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VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA

Product Details

Place of Origin: Japan

Brand Name: OMRON

Model Number: VT-X750

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 PCS

Price: USD+negotiable+pcs

Packaging Details: 1650*2100*1700mm

Delivery Time: 1-7 days

Payment Terms: T/T

Supply Ability: 1+pcs+per days

Get Best Price
Product Details
Highlight:

X-ray CT inspection system

,

automated CT inspection system

,

High speed CT inspection system

Model:
VT-X750
Inspection Object:
BGA/CSP, Inserted Components, SOP, QFP, Transistors, R/C Chips, Bottom-side Terminal Components, QFN, Power Devices, POP, Press-fit CN, Etc
Inspection Items:
Void, Open, Non-wet, Solder Volume, Shifting, Foreign Object, Bridging, Solder Fillet, TH Solder Filling, Solder Ball, Etc. (selectable To Applications)
Imaging System Method:
3D-slice Imaging By Using Parallel CT
Imaging System X-ray Source:
Micro-fucus Closed Tube
Imaging System X-ray Detector:
Flat Panel Detector
PCBA Size:
50x50~610x515mm (2x2 To 24x20 Inch), Thickness:0.4~5.0mm (0.4~3.0mm In 3μm Resolution)
PCBA Weight:
Less Than 4.0 Kg, Less Than 8.0 Kg (*option)
PCBA Component Clearance *Maximum:
Top: 90 Mm (*option), Bottom: 40 Mm
PCBA Warpage:
Less Than 2.0 Mm (Less Than 1.0 mm In 3μm Resolution)
Main Body Footprint:
1,550(W) X 1,925(D) X 1,645(H) Mm
Main Body Weight:
Approx. 3,100kg
Model:
VT-X750
Inspection Object:
BGA/CSP, Inserted Components, SOP, QFP, Transistors, R/C Chips, Bottom-side Terminal Components, QFN, Power Devices, POP, Press-fit CN, Etc
Inspection Items:
Void, Open, Non-wet, Solder Volume, Shifting, Foreign Object, Bridging, Solder Fillet, TH Solder Filling, Solder Ball, Etc. (selectable To Applications)
Imaging System Method:
3D-slice Imaging By Using Parallel CT
Imaging System X-ray Source:
Micro-fucus Closed Tube
Imaging System X-ray Detector:
Flat Panel Detector
PCBA Size:
50x50~610x515mm (2x2 To 24x20 Inch), Thickness:0.4~5.0mm (0.4~3.0mm In 3μm Resolution)
PCBA Weight:
Less Than 4.0 Kg, Less Than 8.0 Kg (*option)
PCBA Component Clearance *Maximum:
Top: 90 Mm (*option), Bottom: 40 Mm
PCBA Warpage:
Less Than 2.0 Mm (Less Than 1.0 mm In 3μm Resolution)
Main Body Footprint:
1,550(W) X 1,925(D) X 1,645(H) Mm
Main Body Weight:
Approx. 3,100kg
Product Description
High Speed Automated X-Ray CT Inspection System
VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 0
VT-X750 Case Study
The X750 is designed for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components, delivering high-definition, high-quality inspection using full 3D-CT technology. In recent years, the VT-X750 has been extensively used for:
  • Solder void and filling inspection of through-hole connectors in power device final assembly (IGBTs, MOSFETs)
  • Integrated machine and electric power component inspection
  • Applications in aerospace, industrial equipment, and semiconductor industries
VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 1 VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 2
In-line Full Inspection Coverage [Omron Patent]
The VT-X750 represents a significant advancement over previous Omron 3D-CT technology, establishing it as the fastest X-Ray inspection system available*.
Key improvements include:
  • Enhanced automated inspection logic for various components (IC heal fillets, PoP devices, through-hole components, press-fit connectors)
  • Increased inspection speed enabling complete in-line coverage via 3D-CT methodology
* Based on internal investigation conducted October 2021
Time measurement based on full PCB inspection of M-size substrate (excluding load/unload time). Includes 3D inspection of both board sides with 2 BGA components (2000-3000 pins each) or SiP.
VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 3 VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 4
Visualize Solder Joint Strength
OMRON's proprietary 3D-CT reconstruction algorithms deliver exceptional solder shape recognition and defect detection capabilities. The quantitative analysis enables:
  • Automated inspection processes with minimized defect escape risk
  • Fast, repeatable operation for consistent quality assurance
VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 5
Design Constraint Free Operation
Omron's 3D-CT technology overcomes the challenges posed by dense and dual-sided board designs, eliminating traditional X-Ray inspection limitations.
VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 6
Advanced Inspection Features
  • Auto-Judge Criteria Setting [Patent Pending]: Reduces programmer dependency through dynamic analysis using Omron AI with quantitative decision making
  • Integrated 3D Cross-Sectional Display: Simplifies inspection criteria understanding
  • Rapid Program Creation [Omron Patent]: AI-assisted new program development with automated generation from CAD data
  • Accelerated Simulation [Omron Patent]: Determines optimal tact and exposure dosage for each component
VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 7 VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 8
Zero Downtime Operation
Omron's global support infrastructure ensures continuous production with comprehensive maintenance services including:
  • Machine monitoring for predictive maintenance
  • Remote access for emergency support
VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 9 VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 10
Radiation Exposure Reduction
The system incorporates advanced radiation management technologies:
  • High-speed, low-radiation imaging with standard protective filters
  • Parts radiation exposure simulator [Omron Patent] for accurate top/bottom side PCB component exposure prediction
VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA 11
Automated X-ray Inspection, CT Imaging Technology, Inline X-ray Inspection, 3D X-ray CT Systems, High-Speed CT Scanning, X-ray Inspection for Electronics, Non-Destructive Testing (NDT), X-ray Computed Tomography Applications, Quality Assurance in Manufacturing, Automated Defect Detection, X-ray Imaging Software, Real-Time X-ray Analysis, High-Resolution X-ray Imaging, X-ray Inspection Systems for Semiconductors, AI in X-ray Inspection, Robotic Sample Loading Systems, X-ray CT for Aerospace Components, High-Throughput Inspection Solutions, Precision Metrology with X-ray CT, Advanced Imaging Techniques in Manufacturing