Global Soul Limited Company News

Riyadh, 9 February 2025 - Alat Enat, an innovative company committed to transforming global industries by creating a world-class manufacturing hub in Saudi Arabia, and global technology leader Lenovo Group today held a groundbreaking ceremony for a new manufacturing base in Riyadh. Located within the Riyadh Complex campus operated by the Saudi Special Integrated Logistics Zone (SILZ), the new facility will cover an area of 200,000 square meters and will be designed, built and operated with a high standard of sustainability, with an expected annual production capacity of millions of "made in Saudi Arabia" laptops, desktops and servers. After obtaining shareholder and regulatory approval, the two parties announced on January 8 the completion of the three-year US $2 billion non-interest-bearing convertible bond investment and the strategic cooperation agreement announced in May 2024. This important development marks a solid step forward in the strategic cooperation between the two parties, and Lenovo's growth in Saudi Arabia and the Middle East region is expected to accelerate again. Amit Midha, CEO of Alat Enet, attended the ceremony with Yang Yuanqing, CEO of Lenovo Group. Yang Yuanqing (sixth from left), CEO of Lenovo Group, and Amit Midha (fifth from left), CEO of Alat Enat, lay the foundation stone of the new plant in Riyadh According to the plan, the new plant is expected to start production in 2026 and will be located in the Saudi Special Integrated Logistics Zone (SILZ), just a 15-minute drive from Riyadh International Airport. When completed, the plant will become an integral part of Lenovo's global manufacturing network with manufacturing sites in more than 30 markets, including China, Argentina, Brazil, Germany, Hungary, India, Japan, Mexico and the United States. At the same time, the new facility will enhance the resilience and flexibility of its global supply chain, while providing more agile service to customers in the Middle East and Africa region. Lenovo Group has been praised for its excellence in global supply chain operations and has been ranked among the top supply chains in various industries around the world - ranked 10th in Gartner's Global Supply Chain Top 25 list. The new facility in Riyadh will further expand Lenovo's presence in the region, bringing industry-leading products, services and solutions to the local market more quickly, and taking full advantage of the high growth opportunities in the information technology and enterprise services industry in the Middle East and Africa. This strong strategic partnership and investment will help Lenovo further strengthen its global presence and fully grasp the huge growth opportunities in Saudi Arabia and the Middle East - Africa region. We are very pleased to form a long-term strategic partnership with Alat Enat, and with our leading global supply chain and innovation capabilities, Lenovo will help Saudi Arabia achieve its Vision 2030 of economic diversification, industrial development, technological innovation and job growth." -- Yang Yuanqing, Chairman and CEO of Lenovo Group We are very proud to be a strategic investor in Lenovo Group and work with them to help them continue to maintain their leading position in the global technology industry. Alat and Lenovo have also entered into a business development and expansion agreement to leverage Alat's extensive local network and rich market insights. With the establishment of Lenovo's regional headquarters in Riyadh and a world-class manufacturing base in Saudi Arabia powered by clean energy, we look forward to seeing Lenovo further unlock its potential in the Middle East and Africa region." -- Amit MidhaAlat, CEO of Ennett On the same day, Yang Yuanqing also attended LEAP 2025, the largest science and technology event in the Middle East, in Riyadh. Yang Yuanqing said at the opening ceremony, "Lenovo Group will also set up its regional headquarters for the Middle East and Africa in Riyadh and establish a new flagship retail store to be closer to local customers." We are proud to embark on a new chapter of growth, innovation and collaboration, and look forward to working with all parties to build a smarter future." Yang Yuanqing attended LEAP 2025, the largest technology event in the Middle East, held in Riyadh The Middle East and Africa market is becoming a competitive hot spot for global IT companies, and Saudi Arabia is the economic and technological hub of the Middle East region. This year's LEAP 2025 has attracted many of the world's leading technology companies, including Lenovo Group, to participate in the exhibition, and the Middle East craze continues to heat up. Yang Yuanqing attended LEAP 2025, the largest technology event in the Middle East, held in Riyadh The investment of Lenovo Group and Alat Enat in Saudi Arabia will greatly contribute to the achievement of Saudi Arabia's economic goals and is highly aligned with the strategic plan of Saudi Arabia's Public Investment Fund (PIF) and Saudi Arabia's Vision 2030. The partnership is expected to create up to 15,000 direct jobs and 45,000 indirect jobs, laying a solid foundation for sustainable growth and national development in Saudi Arabia. By 2030, the cooperation between the two sides is expected to contribute $10 billion to Saudi Arabia's non-oil GDP. The Lenovo investment is one of Alat Enat's many investment plans through 2030, aiming to build on Saudi Arabia's rapid development momentum in the technology sector and enhance the kingdom's capabilities in this field. Alat Enat will also further empower private enterprises and optimize the business environment through its own business systems and partnerships with leading global technology manufacturers. Today, Alat is focusing on building innovation and manufacturing capabilities in nine business segments, including semiconductors, smart devices, smart buildings, smart appliances, smart healthcare, electrification, advanced industries, next generation and AI infrastructure. The company will produce 34 product categories in these nine areas and has hired top global industry experts to lead each business segment.

IPC APEX EXPO 2019 Closed Premier Electronics Industry Conference and Exhibition Dates: Saturday, January 26, 2019 - Thursday, January 31, 2019 Venue: San Diego Convention Center, San Diego CA, United States

As DeepSeek continues to be popular, people are not satisfied with the use of DeepSeek on the web and APP side, and try to localize DeepSeek. Localisation involves installing DeepSeek's large AI models on local computers, without relying on networks or cloud services. Reporters searched video websites and found that many users uploaded tutorials on how to deploy DeepSeek to local computers, and many videos were viewed more than 1 million times. DeepSeek sparks local deployment boom   Teaching people to deploy DeepSeek has also become a business. Through searching for "DeepSeek local deployment" on the e-commerce platform, the reporter found that many shops have opened up DeepSeek local deployment business, and the unit price of these services ranges from a few dollars to dozens of dollars, and some of these services have recently been purchased by 1,000 people.   An AI enthusiast who has tried to deploy told reporters that the response speed of the network side is slow, and when the traffic is too large, there is often "the server is busy, please try again later." In order to get a better experience, he tried to use DeepSeek for local deployment. It is understood that local deployment does not need to master deep programming knowledge, through the tutorial step by step, you can deploy successfully. Zhang Yi, chief analyst at IIMedia Consulting, told reporters: "Local deployment supports individuals to make some customized modifications to DeepSeek according to their needs, which is also one of the driving forces." Zhang Yi added that personal data in the local deployment does not go to the cloud, which can meet the privacy needs. DeepSeek published models with varying numbers of parameters, from as small as 1 billion parameters to as large as 671 billion parameters, and the larger the parameters, the greater the computational resources required. Due to the limited computing resources of devices such as personal computers and mobile phones, the 671 billion parameter DeepSeek model often cannot be deployed locally. "A typical laptop can only deploy a billion-parameter version, but a PC with a good GPU or high memory (say 32GB) can run a 7-billion-parameter version of DeepSeek." The AI technology enthusiasts told reporters. In terms of the effect of local deployment, the smaller the version of parameters, the worse the answer quality of the large model. "I tried the 7 billion parameter version of DeepSeek deployed locally, and it ran smoothly, but the answer quality was much worse than the cloud version, and the effect of the smaller parameter version was even worse." The above AI enthusiasts said. Under the heat of DeepSeek's local deployment, AI PCS that specifically add NPU to PCS are expected to usher in sales growth. It is understood that Huawei, Lenovo and other computer brands have launched AI PC, this new PC is equipped with specialized processing of local deployment of AI large model computing processor chips, these processor chips are provided by Intel, AMD, Qualcomm and other chip factories. These AI PCS can be deployed locally and run smoothly tens of billions of parameters of the AI large model, such as this CES 2025, AMD launched Ryzen AI max series processors, saying that the computer can run 70 billion parameters of the AI large model. However, the AI PC equipped with the processor chip is expensive, and it is understood that the price of an Asus game book is nearly 15,000 yuan. In addition, some people have questioned that spending a lot of money to buy AI PCS, carry out local deployment of AI large models, and achieve functions that are highly overlapping with cloud AI large models, AI PC is just a gimmick of manufacturers. Enterprises try to deploy DeepSeek locally In addition to individuals opening DeepSeek local deployment, enterprises are also beginning to try. On the first day of the working day of the Year of the Snake, Wang Jiahui, the founder of Timwei Ao, released a wechat circle of friends: "DeepSeek large model local computer deployment experience success, import coal mine knowledge safety database for questions and answers, the next step is to combine it with industrial field operations." Timviao is a company that provides industrial management solutions for the mining industry, oil industry and other industries, using AR glasses and AI software to provide real-time observation and guidance for the maintenance, quality inspection and troubleshooting of industrial field personnel. Wang Jiahui told reporters that only Tongyi Qian ask AI large model to create a local knowledge base question and answer, in view of DeepSeek better reasoning ability, he is considering DeepSeek and business deep integration. "On the basis of DeepSeek, we fine-tune specific parameters or secondary develop them to fit IT systems and implement new functions based on the needs and data of specific industrial scenarios." "Our goal is to deploy DeepSeek locally and interact with cameras in the field to better identify dangerous operations on site, and to implement functions such as hidden danger detection and product quality inspection," Wang told reporters. He believes that whether industrial customers adopt on-premises deployment depends mainly on the confidentiality of the data. "Some state-owned enterprises, military and medical equipment companies often ask us to implement local deployment solutions because they have high requirements for data security." He further added: "Non-secret scenarios can use cloud access solutions, although there will be operational delays, but the impact is small, and the solution price is lower." For on-premises deployments, these customers require servers equipped with 4-card or 8-card Gpus to implement DeepSeek local inference services. "My customers generally choose Nvidia's consumer graphics cards to configure their servers, such as the 4090, for better value for money." "If customers have domestic configuration requirements, we will buy more expensive domestic GPU graphics cards," Wang said. In addition to industry, more and more enterprises are starting to deploy DeepSeek locally. Sinolink Securities said that DeepSeek can be applied to information retrieval, document processing, industry research, market research and other scenarios. In addition, enterprises in the medical industry, network security and other industries have also recently deployed DeepSeek locally, including Wanda Information and Qihoo 360. Zhang Yi told reporters that as enterprises expand their requirements for localized deployment, the demand for domestic reasoning computing power will increase, and the United States bans high-end chips, domestic chip computing power companies will usher in greater opportunities. AI applications will explode Qualcomm CEO Cristiano Amon said that DeepSeek-R1 is a turning point for the AI industry, AI reasoning will migrate to the end side, AI will become smaller, more efficient, and more customized, and AI large models and AI applications based on specific scenarios will appear. China Aviation Securities Research report believes that DeepSeek-R1 shows that the end-to-end AI deployment will become more inclusive, and the era of all things intelligent will accelerate. Open source will entice more developers to build apps on top of DeepSeek. Domestic GPU cards such as Huawei Centeng, Moore Thread, Bishi Technology, and Daywise Core have been adapted to DeepSeek; Tencent Cloud, Alibaba Cloud, mobile cloud, Huawei Cloud and other cloud manufacturers also completed the adaptation with DeepSeek. The adaptation optimization of domestic computing power is expected to further reduce the cost of inference side. As the domestic app payment habit is not yet fully mature, the commercialization of AI applications may be hindered. Meng Can, chief of National Finance Computer, believes that the United States has a 10-year or even 20-year basis for application payment, which is helpful for the commercialization of AI applications, while the domestic market will be slow due to the lack of such a foundation. However, the country is constantly catching up, and the time schedule is expected to be reduced to less than half a year.

What is the difference between lead-free reflow soldering and leaded soldering? First of all, we should understand that the whole process of lead-free welding is longer than that of lead welding, and the welding temperature required is also higher, mainly because the melting point of lead-free solder is generally higher than the melting point of lead solder, and the wettability will be worse. So, what do you need to pay attention to in the lead-free reflow welding process? Before the lead-free reflow welding begins, we first need to choose the right welding material, because in terms of its welding process, the selection of lead-free solder, solder paste, flux and other materials is particularly important and quite difficult. In the selection process of these materials, we need to take into account the type of welding components, the type of circuit board and its surface coating status, which are generally selected by experience. After selecting the welding material, we also need to choose the welding method, which generally needs to be selected according to the specific situation, such as in terms of component type, reflow welding method can be used for some surface mounted components, and wave soldering or spray welding can be selected for through hole inserted components. Here we also roughly introduce several common welding applications, for wave soldering, it is mainly suitable for some of the whole board through the hole insert components suitable for welding, dip welding method is more suitable for some of the whole board is relatively small, or there are parts of the board through the hole insert components when welding, Spray welding is more common in the welding of individual components on some plates or a small number of through-hole inserts. After the welding method is selected, the type of welding process is determined, at this time, we only need to select the equipment according to the welding process and the related process control wants to check together. In addition, the manufacturer of lead-free reflow welding also needs to continuously improve the lead-free welding process, so that the product can achieve higher requirements in quality and pass rate. For any lead-free welding process, changing its welding materials and updating equipment can effectively improve its welding performance.

Reflow daily maintenance content: (1) Check whether there is grease in the transmission chain, and add grease in time if necessary. (2) Check that there is no running edge in the transport network, and notify HB in time if there is running edge. (3) Check the reflow furnace inlet mesh belt drive wheel is not shifted, if there is a shift can be adjusted by loosening the screw - adjusting - locking the screw step. (4) Check whether the net belt drive roller at the outlet of reflow furnace is loose, if it is loose, it can be adjusted according to the steps of loosening the screws - adjusting - locking screws. (5) Check whether the high temperature oil in the oil cup is appropriate, the oil surface should be 5mm from the mouth of the cup, if necessary, add high temperature oil in time. Reflow maintenance content: (1) Check the surface of the transport network belt for dirt adhesion, if there is loot adhesion in time with alcohol scrub. (2) Check the guide rail chain groove for foreign bodies, if there are foreign bodies in time to remove the chain with alcohol scrub. (3) Check whether the bearings of the driven gear of the transport chain are flexible, and add lubricating oil in time when necessary. (5) Check whether there is grease on the surface of the lead rod of the head component and no foreign matter, wipe it clean in time when necessary, and add grease. (6) Check whether there is FLUX and dust on the rectifier plate in each area of the furnace, and clean it with alcohol in time if there is dust. (7) Check whether the lifting motor of the furnace lifting system is running without vibration and noise, if there is vibration or noise, it should be replaced in time (8) Check whether the filter of the exhaust device is blocked, if there is blockage, alcohol should be used to clean. (9) Check whether there is FLUX adsorption on the rectifier plate in the cooling area of the cooling system. If there is FLUX, it should be cleaned with alcohol in time. (10) Check that the surface of the photoelectric switch at the transport entrance has dust-free accumulation. If there is dust accumulation, it should be wiped clean with a soft dry rag in time. (11) Check whether the surface of the PC and UPS is clean. If there is dust accumulation, it should be wiped with a soft dry cloth in time. Monthly maintenance contents of reflow welding: (1) Check whether there is vibration and noise in the transportation process, and notify HB in time if necessary. (2) Check whether the transport motor fixing screw is loose, if it is loose, lock the screw. (3) Check whether the tension of the transmission chain is appropriate, and adjust the motor positioning screw in time if necessary. (4) Check whether there is coke and black powder on the transport chain, if there is, it should be removed in time and cleaned with diesel oil. (5) Check the positioning of the synchronous shaft of the width adjustment in the track of the active end, and whether the fixed block is loose. If it is loose, it should be locked in time. (6) Check whether the hot air motor positioning screw is loose, if loose, it should be locked in time. (7) Check whether there is dust and foreign matter in the control box of the electrical system. If there is foreign matter, blow out dust and foreign matter with the same pressure air after power off.

Reflow welding system is to extract high temperature air containing a lot of flux from the preheating zone, reflow zone and cooling zone, after external cooling system, the clean gas is sent back to the furnace. Notes for lead-free reflow curve setting 1, increase the preheating temperature In lead-free reflow welding, the preheating zone temperature of the reflow furnace should be higher than that of the preheating temperature of the tin/lead alloy reflow. It is usually about 30 ° C high, and the purpose of increasing the temperature of the preheating zone at 170 ° C-190 ° C (the traditional preheating temperature is generally 140 ° C-160 ° C) is to reduce the peak temperature to reduce the temperature difference between components. 2. Extend the preheating time Appropriate extension of the preheating time, preheating too fast on the one hand will cause thermal shock, is not conducive to reducing the temperature difference between the components in the formation of peak reflow temperature. Therefore, the preheating time of the preheating is properly extended, so that the temperature of the component to be welded smoothly rises to the predetermined preheating temperature. 3, extend the trapezoidal temperature curve of the reflow zone Extended trapezoidal temperature curve in the recirculation zone. While controlling the maximum reflow temperature, increase the temperature curve width of the reflow area, extend the peak time of small heat capacity components, so that the components with large and small heat capacity can reach the required reflux temperature, and avoid overheating of small components. 4, adjust the consistency of the temperature curve When testing and adjusting the temperature curve, although the temperature curve of each test point has a certain dispersion, it is impossible to be completely consistent, but it should be carefully adjusted to make the temperature curve of each test point as consistent as possible.

In the reflow welding process, welding large heat-absorbing PCB products (especially with metal fixtures), the cooling process has a great impact on the welding quality, but also a process that requires very high temperature control ability, if the cooling speed is too slow during the cooling process, it will lead to low solder joint strength, high outlet temperature, and even in a semi-molten state. Affect the next process of online equipment, such as the use of online AOI. Haobao Reflow adopts unique structural design and cooling technology to achieve fast cooling process, ensuring high cooling slope and low exit temperature of PCB products

The reflow furnace is the equipment with the largest power consumption in SMT. After expert testing, the energy consumption of the existing reflow furnace for work (heating PCB) is not very high, not exceeding 40% of the total energy consumption; Where did the other 60% go? The main energy consumption is analyzed as follows: 1--> Body absorbs heat energy. 2--> Shell radiates heat. 3--> Heat energy taken away by cooling zone and exhaust gas. 4--> Power consumption of reflux fan, transmission network chain and control system. 5--> The heat convection imbalance in the temperature zone causes the heat lost from the inlet or outlet of the plate. Energy-saving technologies for reflow furnaces include: 1. Use high temperature resistant ceramic fiber cotton to strengthen heat insulation of furnace. 2. Adjust the airflow balance according to the temperature difference in the temperature zone. 3. Install the energy-saving control system to automatically adjust the operating parameters according to the predetermined time of multiple stages during standby. 4. Install a speed regulating device to control the speed of the reflux fan, and automatically adjust the speed for about 10 minutes on standby. The running speed of the motor will be reduced or stopped according to the actual situation, which will minimize the consumption and improve the power factor of the motor. 5. Install the electric air valve to automatically control the opening and closing according to the working condition.

In the process of welding in an aerobic environment, secondary oxidation will occur, resulting in poor wetting, especially in the miniaturization and close spacing process, which will lead to more deadly hazards: voids, which easily lead to a decrease in the strength of the solder joints of micro-components; Tin ball, easy to lead to short circuit between closely spaced components; Virtual welding affects the electrical performance and service life of the product. HB reflow low oxygen concentration control technology is specifically designed for expensive components, double-sided assembly, micro-spaced components, small volume components, high temperature solders, and production processes that require high reliability for welding. The results show that in nitrogen environment, the surface tension of liquid solder decreases and the wetting Angle increases by 40%. Increase wetting capacity by 3-5%; Wetting time can be reduced by 15%; Effectively reduce peak temperature and shorten reflux time. In the SELEIT reflow nitrogen system, the oxygen concentration can be independently controlled throughout the whole process, which effectively solves the above problems.

110 essential knowledge of SMT 1. Generally speaking, the temperature specified in the SMT workshop is 25±3℃; 2. Materials and tools required for solder paste printing solder paste, steel plate, scraper, wiping paper, dust-free paper, cleaning agent, stirring knife; 3. The commonly used solder paste alloy composition is Sn/Pb alloy, and the alloy ratio is 63/37; 4. The main components of the solder paste are divided into two parts: tin powder and flux. 5. The main function of flux in welding is to remove oxides, destroy the surface tension of melting tin, and prevent re-oxidation. 6. The volume ratio of tin powder particles and Flux(flux) in the solder paste is about 1:1, and the weight ratio is about 9:1; 7. The principle of using solder paste is first in first out; 8. When the solder paste is used in opening, it must go through two important processes of warming and stirring; 9. The common production methods of steel plates are: etching, laser, electroforming; 10. The full name of SMT is Surface mount(or mounting) technology, which means surface sticking (or mounting) technology in Chinese; 11. The full name of ESD is Electro-static discharge, which means electrostatic discharge in Chinese. 12. When making the SMT equipment program, the program includes five parts, which are PCB data; Mark data; Feeder data; Nozzle data; Part data; 13. Lead-free solder Sn/Ag/Cu 96.5/3.0/0.5 melting point is 217C; 14. The controlled relative temperature and humidity of the parts drying box is < 10%; 15. Commonly used Passive Devices include: resistance, capacitor, point sense (or diode), etc.; Active Devices include: transistors, ics, etc.; 16. Commonly used SMT steel material is stainless steel; 17. The thickness of commonly used SMT steel plate is 0.15mm(or 0.12mm); 18. The types of electrostatic charge are friction, separation, induction, electrostatic conduction, etc.; Electrostatic charge on electron worker The impact of the industry is :ESD failure, electrostatic pollution; The three principles of electrostatic elimination are electrostatic neutralization, grounding, and shielding. 19. Imperial size length x width 0603= 0.06inch*0.03inch, metric size length x width 3216=3.2mm*1.6mm; 20. The 8th code "4" of ERB-05604-J81 represents four circuits with a resistance value of 56 ohms. capacitance The capacity of ECA-0105Y-M31 is C=106PF=1NF =1X10-6F; 21. ECN Chinese full name: Engineering Change Notice; SWR Chinese full name: Special needs Work Order, It must be countersigned by all relevant departments and distributed by the document center to be valid; 22. The specific content of 5S is sorting, rectification, cleaning, cleaning, and quality; 23. The purpose of PCB vacuum packaging is to prevent dust and moisture; 24. The quality policy is: comprehensive quality control, implement the system, and provide the quality required by customers; Full participation, timely Processing, to achieve the goal of zero defects; 25. Quality three No policy: do not accept defective products, do not manufacture defective products, do not outflow defective products; 26. 4M1H of the seven QC techniques for fish bone inspection refers to (Chinese) : people, machines, materials, Method, environment; 27. The ingredients of the solder paste include: metal powder, solvent, flux, anti-vertical flow agent, active agent; By weight, Metal powder accounted for 85-92%, and metal powder accounted for 50% by volume; The main components of the metal powder are tin and lead, the ratio is 63/37, and the melting point is 183℃. 28. When the solder paste is used, it must be taken out of the refrigerator to return to the temperature of the frozen solder paste. Facilitate printing. If the temperature is not restored, the defects that are easy to produce after PCBA Reflow are tin beads; 29. The document supply modes of the machine include: preparation mode, priority exchange mode, exchange mode and quick access mode; 30. SMT PCB positioning methods are: vacuum positioning, mechanical hole positioning, bilateral clamp positioning and plate edge positioning; 31. Silk screen (symbol) indicates the character of a resistance of 272 with a resistance value of 2700Ω and a resistance value of 4.8MΩ The number (screen printing) is 485; 32. The silk screen on the BGA body contains the manufacturer, manufacturer part number, specifications, Datecode/(Lot No) and other information; 33. The pitch of 208pinQFP is 0.5mm; 34. Among the seven QC techniques, fishbone diagram emphasizes the search for causality; 37. CPK means: the current actual condition of the process capability; 38. The flux begins to volatilize in the constant temperature zone for chemical cleaning; 39. Ideal cooling zone curve and reflux zone curve mirror relationship; 40. RSS curve is temperature rise → constant temperature → reflux → cooling curve; 41. The PCB material we use now is FR-4; 42. PCB warping specification does not exceed 0.7% of its diagonal; 43. STENCIL laser cutting is a method that can be reworked; 44. At present, the BGA ball diameter commonly used on the computer motherboard is 0.76mm; 45. ABS system is absolute coordinates; 46. Ceramic chip capacitor ECA-0105Y-K31 error is ±10%; 47. Panasert Panasonic automatic SMT machine its voltage is 3Ø200±10VAC; 48. SMT parts packaging its coil disc diameter of 13 inches, 7 inches; 49. SMT general steel plate opening is 4um smaller than PCB PAD, which can prevent the phenomenon of poor tin ball; 50. According to PCBA inspection Rules, when the dihedral Angle is > 90 degrees, it means that the solder paste has no adhesion to the wave welding body; 51. When the humidity on the IC display card is greater than 30% after the IC is unpacked, it means that the IC is damp and hygroscopic; 52. The weight ratio and volume ratio of tin powder and flux in the solder paste composition are 90%:10%,50%:50%; 53. The early surface bonding technology originated in the military and avionics fields in the mid-1960s; 54. At present, the most commonly used solder paste Sn and Pb content is: 63Sn+37Pb; 55. The feeding spacing of the paper tape tray with a common bandwidth of 8mm is 4mm; 56. In the early 1970s, the industry introduced a new type of SMD, called "sealed footless chip carrier", often abbreviated as HCC; 57. The resistance of the component with symbol 272 shall be 2.7K ohms; 58. The capacity of 100NF component is the same as that of 0.10uf; 59. The eutectic point of 63Sn+37Pb is 183℃; 60. The largest use of SMT electronic parts material is ceramic; 61. The maximum temperature of the back-welding furnace temperature curve 215C is the most suitable; 62. When inspecting the tin furnace, the temperature of the tin furnace 245C is more appropriate; 63. SMT parts packing its coil type disc diameter 13 inches,7 inches; 64. The open-hole type of steel plate is square, triangle, circle, star shape, this Lei shape; 65. Currently used computer side PCB, its material is: glass fiber board; 66. The solder paste of Sn62Pb36Ag2 is mainly used in the substrate ceramic plate; 67. Rosin based flux can be divided into four kinds: R, RA, RSA, RMA; 68. SMT segment exclusion has no directionality. 69. The solder paste currently on the market has a stickiness time of only 4 hours; 70. The rated air pressure of SMT equipment is 5KG/cm2; 71. What kind of welding method is used when the front PTH and the back SMT pass through the tin furnace? 72. SMT common inspection methods: visual inspection, X-ray inspection, machine vision inspection 73. The heat conduction mode of ferrochrome repair parts is conduction + convection; 74. At present, the main tin ball of BGA material is Sn90 Pb10; 75. Production methods of steel plate laser cutting, electroforming, chemical etching; 76. According to the temperature of the welding furnace: use the temperature gauge to measure the applicable temperature; 77. The SMT semi-finished product of the rotary welding furnace is welded to the PCB when it is exported. 78. The development course of modern quality management TQC-TQA-TQM; 79. The ICT test is a needle bed test; 80. ICT testing can test electronic parts using static testing; 81. The characteristics of solder are that the melting point is lower than other metals, the physical properties meet the welding conditions, and the fluidity is better than other metals at low temperature; 82. The measurement curve should be re-measured to change the process conditions of the welding furnace parts replacement; 83. Siemens 80F/S is a more electronic control drive; 84. Solder paste thickness gauge is the use of Laser light measurement: solder paste degree, solder paste thickness, solder paste printed width; 85. The feeding methods of SMT parts include vibrating feeder, disc feeder and coil feeder; 86. Which mechanisms are used in SMT equipment: CAM mechanism, side rod mechanism, screw mechanism, sliding mechanism; 87. If the inspection section cannot be confirmed, the BOM, manufacturer's confirmation and sample plate shall be performed according to what item; 88. If the part package is 12w8P, the counter Pinth size must be adjusted by 8mm each time; 89. Types of welding machine: hot air welding furnace, nitrogen welding furnace, laser welding furnace, infrared welding furnace; 90. SMT parts sample trial can be used: streamline production, handprint machine mount, handprint hand mount; 91. Commonly used MARK shapes are: circle, "ten" shape, square, diamond, triangle, swastig; 92. SMT segment due to improper Reflow Profile Settings, may cause parts micro-crack is the preheating area, cooling area; 93. Uneven heating at both ends of SMT segment parts is easy to cause: air welding, offset, tombstone; 94. SMT parts maintenance tools are: soldering iron, hot air extractor, suction gun, tweezers; 95. QC is divided into :IQC, IPQC,.FQC, OQC; 96. High speed mounter can mount resistor, capacitor, IC, transistor; 97. Characteristics of static electricity: small current, affected by humidity; 98. The Cycle time of high-speed machine and general-purpose machine should be balanced as far as possible; 99. The true meaning of quality is to do it right the first time; 100. The SMT machine should stick small parts first, and then stick large parts; 101. BIOS is a basic Input/Output System. In English, it is: Base Input/Output System; 102. SMT parts can not be divided into LEAD and LEADLESS two kinds according to the parts foot; 103. The common automatic placement machine has three basic types, continuous placement type, continuous placement type and mass transfer placement machine; 104. SMT can be produced without LOADER in the process; 105. SMT process is board feeding system - solder paste printing machine - high speed machine - universal machine - rotary flow welding - plate receiving machine; 106. When the temperature and humidity sensitive parts are opened, the color displayed in the humidity card circle is blue, and the parts can be used; 107. Size specification 20mm is not the width of the material belt; 108. Reasons for short circuit caused by poor printing in the process: a. The metal content of the solder paste is not enough, resulting in collapse b. The opening of the steel plate is too large, resulting in too much tin c. The steel plate quality is not good, the tin is not good, change the laser cutting template d. Solder paste remains on the back of Stencil, reduce the pressure of the scraper, and apply appropriate VACCUM and SOLVENT 109. The main engineering purposes of the general backwelding furnace Profile: a. Preheating zone; Project objective: The capacitive agent volatilization in solder paste. b. Uniform temperature zone; Project purpose: activation of flux, removal of oxide; Evaporate excess water. c. Back welding area; Project purpose: solder melting. d. Cooling zone; Engineering purpose: alloy solder joint formation, part foot and pad joint as a whole; 110. In the SMT process, the main reasons for tin beads are: poor PCB PAD design and poor steel plate opening design

Alarm item software processing method Alarm cause alarm exclusion System power failure The system automatically enters the cooling state and automatically sends the PCB in the furnace to the external power failure Internal circuit fault Repair external circuit Overhaul internal circuitry If the hot air motor does not rotate, the system automatically enters the cooling state The hot air motor is damaged or stuck. Check the inverter Replace or repair the motor If the transmission motor does not rotate, the system automatically enters the cooling state Motor is not stuck or damaged check frequency conversion Replace or repair the motor The board drop system automatically enters the cooling state. The PCB falls or gets stuck Electrical eye damage at transport inlet and outlet The external object mistakenly senses the entrance electric eye and sends the board out to replace the electric eye If the lid is not closed, the system automatically enters the cooling state The lifting screw travel switch is shifted to close the upper furnace and restart Readjust the position of the travel switch When the temperature exceeds the upper limit, the system automatically enters the cooling state Solid state relay output short circuit The computer and PLC cable are unplugged Check whether the temperature control template works properly. Replace the hot spot couple Replace solid state relay Plug in the strip Check the temperature control template If the temperature is lower than the minimum temperature, the system automatically enters the cooling state. The output end of the solid-state relay is disconnected Ground the thermocouple The leakage switch of the generator tube is switched off to replace the solid state relay Adjust the thermocouple position Repair or replace the heating pipe When the temperature exceeds the alarm value, the system automatically enters the cooling state The output end of the solid state relay is normally closed The computer and PLC cable are unplugged Check whether the temperature control template works properly. Replace the thermocouple Replace solid state relay Plug in the strip Check the temperature control template The system automatically enters the cooling state when the temperature is lower than the alarm value. The output end of the solid-state relay is disconnected Ground the thermocouple The leakage switch of the generator tube is switched off to replace the solid state relay Check the temperature control template The system automatically enters the cooling state when the temperature is lower than the alarm value. The output end of the solid-state relay is disconnected Ground the thermocouple The leakage switch of the generator tube is switched off to replace the solid state relay Adjust the thermocouple position Repair or replace the heating pipe The transport motor speed deviation is large. The system automatically enters the cooling state. The transport motor is faulty Encoder fault Inverter failure Replace the motor Fix and replace encoder Change frequency converter The start button is not reset The system is in the waiting state. The emergency switch is not reset The start button is not pressed Start button damaged Line damage reset emergency switch and press start button Replacement button Fix the circuit Press the emergency switch The system is in the waiting state. Press the emergency switch Reset the emergency switch and press the start button to check the external circuit High temperature 1. The hot air motor is faulty 2. The wind turbine is faulty 3. Solid state relay output short circuit 4. Check the wind wheel 5. Replace the solid state relay working process The machine cannot start. 1. The upper furnace body is not closed 2. The emergency switch is not reset 3. The start button is not pressed 4. Check the emergency switch 5. Press the Start button to start the process The temperature in the heating zone does not rise to the set temperature 1. The heater is damaged 2. The power-on couple is faulty 3. The output end of the solid state relay is disconnected 4. The exhaust is too large or the left and right exhaust is unbalanced 5. The photoelectric isolation device on the control board is damaged The transport motor is abnormal. The transport thermal relay detects that the motor is overloaded or stuck 1. Restart the transport thermal relay 2. Check or replace the thermal relay 3. Reset the thermal relay current measurement value Inaccurate count 1. The sensing distance of the counting sensor is changed 2. The counting sensor is damaged 3. Adjust the sensing distance of the technical sensor 4. Replace the counting sensor The error of the speed value on the computer screen is large 1. The speed feedback sensor senses the wrong distance 2. Check whether the encoder is faulty 3. Check the encoder circuit

In the SMT entire line process, after the SMT machine completes the mounting process, the next step is the welding process, reflow welding process is the most important process in the entire SMT surface mounting technology. Common welding equipment includes wave welding, reflow welding and other equipment, and the role of reflow welding four temperature zones, respectively, are preheating zone, constant temperature zone, back welding zone and cooling zone. Each of the four temperature zones has its own significance. SMT reflow preheating area The first step of reflow welding is preheating, which is to activate the solder paste, avoid the preheating behavior caused by poor welding caused by rapid high temperature heating during tin immersion, and evenly heat the normal temperature PCB board to achieve the target temperature. In the heating process to control the heating rate, too fast will produce thermal shock, may cause damage to the circuit board and components; Too slow, the solvent volatilization is insufficient, affecting the welding quality. SMT reflow insulation area The second stage - insulation stage, the main purpose is to make the temperature of the PCB board and the components in the reflow furnace stable, so that the temperature of the components is consistent. Because the size of the components is different, the large components need more heat, the temperature is slow, the small components are heated up fast, and enough time is given in the insulation area to make the temperature of the larger components catch up with the smaller components, so that the flux is fully volatilized to avoid bubbles when welding. At the end of the insulation section, the oxides on the pad, solder ball and component pins are removed under the action of flux, and the temperature of the entire circuit board is also balanced. All components should have the same temperature at the end of this section, otherwise there will be various bad welding phenomena in the reflux section due to the uneven temperature of each part. Reflow back weld area The temperature of the heater in the reflow area rises to the highest, and the temperature of the component rises rapidly to the highest temperature. In the reflux street section, the peak welding temperature varies with the welding paste used, the peak temperature is generally 210-230 ° C, and the reflux time should not be too long to prevent adverse effects on the components and PCB, which may cause the circuit board to be scorched. Reflow cooling zone In the final stage, the temperature is cooled below the freezing point temperature of the solder paste to solidify the solder joint. The faster the cooling rate, the better the welding result. If the cooling rate is too slow, it will lead to the generation of excessive eutectic metal compounds, and the large grain structure is easy to occur at the welding point, so that the strength of the welding point is low, and the cooling rate of the cooling zone is generally about 4℃/S, cooling to 75℃.