Global Soul Limited Company News

What is SMT? A SMT is Surface assembly Technology (short for Surface Mounted Technology), is the most popular technology and process in the electronic assembly industry. It compresses traditional electronic components into only a few tens of the volume of the device, thus realizing the assembly of electronic products of high density, high reliability, miniaturization, low cost, and production automation. This miniaturized component is called: SMY device (or SMC, chip device). The process of assembling components onto a print (or other substrate) is called the SMT process. The associated assembly equipment is called SMT equipment. At present, advanced electronic products, especially in computers and communication electronic products, have widely adopted SMT technology. The international output of SMD devices has increased year by year, while the output of traditional devices has decreased year by year, so with the passage of SMT technology will become more and more popular. SMT features: 1, high assembly density, small size of electronic products, light weight, the size and weight of the patch components is only about 1/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products reduced by 40% to 60%, the weight reduced by 60% to 80%. 2, high reliability, strong vibration resistance. Low defect rate of solder joint. 3, good high-frequency characteristics. Reduced electromagnetic and radio frequency interference. 4, easy to achieve automation, improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc. Why use Surface Mount Technology (SMT)? 1, the pursuit of miniaturization of electronic products, previously used perforated plug-in components have been unable to shrink 2, electronic products function more complete, the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ics, have to use surface patch components. 3, product mass, production automation, the factory to low cost and high output, produce quality products to meet customer needs and strengthen market competitiveness 4, the development of electronic components, integrated circuit (IC) development, semiconductor materials of multiple applications 5, electronic technology revolution is imperative, chasing the international trend. What are the features of QSMT? A High assembly density, small size and light weight of electronic products, the volume and weight of the patch components are only about 1/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%. High reliability and strong vibration resistance. Low defect rate of solder joint. Good high frequency characteristics. Reduced electromagnetic and radio frequency interference. Easy to automate and improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc. Q Why use SMT A Electronic products pursue miniaturization, and previously used perforated plug-in components can no longer be reduced The function of electronic products is more complete, and the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ics, and surface patch components have to be used Product mass, production automation, manufacturers to low cost and high output, produce high-quality products to meet customer needs and strengthen market competitiveness Development of electronic components, development of integrated circuits (ics), multiple applications of semiconductor materials The revolution of electronic science and technology is imperative, and the pursuit of international trends Q Why use lead-free process A Lead is a toxic heavy metal, excessive absorption of lead by the human body will cause poisoning, intake of low amounts of lead may have an impact on human intelligence, nervous system and reproductive system, the global electronic assembly industry consumes about 60,000 tons of solder every year, and is increasing year by year, the resulting lead-salt industrial slag seriously polluted the environment. Therefore, reducing the use of lead has become the focus of worldwide attention, many large companies in Europe and Japan are vigorously accelerating the development of lead-free alternative alloys, and have planned to gradually reduce the use of lead in the assembly of electronic products in 2002. It will be completely eliminated by 2004. (The traditional solder composition of 63Sn/37Pb, in the current electronic assembly industry, lead is widely used). Q What are the requirements for lead-free alternatives A 1, price: Many manufacturers require that the price cannot be higher than 63Sn/37Pn, but at present, the finished products of lead-free alternatives are 35% higher than 63Sn/37Pb. 2, the melting point: most manufacturers require a minimum solid phase temperature of 150 ° C to meet the working requirements of electronic equipment. The liquid phase temperature depends on the application. Electrode for wave soldering: For successful wave soldering, the liquid phase temperature should be below 265 ° C. Solder wire for manual welding: liquid phase temperature should be lower than the working temperature of the soldering iron 345℃. Solder paste: liquid phase temperature should be lower than 250℃. 3. Electrical conductivity. 4, good thermal conductivity. 5, small solid-liquid coexistence range: most experts recommend that this temperature range be controlled within 10 ° C, in order to form a good solder joint, if the alloy solidification range is too wide, it is possible to crack the solder joint, so that electronic products premature damage. 6, low toxicity: the alloy composition must be non-toxic. 7, with good wettability. 8, good physical properties (strength, tensile, fatigue) : the alloy must be able to provide the strength and reliability that Sn63/Pb37 can achieve, and there will be no protruding fillet welds on the passing device. 9, the production of repeatability, solder joint consistency: because the electronic assembly process is a mass manufacturing process, requires its repeatability and consistency to maintain a high level, if some alloy components can not be repeated in mass conditions, or its melting point in mass production due to changes in the composition of the larger changes, it can not be considered. 10, solder joint appearance: solder joint appearance should be close to the appearance of tin/lead solder. 11. Supply ability. 12, compatibility with lead: due to the short term will not immediately be fully transformed into a lead-free system, so lead may still be used on the PCB pad and component terminals, such as mixing such as drilling in the solder, may make the melting point of the solder alloy drop very low, the strength is greatly reduced.

According to the latest forecast data released by market research firm Gartner, the total global semiconductor revenue in 2024 will be $626 billion, an increase of 18.1%. Among the top 10 semiconductor manufacturers in the world in 2024, Samsung, Intel and Nvidia rank the top three. At the same time, Gartner expects that, driven by the demand for AI, total global semiconductor revenue will increase by 12.6% year-on-year to reach $705 billion in 2025. While this forecast is lower than Future Horizons' 15 percent forecast, it is higher than the World Semiconductor Trade Organization's 11.2 percent estimate and Semiconductor Intelligence's 6 percent estimate. "Graphics processing units (Gpus) and AI processors used in data center applications (servers and accelerator cards) are key drivers for the chip industry in 2024," said George Brocklehurst, vice president analyst at Gartner. "The growing demand for artificial intelligence and Generative Artificial Intelligence (GenAI) workloads has led to data centers becoming the second largest semiconductor market after smartphones in 2024. Data center semiconductor revenue totaled $112 billion in 2024, up from $64.8 billion in 2023." Looking at specific vendor performance, only eight of the top 25 semiconductor suppliers by revenue in 2024 experienced a decline in semiconductor revenue, while 11 suppliers achieved double-digit percentage growth. Among the top 10 manufacturers, only Infineon's semiconductor revenue declined year-on-year, and the rest achieved year-on-year growth. ● Samsung Electronics' semiconductor revenue in 2024 is expected to be $66.5 billion, up 62.5% year on year, mainly due to the growth in demand for memory chips and a strong rebound in prices, successfully helping Samsung Electronics regain the top position from Intel and extend its lead over the company. Samsung Electronics' financial report also shows that in 2024, Samsung Electronics' DS division, which is mainly engaged in semiconductor business including memory and wafer foundry, generated annual revenue of 111.1 trillion won, an increase of 67%. Samsung also attributed the increase to higher average selling prices of DRAM and increased sales of HBM and high-density DDR5. Its HBM3E products have already been mass-produced and sold in the third quarter of 2024, and in the fourth quarter of 2024, HBM3E has been supplied to several GPU vendors and data center vendors, and sales have exceeded HBM3. HBM sales for the full fourth quarter were up 190% sequentially, but this was still lower than previously expected. "The 16-layer HBM3E is in the phase of customer sample delivery, and the sixth generation HBM4 is expected to be mass-produced in the second half of 2025," a Samsung official said. Intel's 2024 semiconductor revenue is expected to be $49.189 billion, up only 0.1% year over year, ranking second in the world. While the AI PC market and its Core Ultra chipset appear to be seeing decent growth, its AI accelerator products and overall x86 business are doing so-so. Intel's latest earnings report shows that its overall revenue in the 2024 fiscal year was $53.1 billion, down 2% from the same period last year. After the outbreak of Intel's financial crisis in September 2024, Intel announced that it would reduce its global workforce by 15%, cut capital expenditures (by $10 billion in capital expenditures by 2025), and suspend the construction of factories in Germany and Poland. Although Intel's performance has improved in the next two quarters, it is still not optimistic. Looking at full-year 2024 performance by segment, its customer computing group revenue increased only 3.5% year-over-year to $30.29 billion, and data center and Artificial intelligence (AI) group revenue increased only 1.4% year-over-year to $12.817 billion. In contrast, Nvidia, AMD and other chip manufacturers have benefited from the growth of AI demand, and their AI business revenue has a high double-digit percentage increase. Nvidia's 2024 semiconductor revenue jumped 84% year over year to $46 billion. Due to the strong demand for its AI chips, it moved up two places in the ranking, ranking third globally. According to Nvidia's previously announced financial results for the third quarter of fiscal year 2025 ending on October 27, 2024, revenue for the quarter reached $35.1 billion, up 94% year-on-year and up 17% sequentially. For the fourth quarter, Nvidia expects revenue of $37.5 billion, plus or minus 2 percent, up 70 percent sequentially from the third quarter. SK Hynix semiconductor revenue in 2024 is expected to reach $42.824 billion, up 86% year-on-year, and its ranking has also risen two places to fourth in the world. SK Hynix's growth was mainly due to strong growth in its High bandwidth (HBM) business. SK Hynix's latest financial report shows that its revenue in 2024 was 66.1930 trillion won, up 102% year-on-year, a new high in revenue over the past year, and its operating profit exceeded the performance of the ultra-prosperous memory chip market in 2018. SK Hynix also announced that it achieved its highest annual performance thanks to industry-leading HBM technology strength and profitable business activities amid strong demand for semiconductor memory for AI. Among them, HBM, which showed a high growth trend in the fourth quarter of 2024, accounted for more than 40% of the entire DRAM sales (30% in the third quarter), and enterprise solid state drive (eSSD) sales continued to increase. The company has established a stable financial position based on profitable operations based on the competitiveness of differentiated products, thus continuing to maintain the trend of performance improvement. Qualcomm's 2024 semiconductor revenue was $32.358 billion, up 10.7% year-over-year and dropping two places to fifth. Although Qualcomm's revenue growth is much lower than Samsung, Nvidia, SK Hynix and other leading manufacturers, but thanks to the help of its Snapdragon 8 extreme mobile platform, its revenue growth is still better than the growth of the smartphone market (market research agency Canalys data show that the global smartphone market in 2024 strong rebound shipments reached 1.22 billion units, Year-on-year growth of 7%). However, Qualcomm's energy-consuming Snapdragon X series platform for the PC market is not successful, data show that Qualcomm Snapdragon X series PC only shipped 720,000 units in the third quarter, with a market share of only 0.8%. According to Qualcomm's financial report for the fiscal year 2024, which ended on September 29, 2024, Qualcomm's revenue for the fiscal year was $38.962 billion, an increase of 9% compared to $35.82 billion in the previous fiscal year. In terms of revenue sources, 46% came from customers based in China. Driven by the Snapdragon 8 Extreme mobile platform, Qualcomm expects revenue for the first quarter of fiscal 2025 (equivalent to the fourth quarter of Natural year 2024) to be between $10.5 billion and $11.3 billion, with a median of $10.9 billion, higher than the average market analyst estimate of $10.54 billion. Micron's semiconductor revenue in 2024 is expected to be $27.843 billion, up 72.7% year on year, and moving up six places to sixth. The growth of Micron's revenue and ranking is also mainly due to the strong demand for HBM in the AI market. According to Micron's financial report for the fiscal year 2024, which ended on August 29, 2024, its revenue for the fiscal year 2024 reached $25.111 billion, a year-on-year increase of 61.59%. Micron pointed out that as one of Micron's highest margin products, its HBM revenue for AI data processing has maintained strong growth. Its data center business, where HBM is located, achieved record annual revenue in fiscal year 2024 and will grow significantly in fiscal year 2025. This year and next year, Micron's HBM production capacity has been sold out, and during this period, Micron has also finalized HBM order prices for this year and next year with customers. The subsequent Micron 2025 fiscal year first quarter (as of November 28, 2024) earnings report showed that the fiscal quarter revenue was $8.709 billion, close to the average analyst expectation of $8.71 billion, an increase of 84.1% year on year, an increase of 12.4% quarter on quarter, a record high. While first-quarter results were indeed weighed down by DRAM inventory overhang in end-markets such as smartphones and PCS, they were offset by a 400% explosion in the data center business, driven by cloud server DRAM demand and HBM revenue growth. Although the HBM market is currently dominated by SK Hynix, this year, Micron's HBM3E entered Nvidia's H200 artificial intelligence chip and the newly developed strongest Blackwell system, which will greatly stimulate Micron's HBM revenue growth. Micron CEO has previously predicted that the global market size of HBM chips will increase to about $25 billion in 2025, significantly higher than the $4 billion in 2023, which will also boost the memory chip market size to jump to $204 billion in 2025. In the first quarter earnings call, Micron's CEO has increased the HBM market size to $30 billion in 2025. Broadcom's 2024 semiconductor revenue is expected to be $27.841 billion, up 7.9% year over year, but it will slip three places to seventh. Broadcom's revenue for fiscal year 2024, which ended November 3, 2024, was approximately $51.6 billion, an increase of 44% year-over-year and a record high. But that revenue growth was largely due to the acquisition of VMware, which combined the two companies' revenues. Hock Tan, President and CEO of Broadcom, also explained, "Broadcom's revenue for fiscal year 2024 increased 44% year-over-year to a record $51.6 billion, as infrastructure software revenue grew to $21.5 billion." "However, driven by AI's demand for custom chips, Broadcom's semiconductor revenue also reached a record $30.1 billion in fiscal year 2024, including $12.2 billion in AI revenue, up 220% year-over-year, driven by our leading AI XPU and Ethernet networking portfolio." AMD's 2024 semiconductor revenue is expected to be $23.948 billion, up 7.4% year-over-year and slipping one place to eighth. According to AMD's fiscal year 2024 financial report released on February 4, 2025 local time, the fiscal year revenue reached a record $25.8 billion, an increase of 14%. Benefiting from the strong demand in the AI market, AMD's data center division's revenue reached a new high of $12.6 billion in 2024, up 94% from the same period last year. In addition, its PC chip client segment revenue in 2024 also reached a new high of $2.3 billion, up 58% year on year. But the games division saw revenue plunge 58% to $2.6 billion due to a decline in semi-custom revenue. Embedded segment revenue in 2024 also plunged 33% year-over-year to $3.6 billion, primarily due to normalization of inventory levels as customers clear inventory. Apple's 2024 semiconductor revenue is expected to be $18.88 billion, up 4.6% year over year and up 1 place to ninth. Apple's financial results for the fiscal year 2024, which ended on September 28, showed that its revenue for the fiscal year increased only 2% to $391 billion due to slowing demand in the smartphone and PC markets. The latest financial report for the first quarter of the fiscal year 2025 (the fourth quarter of 2024) shows that Apple's revenue for the quarter increased 4% year-on-year to $124.3 billion, a record high, and better than analysts' expectations of $124.1 billion. Revenue from its core iPhone business edged down 0.9% year-over-year, but it still generated $69.138 billion. Mac revenue increased 15.5 percent to $8.987 billion. iPad revenue also increased 15.2% year-over-year to $8.088 billion. At present, Apple's iPhone/Mac/iPad product line is basically using its own processors. ● Infineon's 2024 semiconductor revenue is expected to be $16.01 billion, down 6% year on year and down one place to 10th. According to Infineon's financial results for the fiscal year 2024 to the end of September 2024, Infineon's revenue for the fiscal year decreased by 8% to 14.955 billion euros, a year-on-year decrease of 8%. Infineon CEO Jochen Hanebeck also said in a statement at the time: "Currently, with the exception of artificial intelligence, our end markets have virtually no growth drivers and cyclical recovery is being delayed." As a result, we are preparing for a lower business trajectory in 2025." However, Infineon's financial report for the first quarter of the fiscal year 2025 ending December 31, 2024, announced on February 4, 2025 local time, showed that the revenue of the fiscal quarter was 3.424 billion euros, down 13% year-on-year. This was mainly due to weaker demand in four segments: Automotive (ATV), Green Industrial Power (GIP), Power and Sensor Systems (PSS), and Connected Security Systems (CSS). However, the overall results were still better than market expectations, and as a result, Infineon revised its revenue for fiscal year 2025 from "slightly down" to "flat or slightly up" for now. HBM has become the growth engine of the head memory manufacturers, and will account for 19.2% of the overall DRAM revenue in 2025, Gartner data also shows that in 2024, global memory chip revenue soared 71.8% year-on-year, making the share of memory chips in total semiconductor sales increased to 25.2%. In contrast, in 2024, semiconductor revenue outside of storage only grew by 6.9% year-over-year, of which DRAM revenue grew by 75.4% in 2024 and NAND revenue grew by 75.7% year-over-year. HBM's revenue growth contributed significantly to the DRAM vendor's revenue. In 2024, HBM's revenue will account for 13.6% of total DRAM revenue. It is expected to further increase to 19.2% by 2025. According to Brocklehurst, "Memory and AI semiconductors will drive near-term growth, with HBM's share of DRAM revenues expected to increase, reaching 19.2% by 2025." HBM's revenue is expected to grow 66.3 percent to $19.8 billion by 2025.

In recent years, Longqi Technology takes the smartphone ODM business as the core, and actively expands the diversified business of tablet computer, smart wear, XR, AI PC, automotive electronics, etc., and has achieved remarkable results in these new business areas, thus driving its business performance to maintain rapid growth. In the first three quarters of 2024, the business of various sectors of Longqi Technology continued to grow, achieving operating income of 34.9 billion yuan, an increase of 101%. Among them, the company's smartphone business achieved revenue of 27.9 billion yuan, an increase of 98% year-on-year, continuing to lead the global smartphone ODM market, and its market share increased steadily. This growth trend is expected to be maintained throughout the year, demonstrating Longqi's strong strength and solid market share gains in the smartphone ODM segment. From the perspective of smartphone ODM/IDH shipments, in the first half of 2024, Longqi Technology ranked first with a 35% market share. Ivan Lam, senior Research Analyst at Counterpoint Research, said: "Longqi maintained its strong momentum, with shipments growing 50% year-on-year in the first half. This high growth was mainly driven by strong shipments from Chinese brands, especially Xiaomi, Huawei and MOTOROLA, as well as Samsung. Xiaomi's performance improved in several key regions including China, India, the Caribbean and Latin America, as well as Central and East Africa." In accepting institutional research, Longqi Technology said that in the third quarter, the company continued to lead the global smartphone ODM market, the company's market share increased steadily, and the business scale continued to maintain rapid growth. There are mainly three reasons: First, the company adopted a more active market strategy, obtained more customers' main projects, the company's market share has been further increased, and the customer structure has been more optimized. Second, some of the company's customers have their own business growth. In addition, the company's cooperation business with individual customers in India is growing faster, and the business model in which the amount of Buy&Sell is large has brought about revenue growth. In addition to the smartphone business, Longqi Technology's tablet computer and AIoT product business also performed well. In the first three quarters of 2024, the company's tablet computer business achieved revenue of 2.6 billion yuan, an increase of 78% over the same period last year. While continuously expanding the high-end and productive product portfolio, the company also actively expanded the customer base of the tablet computer business and continued to optimize the customer structure. AIoT product business achieved revenue of 3.8 billion yuan, an increase of 135%. The company's AIoT business mainly includes smart watches, smart bracelets, TWS headphones, XR products, etc., and the main projects continue to increase. It is worth mentioning that with the vigorous development of AI technology, Longqi Technology is accelerating its entry into the new track of AI intelligent hardware, and showing significant development potential and strong market competitiveness. In 2024, Longqi Technology completed the research and development, manufacturing and shipment of a number of products in the field of AI intelligent hardware, of which the shipment performance of the second-generation AI smart glasses products cooperated with global Internet head customers was particularly excellent. At the same time, the company's first Qualcomm Snapdragon platform laptop project successfully produced goods, which have been sold in the domestic and European markets. The company also landed the Qualcomm Snapdragon platform AI Mini PC project for the world's leading customers of laptops, injecting strong impetus into the expansion of AI applications in commercial and consumer fields. In addition, the company actively negotiates cooperation with major internationally renowned laptop customers on X86 architecture projects, and strives to land more new AI PC projects one after another. As the AI side application is accelerating the update, in addition to AI PC, Longqi Technology's smart hardware products such as mobile phones, tablets, XR, wristbands, TWS headphones also ushered in innovation opportunities, the company also conforms to the global AI technology development trend, actively follow up and layout of wireless communication, optics, display, audio, simulation and other underlying core technologies. To provide customers with full scene AI intelligent terminal product solutions. In the future, with the continuous evolution of AI technology and the growing market demand, Longqi Technology is expected to achieve more brilliant achievements in the field of AI intelligent hardware.

YINCAE has launched the UF 120LA, a high-purity liquid epoxy filling material designed for advanced electronic packaging. The UF 120LA has excellent fluidity and can fill narrow gaps up to 20 μs, avoiding cleaning processes and thus reducing costs and environmental impact while ensuring superior performance in applications such as BGA, flip chips, WLCSP and multi-chip modules. The UF 120LA can withstand five 260°C reflux cycles without distortion of the solder joint, surpassing competitors that require cleaning. Its ability to cure at lower temperatures increases production efficiency and makes it ideal for use in memory cards, chip carriers and hybrid integrated circuits. The superior thermal performance and mechanical durability of the UF 120LA enable manufacturers to develop more compact, reliable, and high-performance devices, driving the trend toward miniaturization, edge computing, and Internet of Things (IoT) connectivity. This technological advancement will enhance the production of critical applications such as 5G and 6G infrastructure, autonomous vehicles, aerospace systems and wearable technology, where reliability and durability are critical. In addition, by streamlining the manufacturing process, the UF 120LA accelerates the speed to market of consumer electronics, potentially reshaping supply chain efficiency and creating new opportunities for economies of scale. In the long term, widespread adoption of this technology could revolutionize the field of semiconductor packaging, laying the foundation for increasingly complex electronic devices that will be lighter, more efficient, and more resilient in extreme environments. Key Benefits: • No cleaning compatibility - Compatible with all non-cleaning solder paste residues. Cost savings - eliminate cleaning processes and pollution control. • High thermal reliability - can withstand multiple reflux cycles without deformation. • Excellent fluidity - narrow gaps up to 20 μs can be filled. • Low warpage - low CTE and high thermal stability. "The UF 120LA represents a significant advance in electronic packaging technology," said YINCAE Chief Technical Officer. "The UF 120LA enables manufacturers to push the boundaries of advanced packaging applications, from BGA to wafer-scale chip-scale packaging. We believe this product will set new industry standards for performance and efficiency.

The performance and technical requirements of the circuit board are related to the structure type of the circuit board and the selected substrate. Different types (rigid and flexible), different structures (single-sided, double-sided, multi-layer, with or without blind holes, buried holes, etc.), different substrates of PCB boards, performance indicators are different. Its performance level, like product design, is usually divided into three levels according to the scope of use, PCB manufacturers describe the complexity of the product, the degree of functional requirements and the frequency of testing and inspection. The acceptance requirements and reliability of products of different performance levels increase according to the level.   Level 1 - General electronic products: mainly consumer electronic products and some computers and peripherals. There are no strict requirements for the appearance of this type of PCB board, and the main requirement is that there should be complete circuit functions to meet the requirements of use. Level 2 - Dedicated service electronic products: including computers, communication equipment, complex commercial electronic equipment, instruments, meters and some use requirements are not very demanding products. This kind of product requires a long life and requires uninterrupted work, but the working environment is not bad. The appearance of some products is not perfect, but the performance should be intact and have a certain reliability. Level 3 - High reliability products: including equipment with strict continuous performance requirements, equipment that does not allow downtime during operation, and equipment used for precision weapons and life support. PCB processing printed board is not only functional integrity, requires uninterrupted work, and can work normally at any time, has a strong environmental adaptability, and should have a high degree of insurance and reliability. For such products, strict quality assurance measures should be taken from design to product acceptance, and some reliability tests should be done if necessary.   PCB board processing out of different levels of PCB suppliers in not all the performance requirements are different, some performance requirements are the same, some performance indicators of the degree of rigor and accuracy, tolerance and reliability requirements are different. The performance requirements of PCB processing manufacturers mainly include appearance, size, mechanical properties, physical properties, electrical properties, chemical properties and other properties. The following will be based on IPC-A-600G and IPC-6011 series standards, according to the performance of these aspects are introduced. The performance indicators that are not specifically stated are the same for all levels of products, and different requirements will be explained separately.   In order to more clearly show the quality status of the product at the time of acceptance, and give a more intuitive description, the quality status of the printed board in the IPC-A-600G standard is divided into ideal, accept and reject three states: Ideal state: A desired state, close to perfect but attainable. In fact, because the design quality and processing level of printed board graphics are generally not easy to achieve, the ideal state is not a necessary requirement for reception. Receiving status: It is the basic requirement to ensure the necessary functional integrity and reliability of PCB board manufacturers under the conditions of their use, but it is not necessarily perfect, and it is the basic condition for product reception. The receiving status of different levels of products, some items are the same, and some items are different, which are described exclusively in the article. Reject state: A state that exceeds the minimum requirements for receiving, and the printed board in this state is not sufficient to ensure the performance and reliability of the product under the conditions of use. For different grades of products and different acceptance items, the conditions for rejection may be different.

The materials used in the production of circuit board processing contain many harmful substances, and many harmful substances will be produced in the production process, especially the "three wastes" produced, which will cause great harm to the environment. If left to itself, it will not only have a serious impact on the sustainable development of society and economy, but also cause great harm to the human body. Therefore, for the printed board production industry, from the beginning of product design to the entire manufacturing and use of the whole process must be strictly controlled materials, improve the production process, the use of advanced pollution-free or low-pollution technology, as well as the printed board electroplating and chemical production process into the "three wastes" for strict monitoring and scientific management. Strengthen the clean production management of printed board, which is related to the survival of the circuit board processing plant production enterprises. PCB board processing clean production concept and content Clean production includes two aspects of clean production process and clean production products. In the concept of cleaner production, it includes not only technical feasibility, but also economic profitability. It should fully reflect the unity of economic benefits, environmental benefits and social benefits. one Cleaner production refers to the continuous application of environmental strategies of comprehensive prevention in production processes and products to reduce the harm to humans and the living environment. For the production process, cleaner production includes saving raw materials and energy, eliminating toxic raw materials, and reducing the quantity and toxicity of all emissions and wastes before they leave the production process; For products, cleaner production strategies mean reducing the impact of a product on the human environment throughout its life cycle, from the processing of raw materials to the final disposal of the product. Cleaner production is achieved by applying specialized technology, improving process and changing management. The purpose of cleaner production is to realize rational utilization of resources and slow down the depletion of resources through comprehensive utilization of resources, substitution of scarce resources, utilization of secondary energy, energy saving, water saving and material saving. In the production process, reduce or eliminate the generation and emission of pollutants and waste, promote the compatibility of printed board industrial production and product consumption process with the environment, and reduce the harm to human beings and the living environment throughout the production cycle. Circuit board   2. Clean production to "energy saving and consumption reduction, comprehensive utilization, pollution reduction and efficiency" as the goal; Strengthen training, improve the ideological awareness and technical quality of employees in cleaner production, strengthen production management, rely on technological progress, adopt reasonable and practical process technology and other measures; In line with the principle of treating pollution first, try not to use or use less harmful substances, so that the production of pollutants in the production process, emissions to achieve the minimum and harmless, and the waste in the production process to achieve resources.  

Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. It has a history of more than 100 years; Its design is mainly layout design; The main advantage of using circuit boards is to greatly reduce wiring and assembly errors, improve the level of automation and production labor rate. Today, the macro link circuit Xiaobian takes you to understand the circuit board exposure skills and basic knowledge. The first is exposure When PCB manufacturers process the board, under ultraviolet light, the photoinitiator absorbs the light energy and decomposes into free groups, which then trigger the photopolymeric monomer for polymerization crosslinking reaction, and forms a large molecular structure insoluble in dilute alkali solution after the reaction. Exposure is generally carried out in the automatic double-sided exposure machine, and now the exposure machine can be divided into air-cooled and water-cooled according to the different cooling methods of the light source. Factors affecting the quality of exposure imaging In addition to the performance of dry film photoresist, the selection of light source, the control of exposure time (exposure amount), and the quality of photographic substrate are all important factors affecting the quality of exposure imaging. 1) Choice of light source Any kind of dry film has its own unique spectral absorption curve, and any kind of light source has its own emission spectral curve. If the main peak of spectral absorption of a certain dry film can overlap or mostly overlap with the main peak of spectral emission of a certain light source, the two match well and the exposure effect is good. The spectral absorption curve of domestic dry film shows that the spectral absorption range is 310-440nm (nm). From the spectral energy distribution of several light sources, it can be seen that the pick lamp, high-pressure mercury lamp and iodogallium lamp have a large relative radiation intensity in the wavelength range of 310-440nm, which is an ideal light source for dry film exposure. Xenon lamps are not suitable for dry film exposure. After the type of light source is selected, a light source with high power should also be considered. Because the light intensity is large, the resolution is high, and the exposure time is short, the degree of heat deformation of the photographic plate is small. In addition, the lamp design is also very important, to try to make the incident light uniformity is good, high parallelism, in order to avoid or reduce the poor effect after exposure. 2) Control of exposure time (exposure amount) In the exposure process, the photopolymerization reaction of the dry film is not "one primer" or "one exposure is ready", but generally through three stages. Due to the presence of oxygen or other harmful impurities in the dry film, it needs to go through an induction process, in which the free group generated by the decomposition of the initiator is consumed by oxygen and impurities, and the polymerization of monomers is very small. However, when the induction period passes, the photopolymerization reaction of the monomer takes place quickly, and the viscosity of the film increases rapidly, close to the degree of mutation, which is the stage of rapid consumption of the photosensitive monomer, and the proportion of time in the exposure process of this stage is very small. When most of the photosensitive monomer is consumed, it enters the monomer depletion zone, and this time the polymerization reaction has been completed. Correct control of exposure time is a very important factor to obtain excellent dry film image. When the exposure is insufficient, due to the incomplete polymerization of monomers, during the development process, the film melts and becomes soft, the lines are not clear, the color is dull, and even degumming. In the pre-plating treatment or electroplating process, the film warps, permeates and even falls off. When the exposure is too much, it will cause difficulties in developing, brittle film, leaving residual glue and other ills. What is more serious is that incorrect exposure will produce a deviation of the image line width, excessive exposure will make the graphic plating line thinner, make the printed etching line thicker, on the contrary, underexposure makes the graphic plating line thicker, make the printed etching line thinner. How to determine the correct exposure time? Due to the different exposure machines used by various manufacturers of films, that is, the light source, the power of the lamp and the lamp distance are different, it is difficult for dry film manufacturers to recommend a fixed exposure time. Foreign companies producing dry film have their own or recommended use of some kind of optical density ruler, the dry film factory is marked with the recommended imaging level, China's dry film manufacturers do not have their own optical density ruler, usually recommend the use of iston 17 or stouffer 21 optical density ruler. The optical density of the Rayston 17 optical density scale is 0.5, and the optical density difference AD increases by 0.05 for each subsequent stage, until the optical density of the 17 level is 1.30. The optical density of the Stuffer 2l optical density scale is 0.05, and then each stage increases with the optical density difference △D by 0.15 to the optical density of the 2l level is 3.05. When the optical density scale is exposed, the light density is small (that is, more transparent) grade, the dry film accepts more ultraviolet light energy, and the polymerization is more complete, and the light density is large (that is, the degree of transparency is poor) grade, the dry film accepts less ultraviolet light energy, and the polymerization does not occur or the polymerization is incomplete, and is displayed or only left part of it during development. In this way, different exposure times can be used to obtain different imaging levels. The use of Ruston 17 optical density ruler is described as follows: a. When exposure is made, the film is downward; b. Put the film on the copper-clad plate for 15 minutes and then expose it. c. After exposure, leave for 30 minutes to develop. Any exposure time is selected as the reference exposure time, expressed by Tn, and the series left after development is called the reference series. The recommended use series is compared with the reference series, and calculated according to the coefficient table of [sensitive word]. Series difference     Coefficient K     Series difference     Coefficient K     one     1.122     6     2.000     2     1.259     7     2.239     3     1.413     8     2.512     4     1.585     9     2.818     5     1.778     10     3.162     When the use series needs to be increased compared to the reference series, the exposure time of the use series T = KTR. When the use series needs to be reduced compared to the reference series, the exposure time of the use series T = TR/K. In this way, the exposure time can be determined by only one test. In the case of no light density scale can also be observed by experience, using the method of gradually increasing the exposure time, according to the brightness of the dry film after development, whether the image is clear, whether the image line width is consistent with the original negative to determine the appropriate exposure time. Strictly speaking, it is unscientific to measure exposure by time, because the intensity of the light source often changes with fluctuations in external voltage and the aging of the lamp. The light energy is defined by the formula E = IT, where E represents the total exposure, in millijoules per square centimeter; I represents the intensity of light in milliwatts per square centimeter; T is the exposure time, in seconds. As can be seen from the above formula, the total exposure E varies with the light intensity I and the exposure time T. When the exposure time T is constant, the light intensity I changes, and the total exposure amount also changes, so although the exposure time is strictly controlled, the total exposure amount accepted by the dry film at each exposure is not necessarily the same, and the degree of polymerization is different. To make each exposure the same energy, a light energy integrator is used to measure the exposure. The principle is that when the light intensity I changes, the exposure time T can be automatically adjusted to keep the total exposure E unchanged. 3) The quality of the photographic substrate The quality of the photographic substrate is mainly manifested in two aspects: optical density and dimensional stability. For optical density, the optical density Dmax is greater than 4, and the minimum optical density Dmin is less than 0.2. Optical density refers to the lower limit of the surface light blocking film in the left ultraviolet light of the base plate, that is, when the optical blocking density of the opaque area of the base plate exceeds 4, a good light blocking purpose can be achieved. The minimum optical density refers to the upper limit of light blocking presented by the transparent film outside the backplate in ultraviolet light, that is, when the optical density Dmin of the transparent area of the backplate is less than 0.2, good light transmission can be achieved. The dimensional stability of the photographic substrate (referring to changes in temperature, humidity and storage time) will directly affect the dimensional accuracy and image overlap of the printed board, and the serious expansion or reduction of the photographic substrate size will cause the photographic substrate image to deviate from the drilling of the printed board. The original domestic SO hard film is affected by temperature and humidity, the size changes greatly, the temperature coefficient and humidity coefficient are about (50-60)×10-6 / ℃ and (50-60)×10-6 / %, for a length of about 400mm S0 base version, the size change in winter and summer can reach 0.5-1mm, The distance from half a hole to a hole may be skewed when imaging on a printed board. Therefore, the production, use and storage of photographic plates are in a constant temperature and humidity environment. The use of thick polyester based silver salt sheets (e.g. 0.18mm) and diazo sheets can improve the dimensional stability of photographic substrates. In addition to the above three main factors, the vacuum system of the exposure machine and the choice of vacuum frame materials will also affect the quality of exposure imaging. Exposure positioning 1) Visual positioning Visual positioning is usually suitable for the use of diazo plates, diazo plates are brown or orange translucent; However, it is not transparent to ultraviolet light, through the diazo image, the welding pad of the bottom plate is aligned with the hole of the printed board, and the exposure can be fixed with tape. 2) Out of stock positioning system positioning The out-of-stock positioning system includes a photographic film punch and a double round hole out. The positioning method is as follows: first, align the front and back plates of the drug film under the microscope; Use a film punch to punch two positioning holes outside the effective image of the base plate. Take one of the base plate with the positioning holes and program the drilling process to obtain the data tape with the component holes and positioning holes drilled at the same time. After drilling the component holes and positioning holes at one time, the metalizing holes of the printed board and the pre-copper plating, the double round holes can be used for positioning exposure. 3) Fix pin positioning The fixed pin is divided into two sets of systems, one set of fixed photographic plate, the other set of fixed printed board, by adjusting the position of the two pins, to achieve the coincidence and alignment of the photographic plate and printed board. After exposure, the polymerization reaction will continue for a period of time, in order to ensure the stability of the process, do not immediately remove the polyester film after exposure, so that the polymerization reaction can continue. Remove the polyester film before development.

Perhaps some people who have just contacted the circuit board factory will be strange, the substrate of the circuit board only has copper foil on both sides, and the insulation layer in the middle, so they do not need to be conductive between the two sides of the circuit board or multiple layers of the line? How can the two sides of the line be connected together so that the current passes smoothly? [Sensitive word] Please see the circuit board manufacturer for you to analyze this magical process - sunk copper (PTH). Copper Plating is short for Eletcroless Plating Copper, also known as Plated Through hole (PTH), is a self-catalyzed REDOX reaction. The PTH process is performed after two or multiple layers of boards are drilled.   The role of PTH: On the non-conductive hole wall substrate that has been drilled, a thin layer of chemical copper is deposited by chemical method to serve as the base for the subsequent plating of copper.   PTH process decomposition: alkaline degreasing → secondary or tertiary counter-current rinsing → roughing (microetching) → secondary counter-current rinsing → pre-leaching → activation → secondary counter-current rinsing → decagging → secondary counter-current rinsing → copper deposition → secondary counter-current rinsing → acid leaching   PTH detailed process explanation: 1. Alkaline oil removal: remove the oil, fingerprints, oxides, dust in the hole; The pore wall is adjusted from negative charge to positive charge to facilitate the adsorption of colloidal palladium in the later process. Cleaning after oil removal shall be carried out in strict accordance with the requirements of the guidelines, and the copper backlight test shall be used for detection.   2. Micro-corrosion: remove the oxide of the plate surface, coarser the plate surface, and ensure that the subsequent copper deposition layer and the substrate bottom copper have a good bonding force; The newly formed copper surface has strong activity and can adsorb colloidal palladium well.   3. Prepreg: It mainly protects the palladium tank from the pollution of the pretreatment tank solution and prolongates the service life of the palladium tank. The main components are the same as the palladium tank except palladium chloride, which can effectively wet the pore wall and facilitate the subsequent activation liquid to enter the hole in time for sufficient and effective activation;   4. Activation: After adjusting the polarity of pre-treated alkaline degreasing, the positively charged pore wall can effectively adsorb enough negatively charged colloidal palladium particles to ensure the average, continuity and density of subsequent copper deposition; Therefore, oil removal and activation are very important to the quality of subsequent copper deposition. Control points: set time; Standard stannous ion and chloride ion concentration; Specific gravity, acidity and temperature are also very important and should be strictly controlled according to the working instructions.   5. Degumming: Remove the stannous ion coated outside the colloidal palladium particles, so that the palladium core in the colloidal particles is exposed, in order to directly and effectively catalyze the start of chemical copper deposition reaction, experience shows that the use of fluoroboric acid as a degumming agent is a better choice.   6. Copper sedimentation: through the activation of palladium nucleus, the chemical copper self-catalytic reaction is induced, and the new chemical copper and the reaction by-product hydrogen can be used as the reaction catalyst to catalyze the reaction, so that the copper sedimentation reaction is continued. After processing through this step, a layer of chemical copper can be deposited on the surface of the plate or the hole wall. In the process, the tank should maintain normal air stirring to convert more soluble bivalent copper.   The quality of the copper sinking process is directly related to the quality of the production of the circuit board, which is only crucial for the circuit board manufacturers, is the main source of the process of through the hole is blocked, and the short circuit is not convenient for visual inspection, and the post-process can only be probabilistic screening through destructive experiments, and can not effectively analyze and monitor a single PCB board. Therefore, once there is a problem, it must be a batch problem, even if the test can not be completed to eliminate, the final product causes great quality hazards, and can only be scrapped in batch, so it is necessary to strictly operate in accordance with the parameters of the work instructions.

SpaceX announced today that IT aims to launch the seventh Starship test flight mission (IFT-7) at 06:00 Beijing time next Tuesday (January 14).   So far, the Starship has completed six test flights - two in 2023, one each in March, June, October, and November of last year, and the successful October mission achieved the feat of "clipping" the super-heavy booster with a tower, which SpaceX will continue to try with IFT-7. In addition, the mission will be the first test of the upper stage of the block 2 Starship. According to SpaceX's website, its starship electronics have been "completely redesigned," with more than 30 cameras throughout the arrow, 25 percent more propellant, 3.1 meters more height, and a redesigned front flap position.   SpaceX wrote in the mission description that the test flight will be the first attempt to deploy a payload in space - 10 simulated satellites "similar in size and weight to the next generation Starlink satellites, as a first rehearsal for a satellite deployment mission." "The Starlink analog satellite will be in the same suborbit as the starship and will aim to splash down in the Indian Ocean," SpaceX added. IT House notes that the super-heavy booster used in the mission will also be the first attempt to reuse previous hardware, primarily "a Raptor engine launched and recovered from Starship's fifth test flight."

House of T, January 9 news, news source Tim Culpan (Tim Culpan) published a blog post yesterday (January 8), reporting that TSMC Arizona factory (Fab 21) has obtained new product orders from Apple, in addition to producing A16 chips for iPhone, It is also producing a SiP chip (Systems-in-Package) for the Apple Watch, believed to be the S9 SiP chip.   The factory began producing A16 Bionic chips for the iPhone 15 and iPhone 15 Plus in September 2024, and the S9 SiP, which is also based on the A16 chip, debuted in 2023. Released with the Apple Watch Series 9 smartwatch. Both the S9 and A16 use TSMC's 4-nanometer process technology (" N4 "), which is the same technical basis for both chips, allowing TSMC to efficiently adapt its Arizona production line to produce both the S9 and A16. Note: Although Apple has now discontinued the Apple Watch Series 9, the Apple Watch Ultra 2 released at the same time still uses the chip.   The source said that the Arizona plant is an important semiconductor manufacturing base for TSMC, but its capacity is still in the early stages. The current operating phase (Phase 1 A) has a monthly production capacity of approximately 10,000 wafers. These wafers are used to produce Apple's A16 and S9 chips, as well as products from other customers such as AMD. The first phase, Phase B, is expected to be completed in early 2025, when the plant's capacity will double to 24,000 wafers per month.

Social media giant Meta announced Wednesday that it will display listings from rival eBay on its Facebook Marketplace platform in response to an antitrust ruling by the European Union. According to Meta's statement, the collaborative testing will start in Germany, France and the United States. Users can browse eBay listings directly on the Facebook Marketplace, but the final completion of the merchandise transaction still needs to be done through the eBay platform. The news sent eBay shares up more than 13% in intraday trading.   In November, the European Union issued an antitrust ruling against Meta for allegedly bundling its classifieds service with Facebook's platform while imposing unfair trading conditions on second-hand goods platform competitors. The ruling ordered Meta to stop the conduct and imposed a hefty fine of 798 million euros ($822 million). However, Meta has made it clear that it does not recognize the EU ruling and has appealed to the EU Court of Justice. However, according to a European Commission spokesperson, Meta is obliged to comply with the decision within 90 days of the original ruling. Meta's antitrust case is one of the last waves of actions against big tech companies under former EU Competition Commissioner Margrethe Vestager. Under her leadership, Brussels regulators have imposed billions of euros in fines on a number of tech giants, including a fine of more than 8 billion euros on Alphabet Inc's Google. It is worth noting that in addition to the EU ruling, the UK Competition and Markets Authority (CMA) has also investigated whether Facebook Marketplace has competition issues. However, unlike the EU's tough attitude, the CMA chose to accept the concessions offered by Meta and ultimately did not further advance the investigation.

Foxconn reported revenue of 654.8 billion yuan (NT $) in December 2024, down 2.64% month on month and up 42.31% year on year, the second-highest in the same period of the calendar year. Revenue in the fourth quarter of 2024 was 2.13 trillion yuan, an increase of 15.03% quarter-on-quarter and 15.17% year-over-year, which was the highest in the same period in the calendar year. The annual revenue in 2024 was 6.8 trillion yuan, an annual increase of 11.37%, the highest in the same period in the calendar year. Looking ahead to the first quarter of 2025, Hon Hai said that although the overall operation is gradually entering the traditional off-season, even in the fourth quarter of 2024, even on the basis of the record single-quarter revenue, it is expected that the seasonal performance of this quarter will still be about the same as the average level of the past five years; Compared to the same period last year, it will be a significant increase. Hon Hai's revenue in December 2024 increased by 42.3% year-on-year, representing the coming trend of AI servers. As for revenue in the fourth quarter of 2024, it hit a record single-quarter high, with both quarterly and year-over-year growth in the range of strong growth, better than the outlook in November last year. At the same time, Nvidia GB200 AI servers have been shipped in a small amount in December 2024 and recognized revenue, and the mass production time is expected to start in late January 2025. In addition, the full-year 2024 revenue performance was better than the company and the market expectations. Hon Hai said its full-year revenue in 2024 increased 11.37% year-on-year, among which the Cloud networking product category, component and other product category and computer terminal product category grew strongly over the same period last year, mainly benefiting from strong demand for AI servers and higher demand for new products. The consumer intelligence category declined slightly from year to year.