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UF 158UL: Redefining the bottom fill material for large chips.

2025-03-17

YINCAE Company Announces Ground-breaking Underfill Material UF 158UL

YINCAE Company (YINCAE), a leading innovator in advanced material solutions, has announced the launch of its ground-breaking underfill material UF 158UL. Designed to meet the growing demand for large chips, this cutting-edge product demonstrates unmatched performance in room-temperature fluidity, fast curing, and high reliability.

The UF 158UL has excellent fluidity and can easily fill gaps as small as 10 microns, even in large chips up to 100*100 mm in size. Its unique formulation ensures rapid curing at room temperature, significantly reducing production times and energy costs. In addition, the reliability of the UF 158UL provides the chip with strong protection against thermal stress, moisture and mechanical shock, ensuring long-term stable operation of the equipment.

YINCAE's Chief Technology Officer said: "We are very excited to launch the UF 158UL, a transformative product in the field of underfill technology. With its superior fluidity, fast curing and high reliability, the UF 158UL enables manufacturers to achieve unprecedented levels of efficiency and quality in the production of large chips."

UF 158UL is suitable for a wide range of applications, including:

High performance Computing
Artificial Intelligence
Automotive Electronics
Aerospace systems

Key features and benefits:

Room temperature fluidity for easy application
Fast curing for improved production efficiency
High reliability for long-term performance
Excellent filling of 10 micron gaps
Compatible with large chips up to 100 x 100 mm.

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UF 158UL: Redefining the bottom fill material for large chips.

News

Cases

SMT Pick And Place Machines

PCB Handling Machine

SMT Machine Spare Parts

Feeder Calibration Jig

SMT Head Unit

SMT Feeders