Several major trends in the development and innovation of PCB technology in circuit board factories

The development of electronic technology is advancing at an unprecedented pace. Only by recognizing the development trend of PCB technology and actively developing and innovating production techniques can circuit board manufacturers find a way out in the highly competitive PCB industry. Circuit board manufacturers should always maintain a sense of development. The following are several views on the development of PCB production and processing technology:

1. 1. Develop component embedding technology

   Component embedding technology is a huge transformation of PCB functional integrated circuits. The formation of semiconductor devices (referred to as active components), electronic components (referred to as passive components) or passive component functions in the inner layer of PCBS, known as "component embedded PCBS", has begun mass production. However, for the development of circuit board manufacturers, it is also an urgent task to first solve the problems of analog design methods, production technology, as well as quality inspection and reliability guarantee. PCB factories need to increase resource investment in systems including design, equipment, testing and simulation in order to maintain strong vitality.

2. 2. HDI technology remains the mainstream development direction

   HDI technology has promoted the development of mobile phones, driven the growth of LSI and CSP chips (packages) for information processing and basic frequency control functions, as well as template substrates for circuit board packaging. It has also facilitated the development of PCBS. Therefore, circuit board manufacturers need to innovate PCB production and processing technologies along the HDI path. As HDI embodies the most advanced technologies of contemporary PCBS, it brings fine conductors and tiny hole diameters to PCB boards. The application of HDI multi-layer boards in terminal electronic products - mobile phones (mobile phones) are a model of the cutting-edge development technology of HDI. In mobile phones, micro-fine wires (50μm - 75μm/50μm - 75μm, wire width/spacing) on PCB motherboards have become mainstream. In addition, the conductive layer and the thickness of the board have become thinner. The miniaturization of conductive patterns brings about high-density and high-performance electronic devices.

3. 3. Continuously introduce advanced production equipment and update the circuit board manufacturing process

   HDI manufacturing has matured and become increasingly sophisticated. With the development of PCB technology, although the subtractive manufacturing method, which was commonly used in the past, still dominates, low-cost processes such as addition and semi-addition methods have begun to emerge. A new manufacturing process method for flexible boards that uses nanotechnology to metallize holes and simultaneously form conductive patterns on PCBS. High-reliability and high-quality printing methods, inkjet PCB technology. Produce fine wires, new high-resolution photomasks and exposure devices, as well as laser direct exposure devices. Uniform and consistent plating equipment. Production component embedding (passive and active components) manufacturing and installation equipment and facilities.

4. 4. Develop PCB raw materials with higher performance

   Whether it is rigid PCB circuit board or flexible PCB circuit board materials, with the global lead-free electronic products, there is a demand for these materials to have higher heat resistance. Therefore, new types of materials with high Tg, small thermal expansion coefficient, small dielectric constant, and excellent dielectric loss tangent are constantly emerging.

5. 5. The prospects for photoelectric PCBS are broad

   The photoelectric PCB circuit board transmits signals by using the optical path layer and the circuit layer. The key to this new technology lies in manufacturing the optical path layer (optical waveguide layer). It is an organic polymer formed by methods such as lithography, laser ablation, and reactive ion etching. At present, this technology has been industrialized in Japan, the United States and other countries. As a major manufacturing country, Chinese circuit board manufacturers should also actively respond and keep pace with the development of science and technology.