Global Soul Limited Company News

Recently, citing foreign media, according to people familiar with the matter, Microsoft plans to launch a new round of layoffs around the world, focusing on those employees who are not performing well, and the specific scale of layoffs is not yet clear. Although Microsoft is keeping quiet about the exact number of layoffs, many of the affected jobs are expected to be replaced by new positions, meaning that the overall number of employees at Microsoft will not change much. A spokesman for the company has confirmed the job cuts, saying they are a continuation of job cuts over the past two years. In a statement, a Microsoft spokesperson said, "At Microsoft, we are always focused on hiring high performers. We are committed to the personal growth and learning of our employees. When employees do not perform as expected, we take the necessary steps to respond." According to people familiar with the matter, Microsoft is following its rivals in taking a tougher approach to performance management. The cuts are widespread, including in the vital security sector. Microsoft has made several rounds of layoffs in the past two years, and in January 2023, Microsoft announced a plan involving 10,000 employees, as part of the technology industry's widespread cost-cutting measures at the time, which accounted for about 5% of the company's total staff. Since then, Microsoft has continued to make a number of small layoffs across teams, products and divisions. Especially after Microsoft's $69 billion acquisition of Activision Blizzard, the Xbox division also experienced a degree of layoffs. The confirmed layoffs have attracted widespread attention, and it remains to be seen how the move will affect Microsoft's employees and overall operations. . (from the original home of SMT BBS, reprint please indicate the source: http://bbs.smthome.net/read-htm-tid-516583.html).

Recently, market research agency IDC pointed out in the report that PC shipments in the fourth quarter of 2024 increased by 1.8% year on year, and global shipments reached 68.9 million units. For the full year 2024, PC shipments were 262.7 million units, an annual increase of 1%. Looking forward to 2025, PC manufacturers are facing a number of resistance and support at the same time, making the market outlook unclear, but also make demand planning difficult.​ In addition, the United States and some European countries also performed strongly due to year-end promotions and as enterprises continue to upgrade hardware ahead of the expected end of Windows 10 support in October 2025."​ PC supply chain manufacturers said that in general, with the Christmas shopping season in Europe and the United States, the third quarter is the traditional shipment peak, and as the shopping tide comes to an end, the operation will enter the off-season by the end of the year. However, 2024 is abnormal, and urgent orders have suddenly emerged from the end of November, showing a state of off-season.

Recently, market research agency IDC pointed out in the report that PC shipments in the fourth quarter of 2024 increased by 1.8% year on year, and global shipments reached 68.9 million units. For the full year 2024, PC shipments were 262.7 million units, an annual increase of 1%. Looking forward to 2025, PC manufacturers are facing a number of resistance and support at the same time, making the market outlook unclear, but also make demand planning difficult.​ In addition, the United States and some European countries also performed strongly due to year-end promotions and as enterprises continue to upgrade hardware ahead of the expected end of Windows 10 support in October 2025."​ PC supply chain manufacturers said that in general, with the Christmas shopping season in Europe and the United States, the third quarter is the traditional shipment peak, and as the shopping tide comes to an end, the operation will enter the off-season by the end of the year. However, 2024 is abnormal, and urgent orders have suddenly emerged from the end of November, showing a state of off-season.

Japanese electronics group Kyocera will consider divesting businesses with limited growth potential with total sales of about 200 billion yen ($1.3 billion) to streamline its portfolio amid sluggish demand for auto electronics parts and other products. "We are positioning those businesses that are not expected to grow as non-core businesses and hope to sell them in the fiscal year ending March 2026," said Hideo Tanimoto, president. He did not name specific candidates, but Kyocera expects to gradually sell businesses that are difficult to increase profitability on their own. Kyocera expects its consolidated net profit for the year to March to fall 30 per cent to Y71bn, its third straight year of decline, due to poor performance in its automotive capacitors and semiconductor packaging businesses. In October, the company announced plans to split its business into core and non-core businesses that are expected to grow, and to exit some non-core businesses. "We are focusing on profit, not sales, which will be equivalent to 10 per cent of total sales," Mr Tanimoto said. Kyocera's strength lies in its management style, known as "amoeba management," in which a small unit of about 10 people is responsible for the profitability of each business. Kyocera, which began as a producer of ceramic parts, has diversified into 15 sectors, including electronic parts, communications equipment, medical equipment, cutting and power tools, and multi-function printers. Some of these businesses have struggled to turn a profit in recent years because of competition from China and elsewhere. The company will continue to invest in growth areas. The company will spend 68 billion yen to build a factory in Nagasaki Prefecture to produce components for semiconductor-related applications. "Every business area has needed a lot of investment in recent years," Tanimoto said. "Unless we focus on investing in specific areas rather than trying to cover everything, we're not going to win." Kyocera has also decided to sell a third of its stake in Japanese telecom operator KDDI over the next five years, in which it holds about 16 percent as the largest shareholder. Kyocera Group is expected to gain a market value of about 500 billion yen and plans to invest in core businesses and large-scale mergers and acquisitions. Kyocera was founded in 1959, the company's business is mainly based on precision ceramic technology, radiation development of a number of industrial chains, divided into information and communication market, automotive market, energy conservation and environmental protection market and health care market, four markets, to provide target customers with valuable products and services. Electronic components is one of the main businesses of Kyocera, which provides miniaturized, large-volume, high-performance multi-layer chip ceramic capacitors (MLCC) with superb dielectric ceramic processing and manufacturing technology. With a rich product lineup, it is widely used in wireless communication terminals such as smart phones and tablet computers, digital equipment such as liquid crystal displays, industrial and vehicle equipment. The MLCC market is undergoing structural change. Japanese companies such as Murata, Suntrap and TDK have a high share, but Samsung Electric (the electronic components arm of the South Korean group) and China's Samsung Electronics are gaining market share. Kyocera's other main business is core components - precision ceramic components, automotive parts, medical devices, jewelry and other products. Kyocera, with its rich material technology, processing technology and innovative design technology as the core, provides highly reliable ceramic packages and substrates for a wide range of products such as small components such as smartphones, optical fiber communication components, and leds for automotive headlights. With the rapid development of information and communication technology and the popularization of the Internet, the high performance and multi-function of electronic equipment have made rapid development. Kyocera supports the development of electronic devices through organic packaging and printed circuit boards. According to Kyocera's second quarter results report (fiscal year ending March 2025), the global economy is growing slowly under the influence of falling inflation rates in various countries. The market related to Kyocera's semiconductor business and information and communication business, mainly for AI-related demand has increased, but the overall has not yet achieved a full recovery. At the same time, affected by the downturn in parts orders, the operation rate of production equipment declined, labor costs increased, and performance profits declined. In addition, the report mentioned that the market weakness and market share decline in the early MLCC, as well as the downturn in the vehicle market, the impact of the decline in the operating rate of the new plant in Thailand is greater, and the profitability of the KAVX Group has declined significantly. Kyocera will focus on developing new products for high-end semiconductors and expanding its business for special uses in Europe and the United States in order to strengthen the MLCC business, which is expected to have high growth, and the titanium capacitor business, which has a high market share. At the same time, it will also study exiting non-core businesses and products, and for the growth of the electronic components business, Kyocera believes that implementing strategic mergers and acquisitions to expand market share and improve profitability is crucial.

In the PCB industry, it is natural to set up a test point on the circuit board, but what is the test point for the new person who just contacts the PCB? It is inevitable that it is a question, so today the PCB manufacturer Xiaobian will take you to understand why the test point is set on the PCB board.   20211222140721_IMG_5630 In simple terms, the purpose of setting the test point is mainly to test whether the components on the circuit board meet the specifications and weldability, for example, if you want to check whether the resistance on a circuit board has a problem, the easiest way is to take a multimeter to measure its two ends. However, In the mass production of Circuit board factories, there is no way for you to use an electric meter to slowly measure whether each resistor, capacitor, inductance, or even IC circuit on each board is correct, so there is the emergence of the so-called ICT (in-circuit-test) automatic Test machine. It uses multiple probes (commonly known as "Bed-Of-Nails" fixtures) to simultaneously contact all the parts on the board that need to be measured, and then measures the characteristics of these electronic parts in a sequential and side-by-side manner through program control. Usually, the test of all the parts of the general board only takes about 1 to 2 minutes to complete, depending on the number of parts on the circuit board, the more parts the longer. 20211222140849_IMG_5634 However, if these probes directly contact the electronic parts on the line board or its welding feet, it is likely to destroy some electronic parts, but the opposite is true, so smart engineers invented the "test point", at both ends of the part extra lead out a pair of circular dots, there is no anti-welding (mask), you can let the test probe contact these small points. Without having to come into direct contact with the electronic parts being measured. In the early days of the traditional plug-in (DIP) on the circuit board, PCB manufacturers do use the welding foot of the part as a test point, because the welding foot of the traditional part is strong enough and is not afraid of needles, but there are often misjudgments of poor contact of the probe. Because the general electronic parts after wave soldering (wave soldering) or SMT eat tin, the surface of the solder usually forms a residual film of solder paste flux, the impedance of this film is very high, often cause poor contact of the probe, so the test operator of the circuit board factory production line is often seen. Often take the air spray gun to blow hard, or take alcohol to wipe these need to be tested. In fact, the test point after wave soldering will also have the problem of poor contact of the probe. Later, after the prevalence of SMT, the situation of test misjudgment has been greatly improved, and the application of test points has been greatly entrusted with the task, because the parts of SMT are usually fragile and can not withstand the direct contact pressure of the test probe, and the use of test points can avoid the direct contact of the probe to the parts and their welding feet, which not only protects the parts from damage, but also protects the parts from damage. Indirectly, the reliability of the test is greatly improved, because there are fewer cases of miscalculation. However, with the evolution of science and technology, the size of the circuit board is getting smaller and smaller, and it is already somewhat difficult to squeeze so many electronic parts from the light on the circuit board, so the problem of the test point occupying the space of the circuit board is often a tug-of-war between the design end and the manufacturing end, but this issue will have the opportunity to talk again in the future. The appearance of the test point is usually round, because the probe is also round, it is easier to produce, and it is easier to let the adjacent probe be closer together, so that the needle density of the needle bed can be increased. The use of a needle bed for circuit testing has some inherent limitations on the mechanism, for example: the minimum diameter of the probe has a certain limit, and the needle with too small a diameter is easy to break and destroy. The distance between the needles is also limited, because each needle has to come out of a hole, and the back end of each needle has to be welded with a flat cable, if the adjacent hole is too small, in addition to the problem of short circuit contact between the needle and the needle, the interference of the flat cable is also a big problem. Needles cannot be placed next to some tall parts. If the probe is too close to the tall part, there is a risk of damage caused by collision with the tall part. In addition, because the part is high, it is usually necessary to cut holes in the needle bed of the test fixture to avoid it, which also indirectly causes the needle planting. It is getting harder to fit all the parts on the circuit board under the test point. As the circuit board is getting smaller and smaller, the storage and waste of test points are often discussed. Now there are some methods to reduce Test points, such as Net test, Test Jet, Boundary Scan, JTAG, etc. There are other test methods that want to replace the original needle bed test, such as AOI tester, X-Ray, but at present, each test seems to be unable to 100% replace ICT. The minimum diameter of the test point and the minimum distance of the adjacent test point, usually there will be a desired minimum value and the minimum value that can be achieved, but the scale of the circuit board manufacturers will require the minimum test point and the minimum test point distance can not exceed a number of points, so PCB manufacturers will leave more test points in the production of the board

PCB wiring is a very important link in the PCB board, and understanding PCB wiring is something that beginners need to learn. In this article will share the PCB circuit board and precautions, hope to help users. _DSC1445 PCB design should follow the rules: 1. Control the cable direction 2. Check the open and closed loop of the cable 3. Control the cable length 4. Control the length of the cable branch 5. Corner design 6. Differential cabling 7. The impedance board of the control PCB wire is matched with the cable terminal 8. Design grounding protection cables 9. Prevent cable resonance PCB routing principles are as follows: 1. The input and output wires should be avoided parallel to each other, and the ground wire between the lines should be added to prevent feedback coupling. 2. The minimum width of the PCB wire is determined by the adhesion strength and current value between the wire and the insulating substrate. 3. The minimum spacing of PCB wires is determined by the insulation resistance and breakdown voltage between the wires in the worst case. 4, PCB printed board wire bend generally take circular arc, but also try to avoid large area of copper foil, for some reasons need to use large area of copper foil, also try to use grid. The above are the principles and rules of PCB design and wiring.

In recent years, with the progress of science and technology, the PCB industry has also entered a rapid development mode, and because the global pcb continues to migrate to Asia, especially the Chinese mainland, so the Chinese mainland has quickly become a pcb production power. According to statistics, the total output value of the PCB industry from $3.368 billion in 2000 to $21.636 billion in 2012, has developed into the world's largest pcb production country. It is predicted that in the next few years, China's pcb industry will continue to maintain a rapid growth trend, and its market position in the world will continue to improve; From 2012 to 2017, the compound annual growth rate of China's pcb output value can reach 6.0%, and the total output value can reach 28.972 billion US dollars by 2017, accounting for 44.13% of the global pcb total output value. The above data is of course an encouragement and incentive for our PCB industry, and also gives us a certain confidence to continue to move forward in the industry. However, in the past two years, the news about China's PCB industry is always mixed: happy is that more and more large PCB enterprises have been listed or about to be listed, such as Guangdong Yidon, Zhengye Technology and June 2015 just listed Shenghong Technology, Bomin Electronics, and are preparing for the listing of Jingwang, Chongda and five...... The listing of these enterprises will mean that they have more and more strong economic backing to optimize enterprise resources and products, so that they have more and more advantages in market competition; On the other hand, it is worrying that more and more small and medium-sized PCB enterprises will face closure, and even some bosses directly run away, leaving a pile of workers and suppliers without settlement of wages, and the rest of the small and medium-sized factories that are still struggling, most of them have already been in a state of loss, but still struggling to turn over. These facts seem to tell us that the PCB industry has gradually begun to show polarization, the strong is getting stronger, the weak is getting weaker and weaker until finally disappear. What is the cause of this polarization in the first place? After the author and a number of circuit board factory owners or managers to understand, summed up mainly as follows:   1. Chaotic management system leads to reduced orders and increased costs Most of the small factories are produced when PCB products are in short supply, the early construction of the factory due to high PCB unit price, high profits, sufficient orders, so it is easy to survive, there is no sense of crisis, so there is no much consideration of factory management issues. Since it is easy to survive, of course, more and more people are investing, so the PCB factory is growing faster and faster, the supply and demand of PCB gradually tends to balance until the supply exceeds the demand, at this time to rely on the advantages of the PCB factory itself to attract customers, and delivery and quality are the two key indexes that customers care about most, delivery and quality assurance by what? It relies on an excellent management system. Imagine a factory with chaotic management, where employees operate at will, production parameters are adjusted according to their feelings, process sequence is not controlled, quality inspection is not implemented, production schedule is chaotic, allocation is unreasonable, production is arranged after delivery of the board on a tight schedule, the board is stuck in a certain process and cannot continue production due to process capability, and the board is scrapped near the delivery date...... How to guarantee the quality and delivery time in such a chaotic situation? Without the guarantee of quality and delivery, customers have more opportunities to choose suppliers, so of course they will give orders to PCB factories with good quality and delivery time. Another problem caused by management chaos is the increase of hidden costs, such as the increase of scrap costs caused by quality problems, the increase of working hours and labor costs caused by the extension of production cycle, and even the increase of transportation costs (for example, some products have to be transported by car instead of by air, or specially driven to the customer's factory in order to catch up with the delivery time).   2. Obsolete equipment restricts the PCB process capacity and increases quality hazards Most of the small and medium-sized PCB factories in China have risen since 2003, so the production equipment has 10 years, and the service life of PCB equipment is generally only about 10 years, so these equipment are almost scrapped, and small and medium-sized PCB factories are unable to buy new equipment replacement due to insufficient funds, so they can only make do with it. How can old and aging equipment produce high-precision products? Even often because of equipment failure to lead to quality problems, or unable to produce affect the delivery, which is undoubtedly in the chaos of management on the basis of worse.   3. Environmental requirements restrict the development of PCB enterprises In recent years, with the improvement of China's environmental awareness, the requirements for environmental protection have become more and more stringent, and most small factories did not obtain independent environmental protection cards at the beginning of the construction of the factory, so that these small factories can only rely on renting plants with environmental protection cards, and waste water treatment is also handed over to the environmental Protection Bureau, forcing PCB companies to restrict regional selection and increase environmental protection costs.   4. Fierce market competition leads to lower unit price and thinner profit Since some small and medium-sized enterprises have lost the advantage of receiving orders in terms of delivery time and quality, they can only attract customers by lowering prices, and maintain survival with meager profits, sometimes even at a loss.   5. Changes in the order structure of upstream electronic products have led to the development of PCB products in the direction of high precision With the change of consumer psychology, terminal electronic products are gradually turning to the direction of high quality and high precision. When smart phones first appeared, consumers are pursuing a fresh experience, and the first choice for the public is of course low-cost Sanzhai products, and Sanzhai products have very low quality requirements, and the same is true for PCB. When the freshness of consumers disappears, and then turn to the pursuit of high quality, copycat products are eliminated at this time, and some brand products such as Apple, Samsung, Huawei gradually occupy the market, and the dominant brand manufacturers choose PCB suppliers, of course, will not consider any advantages and protection of small factories.   6. A vicious circle leads to difficulties in capital turnover Due to the decrease in PCB orders, the decrease in unit price, and the increase in hidden costs, PCB profits will eventually decrease, and even a loss will occur, which will eventually lead to difficulties in capital turnover. The PCB factory's material supplier itself has low support for the small factory, and if there is a turnover problem at this time, it will choose to stop the supply, and eventually lead to the PCB factory cannot operate and "close the door". Although big fish eat small fish is the law of social development is also the law of market development, but does not mean that all small fish will be eaten, there are always small fish lucky to escape from the big fish, PCB companies are the same, as long as some PCB companies have enough measures to face the fierce market competition always able to survive in the cracks. The author believes that small and medium-sized PCB factories can be improved from the following aspects:   1. Choose a suitable ERP system to help enterprises establish a good management system. With the rapid development of information technology, the use of ERP to help management has become an inevitable trend of enterprise development. a suitable set of ERP can guarantee the quality and delivery of the enterprise, increase the advantage of PCB enterprises to receive orders, and help PCB enterprises save costs, which is reflected in the following aspects: a. Automatic scheduling allows you to worry about delivery time and ensure delivery. No late delivery, no customer claims; b. Production management seamless handover, there will be no human factors caused by waste, rework; c. When a contract is entered into the system, the system will automatically prompt how much inventory, where, if the inventory is enough, you can not be included in the production line, direct shipment, save time, increase customer reputation; Reduce the floor space of finished product warehouse, save warehouse costs and personnel costs; d. The system is a set of OA finance CRMERP, on a system, basically do not need to go on the other, several in one, cost-effective; e. After the completion of a contract, it is directly transferred to the engineering department, and after the completion of the project, it is directly entered into the plan to dismantle the card, and then the production line. Every process is very clear, where and who is doing what, and it is known at a glance in the system. When the working status of all personnel is clearly visible, who dares to slow down or slow down? Who dares to do sloppy work? Efficiency will of course increase; f. If the quality of the product is not qualified, where the problem is, from what person's hand, in the system a check will know, the enterprise can adjust accordingly to avoid the same problem next time; g. The longer the system is used and the more data it accumulates, it is very effective for analyzing the problems of the enterprise and the trends that should be taken, and it helps the boss make the right decisions.   Do you think that when all farmers begin to use time-saving and efficient machinery, farmers who rely on primitive farming practices will still be able to prosper? Nowadays, in this era of rapid development of high-tech, an enterprise that does not use ERP management system is like a farmer who relies on primitive farming operations, and will never have the opportunity to turn over.   2. To develop in the direction of special technology, increase the advantage of receiving orders. In the fierce market competition, small and medium-sized PCB factories have no advantage in ordinary orders, so only by special processes to attract customers, such as high-precision fast samples and small batches; Special plate or special process design of unpopular products; Board size is abnormal, normal equipment can not produce products...... These special types of boards increase opportunities for PCB companies at the same time, the profit will be relatively high, to the survival of PCB companies greatly increased the opportunity.   3. Resource integration within the industry The era of winning by going it alone has passed, and now it is the era of winning by team. Should these small and medium-sized PCB factories consider resource integration and complementary advantages? For example, the merger between the peer circuit board factory, huddle heating, increase the overall strength; The vertical industrial chain is merged to save costs and shorten the production cycle, such as the merger of electronics factories and PCB factories, and the merger of PCB factories and material suppliers or processors.   4. Turn to the industrial chain development of PCB industry Due to the improvement of PCB environmental protection requirements in Guangdong and the increase in production costs, since 2010, there have been many PCB factories transferred to the mainland, but the supporting industrial chain has not been transferred, resulting in PCB orders and production are severely restricted, such as the lack of logistics leads to some PCB orders to be transferred several times to reach the hands of customers. Extended delivery time, increased transportation costs and quality hazards during transportation; In addition, some material suppliers and processors are almost absent in the mainland, resulting in longer material procurement time for PCB enterprises and weak technical service support...... In this case, why not turn to the development of PCB industry chain with huge market space?

Printed circuit boards are manufactured according to customer or industry requirements, following different IPC standards. The following summarizes the common standards of printed circuit board production for reference.   1)IPC-ESD-2020: Joint standard for the development of electrostatic discharge control procedures. Including electrostatic discharge control program necessary design, establishment, implementation and maintenance. Based on the historical experience of certain military organizations and commercial organizations, it provides guidance for the treatment and protection of electrostatic discharge during sensitive periods.   2)IPC-SA-61A: semi-aqueous cleaning manual after welding. Includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, process, process control, and environmental and safety considerations.   3)IPC-AC-62A: Water cleaning manual after welding. Describe the costs of manufacturing residues, types and properties of water-based cleaners, water-based cleaning processes, equipment and processes, quality control, environmental control, and employee safety and cleanliness measurement and determination.   4)IPC-DRM-40E: Through hole welding point evaluation desktop reference manual. Detailed descriptions of components, hole walls, and weld surfaces as per standard requirements, in addition to computer-generated 3D graphics. It covers filling, contact Angle, tinning, vertical filling, pad covering, and numerous weld point defects.   5)IPC-TA-722: Welding Technology Evaluation Manual. Includes 45 articles on all aspects of welding technology, covering general welding, welding materials, manual welding, batch welding, wave soldering, reflow welding, gas phase welding, and infrared welding.   6)IPC-7525: Template Design Guidelines. Provides guidelines for the design and manufacture of solder paste and surface-mount binder coated formforms.i Also discusses formwork designs that apply surface-mount techniques, and describes hybrid techniques with through-hole or flip-chip components, including overprint, double print, and stage formwork designs.   7)IPC/EIAJ-STD-004: Specification requirements for flux I includes Appendix I. Including rosin, resin and other technical indicators and classification, according to the content of halide in the flux and the degree of activation classification of organic and inorganic flux; It also covers the use of flux, substances containing flux, and low-residue flux used in no-clean processes.   8)IPC/EIAJ-STD-005: Specification requirements for solder paste I includes Appendix I. The characteristics and technical requirements of solder paste are listed, including test methods and standards for metal content, as well as viscosity, collapse, solder ball, viscosity and solder paste sticking properties.   9)IPC/EIAJ-STD-006A: Specification requirements for electronic grade solder alloys, flux and non-flux solid solder. For electronic grade solder alloys, for rod, band, powder flux and non-flux solder, for electronic solder applications, for special electronic grade solder terminology, specification requirements and test methods.   10)IPC-Ca-821: General requirements for thermal conductivity binders. Includes requirements and test methods for thermal conductivity media that will glue components to suitable locations.   11)IPC-3406: Guidelines for Coating binders on conductive surfaces. To provide guidance for the selection of conductive binders as solder alternatives in electronic manufacturing.   12)IPC-AJ-820: Assembly and Welding manual. Contains a description of inspection techniques for assembly and welding, including terms and definitions; Specification reference and outline for printed circuit boards, components and pin types, welding point materials, component installation, design; Welding technology and packaging; Cleaning and laminating; Quality assurance and testing.   13)IPC-7530: Guidelines for temperature curves for batch welding processes (reflow welding and Wave soldering). Various testing methods, techniques and methods are used in temperature curve acquisition to provide guidance for establishing the best graph.   14)IPC-TR-460A: Troubleshooting list for wave soldering of printed circuit boards. A list of recommended corrective actions for faults that may be caused by crest welding.   15)IPC/EIA/JEDECJ-STD-003: weldability test for printed circuit boards.   16)J-STD-013: Ball-foot Lattice array package (SGA) and other high density technology applications. Establish the specification requirements and interactions required for the printed circuit board packaging process to inform high-performance and high-pin number integrated circuit package interconnections, including information on design principles, material selection, board fabrication and assembly techniques, test methods, and reliability expectations based on the end-use environment.   17)IPC-7095: Design and assembly process supplement for SGA devices. Provide a variety of useful operational information for those who are using SGA devices or considering switching to array packaging; Provide guidance on SGA inspection and maintenance and provide reliable information on the SGA field.   18)IPC-M-I08: Cleaning Instruction Manual. Includes the latest version of IPC cleaning guidance to assist manufacturing engineers as they determine the cleaning process and troubleshooting of products.   19)IPC-CH-65-A: Cleaning Guidelines for printed circuit board assembly. Provides references to current and emerging cleaning methods in the electronics industry, including descriptions and discussions of various cleaning methods, explaining the relationships between various materials, processes, and contaminants in manufacturing and assembly operations.   20)IPC-SC-60A: Cleaning manual for solvents after welding. The application of solvent cleaning technology in automatic welding and manual welding is given. The properties of solvent, residues, process control and environmental problems are discussed.   21)IPC-9201: Surface Insulation Resistance Manual. Covers terminology, theory, test procedures, and test methods for surface insulation resistance (SIR), as well as temperature and humidity (TH) tests, failure modes, and troubleshooting.   22)IPC-DRM-53: Introduction to the Electronic Assembly Desktop Reference Manual. Illustrations and photographs used to illustrate through-hole mounting and surface-mount assembly techniques.   23)IPC-M-103: Surface Mount Assembly manual standard. This section includes all 21 IPC files on surface mount.   24)IPC-M-I04: Printed circuit Board Assembly manual standard. Contains the 10 most widely used documents on printed circuit board assembly.   25)IPC-CC-830B: Performance and identification of electronic insulating compounds in printed circuit board assembly. The shape coating meets an industry standard for quality and qualification.   26)IPC-S-816: Surface mount technology process Guide and list. This troubleshooting guide lists all types of process problems encountered in surface mount assembly and how to resolve them, including Bridges, missed welds, uneven placement of components, etc.   27)IPC-CM-770D: Installation Guide for PCB components. Provides effective guidance on the preparation of components in printed circuit board assembly and reviews relevant standards, influences and releases, including assembly techniques (both manual and automatic as well as surface mount and flip-chip assembly techniques) and considerations for subsequent welding, cleaning and laminating processes.   28)IPC-7129: Calculation of Number of failures per million opportunities (DPMO) and manufacturing index of PCB assembly. Agreed benchmark indicators for the calculation of defects and quality related industrial sectors; It provides a satisfactory method for calculating the benchmark of the number of failures per million chances.   29)IPC-9261: Printed circuit board assembly yield estimates and failures per million chances of assembly in progress. A reliable method is defined for calculating the number of failures per million opportunities during PCB assembly and is a measure for evaluation at all stages of the assembly process.   30)IPC-D-279: Design Guide for assembly of printed circuit Boards for Reliable Surface Mount Technology. Reliable manufacturing process guide for surface-mount technology and hybrid technology printed circuit boards, including design ideas.   31)IPC-2546: Combination requirements for conveying key points in printed circuit board assembly. Material movement systems such as actuators and buffers, manual placement, automatic screen printing, automatic binder distribution, automatic surface mount placement, automatic plating through hole placement, forced convection, infrared reflux furnace, and wave soldering are described.   32)IPC-PE-740A: Troubleshooting in printed circuit board manufacturing and assembly. It includes case records and correction activities of problems occurring in the design, manufacture, assembly and testing of printed circuit products.   33)IPC-6010: Printed Circuit Board Quality Standards and Performance specifications series manual. Includes the quality standards and performance specifications set by the American Printed Circuit Board Association for all printed circuit boards.   34)IPC-6018A: Inspection and testing of microwave finished printed circuit boards. Includes performance and qualification requirements for high frequency (microwave) printed circuit boards.   35)IPC-D-317A: Guidelines for the design of electronic packages using high-speed technology. Provides guidance on the design of high-speed circuits, including mechanical and electrical considerations and performance testing

Most electronics factory purchasing personnel have been confused by the changing price of PCB board, even if some people with many years of PCB board procurement experience may not fully understand the reason, in fact, PCB board price is composed of the following factors:   First, the different materials used in PCB board cause the diversity of prices Taking the common double panel as an example, the plate material is generally FR-4, CEM-3, etc., the plate thickness ranges from 0.6mm to 3.0mm, and the copper thickness ranges from ½ Oz to 3Oz range, all these in the sheet material alone caused a huge price difference; In terms of solder resistance inks, there is also a certain price difference between ordinary thermosetting oil and photosensitive green oil, so the difference in materials causes the diversity of prices.   Second, the different production processes used by PCB boards cause the diversity of prices Different production processes result in different costs. Such as gold-plated plate and spray tin plate, the production of shaped gong (milling) plate and beer (punching) plate, the use of silk screen lines and dry film lines will form different costs, leading to the diversity of prices.   Third, the price diversity caused by the different difficulty of the PCB board itself Even if the material is the same and the process is the same, the difficulty of the PCB board itself will cause different costs. If there are 1000 holes on both PCB boards, the aperture of one board is greater than 0.6mm and the aperture of the other board is less than 0.6mm, different drilling costs will be formed; If the other two kinds of circuit boards are the same, but the line width and line distance are different, one is greater than 0.2mm, and one is less than 0.2mm, it will also cause different production costs, because the difficult board scrap rate is higher, the inevitable cost increases, resulting in price diversity.   Fourth, different customer requirements will also cause different prices The level of customer requirements will directly affect the finished product rate of the board factory, such as a board according to IPC-A-600E, class1 requirements have 98% pass rate, but according to class3 requirements may only 90% pass rate, resulting in different costs of the board factory, and finally lead to product price variability.   Five, PCB board manufacturers caused by different price diversity Even if the same product, but because different manufacturers process equipment, technical level is different, will form different costs, nowadays many manufacturers like to produce gold-plated plate, because the process is simple, low cost, but there are also some manufacturers to produce gold-plated plate, scrap that rise, resulting in higher costs, so they would rather produce tin-spray plate, so their tin-spray plate price is lower than gold-plated plate.   6. Price differences caused by different payment methods At present, PCB board factories generally adjust the sustainable development price of PCB board according to the different payment methods, the range is 5%-10%, which also causes the difference in price.   Seven, different regions cause the diversity of prices At present, from the geographical position of the country, from the south to the north, the price is increasing, and there are certain differences in different regional prices, so regional differences also cause the diversity of prices. It is not difficult to see from the above discussion that the diversity of PCB board prices has its inherent inevitable factors, this column can only provide a rough price range for reference, of course, the specific price is still in direct contact with the manufacturer.

At its lab near SAN Jose, IBM has built an electronic rodent brain from 48 TrueNorth test chips, each of which can mimic a basic building block of the brain. IBM made an artificial brain out of 48 chips Under the leadership of the project leader Dharmendra Modha, we got up close and personal with the entire project. It is understood that its volume is like a bathroom medicine cabinet, which is covered with translucent plastic panels, and can clearly see the chips, circuit boards and colorful indicators inside it. It looks like something out of a 70s science fiction movie, but Modha says, "You're looking at a small rodent." He's talking about the brain of a small rodent, or at least this stack of chips can fit into that brain. These chips act as neurons, the basic building blocks of the brain. Modha says the system can simulate 48 million nerve cells, roughly equal to the number of nerve cells in a small rodent brain. At IBM, Modha ran the cognitive computing group, which invented the "neurochip." When he and his team first unveiled their invention, they used it for a three-week test run, supporting academics and government researchers at IBM's research and development lab in Silicon Valley. After connecting their own computers to the digital mouse brain, the researchers explored its structure and began writing programs for the TrueNorth chip. Last month, some researchers had already seen this guy in Colorado, so they had programmed it to recognize photos and speech, and understand some natural language. The chip runs the "deep learning" algorithms that now dominate the Internet's artificial intelligence services, providing facial recognition for Facebook and real-time language translation for Microsoft's Skype. Still, IBM has a head start here because its research could reduce the need for space and power supplies. In the future, we may be able to put this artificial intelligence into mobile phones and other small devices, such as hearing AIDS and watches. "What do we get from the synaptic structure? We can classify images with very low power consumption, and we can constantly solve new problems in new environments." Brian Van Essen, a computer scientist at Lawrence Livermore National Laboratory who is responsible for applying deep learning algorithms to national security. TrueNorth is the latest technology that will run deep learning and a range of other AI services in the future. Today's machines that run algorithms from Google, Facebook and Microsoft still require separate graphics processors, but they are all moving towards FPgas (chips that can be programmed for specific tasks). Peter Diehl (PhD in the Cortex Computing Group at Polytechnic University Zurich) believes TrueNorth is superior to both standalone graphics chips and FPgas because of its low power consumption. The main difference, says Jason Mars, a professor of computer science at the University of Michigan, is that TrueNorth works seamlessly with deep learning algorithms. Both simulate neural networks in depth and generate neurons and synapses "in the brain." "The chip can efficiently execute the commands of the neural network." He did not participate in the test run, but has closely followed the chip's progress. Even so, TrueNorth is not yet fully synchronized with deep learning algorithms. However, IBM has decided to involve outside researchers in improving the chip, because it is still some distance from the actual market. For Modha, it was also a necessary process, as he said: "We needed to lay a solid foundation for a major transformation." The brain in the phone Peter Diehl recently traveled to China, but for some reason you know, his phone didn't work with Google, and he suddenly took artificial intelligence back to its original form. Because most of the cloud computing now depends on Google's servers, so without the network, everything is useless. Deep learning requires a tremendous amount of processing power, which is typically provided by giant data centers, and our phones are usually connected to them via the Internet. TrueNorth, on the other hand, can move at least some of its processing power to your phone or other device, which could greatly expand the frequency of AI use. But to understand this, you first need to understand how deep learning works. It works in two stages. First, companies like Google and Facebook need to build their own neural networks to handle specific tasks. If they want the ability to automatically recognize cat photos, they have to show the neural network a bunch of cat photos. Then, after the pattern is trained, another neural network needs to perform this task. When you take out a photo, the system has to determine if there are cats in it, and TrueNorth exists to make the second step more efficient. Once you've trained the neural network, the chip can help you bypass the giant data center and go straight to the second step. And because TrueNorth's chip is so small and power efficient, it can fit into handheld devices. This increases overall efficiency because you no longer need to download the results from the data center over the network. If it can be popularized, it can greatly reduce the pressure on data centers. "This is the future of the industry, where devices can perform complex tasks independently." "Mars said. Neurons, axons, synapses and nerve impulses Google has recently been trying to bring neural networks to mobile phones, but Diehl thinks TrueNorth is way ahead of its rivals, because it's more in sync with deep learning. Each chip can simulate millions of neurons, and these neurons can communicate with each other through "synapses in the brain." This is what sets TrueNorth apart from similar products on the market, even compared to graphics processors and FPgas have enough advantages. TrueNorth chips can form "nerve impulses," similar to electrical impulses in the brain. Nerve impulses can show a change in tone in someone's speech, or a change in color in an image. "You can think of it as little messages between neurons." Rodrigo Alvarez-Icaza, one of the chip's lead designers. Although there are 5.4 billion transistors on the chip, its power consumption is only 70 milliwatts. What about standard Intel processors? It has 1.2 billion transistors, but its power consumption reaches 35 to 140 watts. Even ARM chips, which are commonly used in smartphones, consume several times more power than TrueNorth chips. Of course, for the chip to really work, it needs new software, which is exactly what Diehl and other developers have been trying to do during the test run. In other words, the developers are converting existing code into a language that the chip recognizes and feeds into it, but they're also working on writing native code for TrueNorth. present Like other developers, Modha focuses on discussing TrueNorth in the field of biology, such as neurons, axons, synapses, nerve impulses, etc. The chip undoubtedly mimics the human nervous system in some ways, but it still has its limitations. "These kinds of discussions are often very cautionary. After all, silicon is not what the human brain is made of." Chris Nicholson, co-founder of a company called Skymind. Modha acknowledges these claims. When he started the project in 2008, with a $53.5 million investment from Darpa (the research arm of the Department of Defense), the goal was to build an entirely new chip out of completely different materials and simulate the human brain. But he knows it won't happen quickly, and "we can't ignore reality on the way to pursuing our dreams," he said. In 2010, he was bedridden with swine flu, during which time he realized that the best way to break through the bottleneck was to start with the chip structure and achieve a simulation of the brain. "You don't need nerve cells to mimic basic physics, chemistry and biology to improve computing power. We need to be flexible enough to become more and more like the brain." 'he said. This is the TrueNorth chip. It's not a digital brain, but it's an important step along the way, and with IBM's trial run, the plan is on track. The entire machine is actually made up of 48 separate machines, each with its own TrueNorth processor. Next week, with the trial run over, Modha and his team will break down the machine for researchers to take home for further study. Humans use technology to change society, and these researchers are the backbone of our efforts.

The circuit board, the full name of the printed circuit board, is a bridge between high-tech signal communication, including the industrial board connecting the switch and the machinery, in the production process of the circuit board, PCB manufacturers always play a circle of holes and copper tape around the industrial board or RF board, and even some RF board will be metallized around the four edges of the board. Many small partners do not understand why to do so, is it engineers show technology, do useless work? pcb circuit board No, it's not. There's a purpose to it. Nowadays, with the improvement of system speed, not only the timing and signal integrity problems of high-speed signals are prominent, but also the EMC problems caused by electromagnetic interference and power integrity caused by high-speed digital signals in the system are also very prominent. The electromagnetic interference generated by high-speed digital signals will not only cause serious interference within the system, reduce the anti-interference ability of the system, but also produce strong electromagnetic radiation to the outer space, causing the electromagnetic radiation emission of the system to seriously exceed the EMC standard, so that the products of the circuit board manufacturers can not pass the EMC standard certification. The edge radiation of multilayer PCB is a common source of electromagnetic radiation. Edge radiation occurs when an unexpected current reaches the edge of the ground layer and the power layer, with grounding and power supply noise in the form of inadequate power supply bypass. The cylindrical radiating magnetic field generated by the inductive hole radiates between the layers of the board and finally meets at the edge of the board. The return current of the strip line carrying the high frequency signal is too close to the edge of the board. In order to prevent these situations, a ring of ground holes is made around the PCB board with 1/20 wavelength hole spacing to form a ground hole shield to prevent external radiation of TME waves.   pcb board For the microwave circuit board, its wavelength is further reduced, and due to the PCB production process now, the spacing between holes and holes can not be made very small, at this time has 1/20 wavelength spacing in the PCB around the way to play shielded holes for the microwave board is not obvious, then you need to use the PCB version of metalization edge process, the entire board edge surrounded by metal, Thus, the microwave signal can not radiate out from the PCB board edge, of course, the use of plate edge metallization process, will also lead to PCB manufacturing costs increase a lot. For RF microwave boards, some sensitive circuits, and circuits with strong radiation sources can be designed to weld a shielding cavity on the PCB, and the PCB board should be added "through the hole shielding wall" in the design, that is, the PCB and the shielding cavity wall close to the part of the ground through the hole. This creates a relatively isolated area. After confirming that it is correct, it can be sent to the multi-layer circuit board manufacturer for production. Hot article Basic principles of pcb routing Why do I need test points on the PCB? Copper sinking process for PCB circuit board production PCB exposure skills and basic knowledge What is the concept and content of cleaner production in PCB board production? What are the performance and technical requirements of the circuit board? Previous post

December 24 News, Samsung and other manufacturers have proved that folding screen smart phones have a certain market, however, foreign media AndroidAuthority quoted ET News report that the market is now slowly cooling, Samsung plans to scale back the Z Fold/Flip 7 foldable phone layout next year. While Samsung's overall sales target for 2025 May be down slightly from this year, there could still be some bright spots in the market, such as the rumored Galaxy S25 Slim. This thinner, more affordable flagship model may be able to continue the attention brought by the previous Z Fold. At present, the focus of consumers is gradually shifting to Samsung's new product line in 2025. While no official announcement has been made, Samsung is rumored to be unveiling the all-new S25 series phones for the first time at its Galaxy Unpacked event on January 22. With the diversification of market demand and the increasing pursuit of consumers for mobile phone performance and beauty, the form of smart phones is constantly evolving, and the material and process of structural parts have become the focus of industry innovation. Aibang has a mobile phone innovation material process exchange group, welcome to long press the QR code below to join the group chat, to discuss the development trend of mobile phone industry innovation.