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Home > Products > SMT Pick And Place Machines > VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA

VT-X750 High-Speed 3D-CT X-Ray Inspection System for PCBA

Product Details

Place of Origin: Japan

Brand Name: OMRON

Model Number: VT-X750

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 PCS

Price: USD+negotiable+pcs

Packaging Details: 1650*2100*1700mm

Delivery Time: 1-7 days

Payment Terms: T/T

Supply Ability: 1+pcs+per days

Get Best Price
Product Details
Highlight:

X-ray CT inspection system

,

automated CT inspection system

,

High speed CT inspection system

Model:
VT-X750
Inspection Object:
BGA/CSP, Inserted Components, SOP, QFP, Transistors, R/C Chips, Bottom-side Terminal Components, QFN, Power Devices, POP, Press-fit CN, Etc
Inspection Items:
Void, Open, Non-wet, Solder Volume, Shifting, Foreign Object, Bridging, Solder Fillet, TH Solder Filling, Solder Ball, Etc. (selectable To Applications)
Imaging System Method:
3D-slice Imaging By Using Parallel CT
Imaging System X-ray Source:
Micro-fucus Closed Tube
Imaging System X-ray Detector:
Flat Panel Detector
PCBA Size:
50x50~610x515mm (2x2 To 24x20 Inch), Thickness:0.4~5.0mm (0.4~3.0mm In 3μm Resolution)
PCBA Weight:
Less Than 4.0 Kg, Less Than 8.0 Kg (*option)
PCBA Component Clearance *Maximum:
Top: 90 Mm (*option), Bottom: 40 Mm
PCBA Warpage:
Less Than 2.0 Mm (Less Than 1.0 mm In 3μm Resolution)
Main Body Footprint:
1,550(W) X 1,925(D) X 1,645(H) Mm
Main Body Weight:
Approx. 3,100kg
Model:
VT-X750
Inspection Object:
BGA/CSP, Inserted Components, SOP, QFP, Transistors, R/C Chips, Bottom-side Terminal Components, QFN, Power Devices, POP, Press-fit CN, Etc
Inspection Items:
Void, Open, Non-wet, Solder Volume, Shifting, Foreign Object, Bridging, Solder Fillet, TH Solder Filling, Solder Ball, Etc. (selectable To Applications)
Imaging System Method:
3D-slice Imaging By Using Parallel CT
Imaging System X-ray Source:
Micro-fucus Closed Tube
Imaging System X-ray Detector:
Flat Panel Detector
PCBA Size:
50x50~610x515mm (2x2 To 24x20 Inch), Thickness:0.4~5.0mm (0.4~3.0mm In 3μm Resolution)
PCBA Weight:
Less Than 4.0 Kg, Less Than 8.0 Kg (*option)
PCBA Component Clearance *Maximum:
Top: 90 Mm (*option), Bottom: 40 Mm
PCBA Warpage:
Less Than 2.0 Mm (Less Than 1.0 mm In 3μm Resolution)
Main Body Footprint:
1,550(W) X 1,925(D) X 1,645(H) Mm
Main Body Weight:
Approx. 3,100kg
Product Description
High Speed Automated X-Ray CT Inspection System
VT-X750 X-Ray CT Inspection System in operation
VT-X750 Case Study
The X750 is designed for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components, delivering high-definition, high-quality inspection using full 3D-CT technology. In recent years, the VT-X750 has been extensively used for:
  • Solder void and filling inspection of through-hole connectors in power device final assembly (IGBTs, MOSFETs)
  • Integrated machine and electric power component inspection
  • Applications in aerospace, industrial equipment, and semiconductor industries
Close-up of X-Ray CT inspection process In-line inspection system overview
In-line Full Inspection Coverage [Omron Patent]
The VT-X750 represents a significant advancement over previous Omron 3D-CT technology, establishing it as the fastest X-Ray inspection system available*.
Key improvements include:
  • Enhanced automated inspection logic for various components (IC heal fillets, PoP devices, through-hole components, press-fit connectors)
  • Increased inspection speed enabling complete in-line coverage via 3D-CT methodology
* Based on internal investigation conducted October 2021
Time measurement based on full PCB inspection of M-size substrate (excluding load/unload time). Includes 3D inspection of both board sides with 2 BGA components (2000-3000 pins each) or SiP.
Inspection speed comparison chart 3D-CT reconstruction visualization
Visualize Solder Joint Strength
OMRON's proprietary 3D-CT reconstruction algorithms deliver exceptional solder shape recognition and defect detection capabilities. The quantitative analysis enables:
  • Automated inspection processes with minimized defect escape risk
  • Fast, repeatable operation for consistent quality assurance
Solder joint strength visualization
Design Constraint Free Operation
Omron's 3D-CT technology overcomes the challenges posed by dense and dual-sided board designs, eliminating traditional X-Ray inspection limitations.
Dual-sided board inspection example
Advanced Inspection Features
  • Auto-Judge Criteria Setting [Patent Pending]: Reduces programmer dependency through dynamic analysis using Omron AI with quantitative decision making
  • Integrated 3D Cross-Sectional Display: Simplifies inspection criteria understanding
  • Rapid Program Creation [Omron Patent]: AI-assisted new program development with automated generation from CAD data
  • Accelerated Simulation [Omron Patent]: Determines optimal tact and exposure dosage for each component
Program creation interface Global support network diagram
Zero Downtime Operation
Omron's global support infrastructure ensures continuous production with comprehensive maintenance services including:
  • Machine monitoring for predictive maintenance
  • Remote access for emergency support
Maintenance service overview Radiation reduction technology
Radiation Exposure Reduction
The system incorporates advanced radiation management technologies:
  • High-speed, low-radiation imaging with standard protective filters
  • Parts radiation exposure simulator [Omron Patent] for accurate top/bottom side PCB component exposure prediction
Radiation exposure simulation interface
Automated X-ray Inspection, CT Imaging Technology, Inline X-ray Inspection, 3D X-ray CT Systems, High-Speed CT Scanning, X-ray Inspection for Electronics, Non-Destructive Testing (NDT), X-ray Computed Tomography Applications, Quality Assurance in Manufacturing, Automated Defect Detection, X-ray Imaging Software, Real-Time X-ray Analysis, High-Resolution X-ray Imaging, X-ray Inspection Systems for Semiconductors, AI in X-ray Inspection, Robotic Sample Loading Systems, X-ray CT for Aerospace Components, High-Throughput Inspection Solutions, Precision Metrology with X-ray CT, Advanced Imaging Techniques in Manufacturing