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SONY SI-F130 SMT Pick And Place Machine 25900 CPH High Precision

Name: SONY SI-F130 SMT Pick And Place Machine 25900 CPH High Precision
Brand: Global Soul Limited
SKU: SI-F130
Price: 3,000.00 USD
Availability: InStock

Product Details

Place of Origin: Japan

Brand Name: SONY

Model Number: SI-F130

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 PCS

Price: USD+negotiable+pcs

Packaging Details: 1500mm*1600mm*1750mm

Delivery Time: 1-7 days

Payment Terms: T/T

Supply Ability: 1+pcs+per days

Get Best Price

Product Details

Product Description

Product Details

Highlight: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                High Precision SMT Pick Place Machine, Soldering SMT Pick Place Machine
                              

Equipment Model:	SI-F130	Soldering Head:	1 Head & 12 Nozzles
Feeder Quantity:	50	Vision System:	Optical Recognition System
Component Size:	Max: 6mm	Soldering Accuracy:	50um (CPK 1.0 Or Above)
PCB Size:	50mm50mm - 360mm1200mm	Component Thickness:	0402 (01005) - 12mm IC (mobile Camera) 6mm - 25mm IC (fixed Camera)
PCB Thickness:	0.5mm To 2.6mm	Operating Environment:	Ambient Temperature 15℃~30℃, Environmental Humidity 30%~70% (no Condensation Allowed)
Working Noise:	35-65 Decibels	Correction Method:	Machine Vision System, Multi-point MARK Vision Correction
Drive System:	AC Servo, AC Motor	Data Transmission:	USB Interface Input (EXCEL Document Format)
Operating System:	Chinese, English, Japanese Interface (WINDOWS System Control Platform)	Control Mode:	Fully Automatic
Soldering Speed:	0.139 Seconds (25900 CPH)	Equipment Dimensions (WDH):	1220mm X 1400mm X 1545mm
Equipment Weight:	1560KG

Equipment Model:	SI-F130
Soldering Head:	1 Head & 12 Nozzles
Feeder Quantity:	50
Vision System:	Optical Recognition System
Component Size:	Max: 6mm
Soldering Accuracy:	50um (CPK 1.0 Or Above)
PCB Size:	50mm50mm - 360mm1200mm
Component Thickness:	0402 (01005) - 12mm IC (mobile Camera) 6mm - 25mm IC (fixed Camera)
PCB Thickness:	0.5mm To 2.6mm
Operating Environment:	Ambient Temperature 15℃~30℃, Environmental Humidity 30%~70% (no Condensation Allowed)
Working Noise:	35-65 Decibels
Correction Method:	Machine Vision System, Multi-point MARK Vision Correction
Drive System:	AC Servo, AC Motor
Data Transmission:	USB Interface Input (EXCEL Document Format)
Operating System:	Chinese, English, Japanese Interface (WINDOWS System Control Platform)
Control Mode:	Fully Automatic
Soldering Speed:	0.139 Seconds (25900 CPH)
Equipment Dimensions (WDH):	1220mm X 1400mm X 1545mm
Equipment Weight:	1560KG

Product Description

SONY SI-F130 SMT Pick And Place Machine

Key Specifications

Attribute	Value
Equipment Model	SI-F130
Soldering Head	1 head & 12 nozzles
Feeder Quantity	50
Vision System	Optical recognition system
Component Size	Max: 6mm
Soldering Accuracy	50μm (CPK 1.0 or above)
PCB Size	50mm × 50mm - 360mm × 1200mm
Component Thickness	0402 (01005) - 12mm IC (mobile camera) 6mm - 25mm IC (fixed camera)
PCB Thickness	0.5mm to 2.6mm
Operating Environment	Ambient temperature 15℃~30℃, humidity 30%~70% (no condensation)
Working Noise	35-65 decibels
Correction Method	Machine vision system, multi-point MARK vision correction
Drive System	AC servo, AC motor
Data Transmission	USB interface input (EXCEL document format)
Operating System	Chinese, English, Japanese interface (WINDOWS system control platform)
Control Mode	Fully automatic
Soldering Speed	0.139 seconds (25900 CPH)
Equipment Dimensions (W×D×H)	1220mm × 1400mm × 1545mm
Equipment Weight	1560KG

Product Highlights

High-speed placement capability: 25,900 CPH (0.139 seconds per chip)
Advanced CCD camera with unique image recognition system for precise component identification
Globally unique rotating planetary type mounting head with 12 suction nozzles
Exceptional mounting accuracy of 50μm with CPK 1.0 or above
Compact footprint with low power consumption and minimal noise (35-65 dB)
Ideal for high-speed surface mounting of 1.2-meter LED light beads
Multi-language interface (Chinese, English, Japanese) on Windows control platform

Technical Description

The SONY 130 series surface mounters, including the F130 model, represent high-quality SMT equipment with exceptional performance. Featuring a planetary-type mounting head with 12 suction nozzles, these machines deliver both speed and precision. The optical recognition system ensures accurate component placement, while the compact design offers space efficiency without compromising on capability. With its fully automatic control mode and versatile PCB handling, the SI-F130 is particularly well-suited for LED light bead applications and other high-speed surface mounting requirements.

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Contacts: Mr. Yi Lee

Tel: 86-755-27962186

Fax: 86-0755-27678283

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