processing has maintained strong growth. Its data center business, where HBM is located, achieved record annual revenue in fiscal year 2024 and will grow significantly in fiscal year 2025. This year and next year, Micron's HBM production capacity has been sold out, and during this period, Micron has also finalized HBM order prices for this year and next year with customers. The subsequent Micron 2025 fiscal year first quarter (as of November 28, 2024) earnings report showed that the fiscal quarter revenue was $8.709 billion, close to the average analyst expectation of $8.71 billion, an increase of 84.1% year on year, an increase of 12.4% quarter on quarter, a record high. While first-quarter results were indeed weighed down by DRAM inventory overhang in end-markets such as smartphones and PCS, they were offset by a 400% explosion in the data center business, driven by cloud server DRAM demand and HBM revenue growth. Although the HBM market is currently dominated by SK Hynix, this year, Micron's HBM3E entered Nvidia's H200 artificial intelligence chip and the newly developed strongest Blackwell system, which will greatly stimulate Micron's HBM revenue growth. Micron CEO has previously predicted that the global market size of HBM chips will increase to about $25 billion in 2025, significantly higher than the $4 billion in 2023, which will also boost the memory chip market size to jump to $204 billion in 2025. In the first quarter earnings call, Micron's CEO has increased the HBM market size to $30 billion in 2025. Broadcom's 2024 semiconductor revenue is expected to be $27.841 billion, up 7.9% year over year, but it will slip three places to seventh. Broadcom's revenue for fiscal year 2024, which ended November 3, 2024, was approximately $51.6 billion, an increase of 44% year-over-year and a record high. But that revenue growth was largely due to the acquisition of VMware, which combined the two companies' revenues. Hock Tan, President and CEO of Broadcom, also explained, "Broadcom's revenue for fiscal year 2024 increased 44% year-over-year to a record $51.6 billion, as infrastructure software revenue grew to $21.5 billion." "However, driven by AI's demand for custom chips, Broadcom's semiconductor revenue also reached a record $30.1 billion in fiscal year 2024, including $12.2 billion in AI revenue, up 220% year-over-year, driven by our leading AI XPU and Ethernet networking portfolio." AMD's 2024 semiconductor revenue is expected to be $23.948 billion, up 7.4% year-over-year and slipping one place to eighth. According to AMD's fiscal year 2024 financial report released on February 4, 2025 local time, the fiscal year revenue reached a record $25.8 billion, an increase of 14%. Benefiting from the strong demand in the AI market, AMD's data center division's revenue reached a new high of $12.6 billion in 2024, up 94% from the same period last year. In addition, its PC chip client segment revenue in 2024 also reached a new high of $2.3 billion, up 58% year on year. But the games division saw revenue plunge 58% to $2.6 billion due to a decline in semi-custom revenue. Embedded segment revenue in 2024 also plunged 33% year-over-year to $3.6 billion, primarily due to normalization of inventory levels as customers clear inventory. Apple's 2024 semiconductor revenue is expected to be $18.88 billion, up 4.6% year over year and up 1 place to ninth. Apple's financial results for the fiscal year 2024, which ended on September 28, showed that its revenue for the fiscal year increased only 2% to $391 billion due to slowing demand in the smartphone and PC markets. The latest financial report for the first quarter of the fiscal year 2025 (the fourth quarter of 2024) shows that Apple's revenue for the quarter increased 4% year-on-year to $124.3 billion, a record high, and better than analysts' expectations of $124.1 billion. Revenue from its core iPhone business edged down 0.9% year-over-year, but it still generated $69.138 billion. Mac revenue increased 15.5 percent to $8.987 billion. iPad revenue also increased 15.2% year-over-year to $8.088 billion. At present, Apple's iPhone/Mac/iPad product line is basically using its own processors. ● Infineon's 2024 semiconductor revenue is expected to be $16.01 billion, down 6% year on year and down one place to 10th. According to Infineon's financial results for the fiscal year 2024 to the end of September 2024, Infineon's revenue for the fiscal year decreased by 8% to 14.955 billion euros, a year-on-year decrease of 8%. Infineon CEO Jochen Hanebeck also said in a statement at the time: "Currently, with the exception of artificial intelligence, our end markets have virtually no growth drivers and cyclical recovery is being delayed." As a result, we are preparing for a lower business trajectory in 2025." However, Infineon's financial report for the first quarter of the fiscal year 2025 ending December 31, 2024, announced on February 4, 2025 local time, showed that the revenue of the fiscal quarter was 3.424 billion euros, down 13% year-on-year. This was mainly due to weaker demand in four segments: Automotive (ATV), Green Industrial Power (GIP), Power and Sensor Systems (PSS), and Connected Security Systems (CSS). However, the overall results were still better than market expectations, and as a result, Infineon revised its revenue for fiscal year 2025 from "slightly down" to "flat or slightly up" for now. HBM has become the growth engine of the head memory manufacturers, and will account for 19.2% of the overall DRAM revenue in 2025, Gartner data also shows that in 2024, global memory chip revenue soared 71.8% year-on-year, making the share of memory chips in total semiconductor sales increased to 25.2%. In contrast, in 2024, semiconductor revenue outside of storage only grew by 6.9% year-over-year, of which DRAM revenue grew by 75.4% in 2024 and NAND revenue grew by 75.7% year-over-year. HBM's revenue growth contributed significantly to the DRAM vendor's revenue. In 2024, HBM's revenue will account for 13.6% of total DRAM revenue. It is expected to further increase to 19.2% by 2025. According to Brocklehurst, "Memory and AI semiconductors will drive near-term growth, with HBM's share of DRAM revenues expected to increase, reaching 19.2% by 2025." HBM's revenue is expected to grow 66.3 percent to $19.8 billion by 2025.

In recent years, Longqi Technology takes the smartphone ODM business as the core, and actively expands the diversified business of tablet computer, smart wear, XR, AI PC, automotive electronics, etc., and has achieved remarkable results in these new business areas, thus driving its business performance to maintain rapid growth. In the first three quarters of 2024, the business of various sectors of Longqi Technology continued to grow, achieving operating income of 34.9 billion yuan, an increase of 101%. Among them, the company's smartphone business achieved revenue of 27.9 billion yuan, an increase of 98% year-on-year, continuing to lead the global smartphone ODM market, and its market share increased steadily. This growth trend is expected to be maintained throughout the year, demonstrating Longqi's strong strength and solid market share gains in the smartphone ODM segment. From the perspective of smartphone ODM/IDH shipments, in the first half of 2024, Longqi Technology ranked first with a 35% market share. Ivan Lam, senior Research Analyst at Counterpoint Research, said: "Longqi maintained its strong momentum, with shipments growing 50% year-on-year in the first half. This high growth was mainly driven by strong shipments from Chinese brands, especially Xiaomi, Huawei and MOTOROLA, as well as Samsung. Xiaomi's performance improved in several key regions including China, India, the Caribbean and Latin America, as well as Central and East Africa." In accepting institutional research, Longqi Technology said that in the third quarter, the company continued to lead the global smartphone ODM market, the company's market share increased steadily, and the business scale continued to maintain rapid growth. There are mainly three reasons: First, the company adopted a more active market strategy, obtained more customers' main projects, the company's market share has been further increased, and the customer structure has been more optimized. Second, some of the company's customers have their own business growth. In addition, the company's cooperation business with individual customers in India is growing faster, and the business model in which the amount of Buy&Sell is large has brought about revenue growth. In addition to the smartphone business, Longqi Technology's tablet computer and AIoT product business also performed well. In the first three quarters of 2024, the company's tablet computer business achieved revenue of 2.6 billion yuan, an increase of 78% over the same period last year. While continuously expanding the high-end and productive product portfolio, the company also actively expanded the customer base of the tablet computer business and continued to optimize the customer structure. AIoT product business achieved revenue of 3.8 billion yuan, an increase of 135%. The company's AIoT business mainly includes smart watches, smart bracelets, TWS headphones, XR products, etc., and the main projects continue to increase. It is worth mentioning that with the vigorous development of AI technology, Longqi Technology is accelerating its entry into the new track of AI intelligent hardware, and showing significant development potential and strong market competitiveness. In 2024, Longqi Technology completed the research and development, manufacturing and shipment of a number of products in the field of AI intelligent hardware, of which the shipment performance of the second-generation AI smart glasses products cooperated with global Internet head customers was particularly excellent. At the same time, the company's first Qualcomm Snapdragon platform laptop project successfully produced goods, which have been sold in the domestic and European markets. The company also landed the Qualcomm Snapdragon platform AI Mini PC project for the world's leading customers of laptops, injecting strong impetus into the expansion of AI applications in commercial and consumer fields. In addition, the company actively negotiates cooperation with major internationally renowned laptop customers on X86 architecture projects, and strives to land more new AI PC projects one after another. As the AI side application is accelerating the update, in addition to AI PC, Longqi Technology's smart hardware products such as mobile phones, tablets, XR, wristbands, TWS headphones also ushered in innovation opportunities, the company also conforms to the global AI technology development trend, actively follow up and layout of wireless communication, optics, display, audio, simulation and other underlying core technologies. To provide customers with full scene AI intelligent terminal product solutions. In the future, with the continuous evolution of AI technology and the growing market demand, Longqi Technology is expected to achieve more brilliant achievements in the field of AI intelligent hardware.

YINCAE has launched the UF 120LA, a high-purity liquid epoxy filling material designed for advanced electronic packaging. The UF 120LA has excellent fluidity and can fill narrow gaps up to 20 μs, avoiding cleaning processes and thus reducing costs and environmental impact while ensuring superior performance in applications such as BGA, flip chips, WLCSP and multi-chip modules. The UF 120LA can withstand five 260°C reflux cycles without distortion of the solder joint, surpassing competitors that require cleaning. Its ability to cure at lower temperatures increases production efficiency and makes it ideal for use in memory cards, chip carriers and hybrid integrated circuits. The superior thermal performance and mechanical durability of the UF 120LA enable manufacturers to develop more compact, reliable, and high-performance devices, driving the trend toward miniaturization, edge computing, and Internet of Things (IoT) connectivity. This technological advancement will enhance the production of critical applications such as 5G and 6G infrastructure, autonomous vehicles, aerospace systems and wearable technology, where reliability and durability are critical. In addition, by streamlining the manufacturing process, the UF 120LA accelerates the speed to market of consumer electronics, potentially reshaping supply chain efficiency and creating new opportunities for economies of scale. In the long term, widespread adoption of this technology could revolutionize the field of semiconductor packaging, laying the foundation for increasingly complex electronic devices that will be lighter, more efficient, and more resilient in extreme environments. Key Benefits: • No cleaning compatibility - Compatible with all non-cleaning solder paste residues. Cost savings - eliminate cleaning processes and pollution control. • High thermal reliability - can withstand multiple reflux cycles without deformation. • Excellent fluidity - narrow gaps up to 20 μs can be filled. • Low warpage - low CTE and high thermal stability. "The UF 120LA represents a significant advance in electronic packaging technology," said YINCAE Chief Technical Officer. "The UF 120LA enables manufacturers to push the boundaries of advanced packaging applications, from BGA to wafer-scale chip-scale packaging. We believe this product will set new industry standards for performance and efficiency.