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Maintenance Guide for Surface Mount Technology (SMT) Machine Drive and Motor System Function description of core componentsCommon brands of component functionsServo motors control the precise movement of the placement head (X/Y/Z axes), Panasonic, YASKAWAThe core power source for high-speed mounting of linear motors (such as FUJI NXT) SiemensThe drive controller parses the motion instructions and outputs current signals Delta and MitsubishiThe encoder provides real-time feedback on the motor position accuracy (±0.01mm) HEIDENHAINI. Daily Maintenance and Care Standards1. Cleaning and dust prevention managementWeekly tasks: Clean the motor heat dissipation fins with anhydrous ethanol (to prevent overheating and burning out); Clean the ventilation filter screen of the drive controller with a vacuum cleaner and an anti-static brush (dust accumulation causes overheating failure rate ↑30%). Taboo: Do not directly blow compressed air onto the encoder (it may damage the optical grid). 2. Maintenance of mechanical componentsLubrication Apply lithium-based grease (such as Mobilith SHC 100) to the guide rails of linear motors and replenish it every 500 hours. The lead screw drive mechanism uses ISO VG32 grade lubricating oil (such as THK AFB-E). Fastening: Check the torque of the motor installation bolts monthly (refer to the equipment manual, for example, YAMAHA requires 10±1N·m). 3. Electrical system inspectionCable status: Check whether the motor power cord/encoder cord is worn (broken skin may cause a short circuit); Shake the test connector (a loose connection will cause an alarm at the ERR-410 position). Grounding resistance: Quarterly detection of the grounding resistance of the drive cabinet ≤4Ω (to prevent static interference). Ii. Diagnosis and Handling of Critical FaultsCommon Alarm Codes and ResponsesPossible causes of alarm codes and emergency handling stepsERR-410 encoder feedback loss 1. Check the encoder connection2. Clean the optical readerERR-720 driver overload (Current over-limit) 1. Measure the motor winding resistance (standard 1-2Ω)2. Check for mechanical jammingERR-500 bus communication timeout 1. Restart the driver controller2. Replace the communication optical fiberJudgment of motor performance attenuationTest method: Run the mounting head without load and record the current value at the rated speed (15% higher than the initial value requires a warning). The vibration velocity of the motor was detected by a laser vibrometer (> 4.5mm/s indicates bearing wear). Replacement threshold: Winding insulation resistance < 100MΩ (measured with a 500V megohmmeter). Iii. In-depth Strategies for Preventive Maintenance (PM)Monthly PM processDriver detection: The oscilloscope measures the output current waveform (a distortion rate > 5% indicates the aging of the IGBT module); Clean the dust on the circuit board (brush + vacuum cleaner, do not use liquids). Motor maintenance The thermal imager scans the temperature rise (the casing needs to be shut down for maintenance if it exceeds 65℃). High-temperature grease (such as SKF LGHP2) is injected into the bearings. Annual major maintenanceDisassemble the motor Replace the bearings (NSK, SKF brands); Clean the stator windings (soaked in special volatile oil); Drive maintenance: Replace the cooling fan (with a lifespan of approximately 20,000 hours); Test the capacity of the electrolytic capacitor (replace it when it decays by 20%). Four. Advanced Techniques for Prolonging LifeReduce electrical stressInstall servo dedicated reactors (to suppress high-frequency harmonics and reduce winding heating); The power supply configuration of the driver is a voltage-stabilizing UPS (voltage fluctuation ≤±10%). 2. Optimization of motion parametersAdjust the acceleration and deceleration curves (such as S-shaped curves to reduce mechanical shock); Hard collisions beyond the range limit are prohibited (rubber buffers should be installed). 3. Spare Parts ManagementReserve key spare parts: encoder modules, driver board power ics (such as Mitsubishi J2 series IPM); Reuse of old parts: Disassemble scrapped motors to recycle magnets and coils. V. Classic Fault CasesProblem: The FUJI NXTⅢ surface mount technology (SMT) machine of a certain factory frequently reports "Z-axis overload" (ERR-720). Diagnosis process: Measure the motor current (no-load 3.2A > standard value 2.5A); Disassembly revealed that the lubricating grease on the guide rail had dried up, causing the resistance to double. Solution: Clean the guide rails and apply fully synthetic grease; Calibrate the pressure of the Z-axis balance cylinder. Result: The failure interval was prolonged from 3 days to 11 months. Comparison of maintenance effectivenessThe indicator has no PM maintenance specification PM maintenanceThe average lifespan of the motor is 1.5 to 2 years and 4 to 5 yearsThe frequency of unexpected shutdowns is 2 to 3 times per month and less than 0.5 times per monthThe stability of the mounting accuracy is ±0.05mm and the fluctuation is ±0.02mmUltimate suggestion: Establish a "Drive - Motor Health File" to record each maintenance data (current/vibration/temperature rise) and predict faults through trends!

How to increase the operation rate of the surface mount technology (SMT) machine First, clarify the core formula and bottleneck of the engagement rateThe downtime rate = (planned operating time - downtime)/planned operating time × 100%Key impact dimensions: equipment failure, line change and debugging, material interruption, program anomaly, and human waiting Ii. Technical Optimization: Reduce forced equipment shutdownsStandardization of preventive maintenance (PM)Daily: Clean the suction nozzle/guide rail, calibrate the camera lens, and check the airway pressure; Weekly: Replace the filter, lubricate the moving parts, and verify the mounting accuracy; Monthly: Deep maintenance of the motor/sensor and update of the equipment firmware.Case: A certain factory reduced the failure rate by 40% through PM standardization and cut the average monthly downtime by 12 hours. 2. Quick Cable Switching (SMED) technologyStep: Prepare materials in advance (the Feeder is pre-loaded with the next model of materials); Standardized nozzle library (compatible with multiple products) Use program templates (to reduce the debugging time of new lines).Effect: The cable replacement time has been reduced from 45 minutes to within 15 minutes. 3. Program and process optimizationMounting path optimization: Adopt the "shortest path algorithm" to reduce the headarm movement distance (such as YAMAHA YSM series); Improvement of panel design: Increase the number of Mark points to enhance recognition stability; Nozzle matching strategy: Dynamically allocate nozzle types based on component sizes (to avoid frequent replacements). Iii. Management Process: Eliminating Hidden Time Waste1. Material early warning systemSet the minimum safety stock (automatically alarm when there are 30 rolls remaining); Implement Feeder RFID management (real-time tracking of material location and lifespan). 2. Real-time monitoring and response mechanismDeploy the MES system to monitor the occupancy rate dashboard (automatically calculate MTBF/MTTR); Establish a "5-minute response mechanism" (technicians must arrive within 5 minutes when the equipment malfunctions). 3. Scientific planning and production schedulingCentralized production of similar products (reducing the frequency of line changes); Reserve a 10% buffer time to deal with sudden downtime. Iv. Personnel Efficiency: Enhance operational and collaborative levels1. Multi-skill trainingThe operator is proficient in handling basic faults (such as high material rejection rate and identification errors); Cross-device training for technicians (supporting different brands of surface mount technology (SMT) machines). 2. Performance incentive linkageSet up a tiered bonus for the engagement rate (such as rewarding the team with ≥85%); Publish the team rankings (to stimulate the sense of competition). 3. Standardization of shift handoverUse the "Handover Checklist" (including equipment status, unfinished work orders, and pending anomalies); Overlap for 15 minutes for face-to-face handover. V. Data-Driven: Continuous Improvement Cycle (PDCA)Application of phased action key points toolPlan analysis of the TOP3 causes of downtime (such as line replacement/material discharge) Pareto chart and fishbone chartA/B test comparison of the Do pilot optimization scheme (such as the dual-track feeder)Check the real-time MES report and OEE dashboard for monitoring the changes in the feeding rate/material discharge rateEffective measures for Act standardization and promotion of SOP updates, training and verificationVi. Practical Case: A certain electronics factory increased its sales rate from 78% to 92%Problem: Frequent line changes (an average of 6 times per day), and the material discharge rate reaches 0.3%. Measures: Introduce intelligent feeding vehicles (reducing the line changing time to 10 minutes); Optimize the parameters of the suction nozzle (reduce the material discharge rate to 0.08%); Implement cross-shift competitions (increase fault response speed by 50%). Result: The monthly production capacity has increased by 18%, and the annual downtime cost savings exceed 2 million yuan. Key summaryTechnical side: Preventive maintenance + SMED + program optimization → Reduce hard downtime; Management side: Material early warning + real-time monitoring + scientific production scheduling → Eliminate hidden waste; Personnel side: Multi-skill training + performance incentives → Enhance response speed; Data side: PDCA cycle → Continuous Improvement. Action Tip: Prioritize addressing the type of downtime with the highest proportion (typically line replacement/failure). For every 1% increase in the downtime rate, the production capacity benefits will increase significantly!

Panasonic surface Mount Technology (SMT) machine nozzle cleaning technology: The guardian of precision manufacturingIn modern electronics manufacturing, surface mount technology (SMT) is the core for the efficient production of electronic products. As a key piece of equipment in the SMT production line, the precision and stability of Panasonic placement machines directly affect the production quality and efficiency. The nozzle, as the most precise consumable component of the surface mount technology (SMT) machine, has a minimum aperture of 0.033mm (01005 nozzle), which is equivalent to one-third of the diameter of a human hair. When solder paste and flux residues clog these micro-pores, the decrease in vacuum adsorption force will lead to component displacement, an increase in material rejection rate, and even the scrapping of the entire board. With the miniaturization of components and the popularization of lead-free processes, the nozzle cleaning technology has been upgraded from an auxiliary process to a key link to ensure the yield rate.I. The Tragedy of Traditional Cleaning: The Dilemma of Efficiency and DamageThe early cleaning methods exposed obvious defects under the requirements of precision: Clean by hand with alcohol and air gunThe operator needs to remove the suction nozzle, wipe the surface with a lint-free cloth dipped in alcohol, and then blow it clean with a high-pressure air gun. However, the dirt in the inner holes cannot be reached, and the infiltration of alcohol can easily cause the adhesive of the reflector plate to dissolve and fall off. What's more serious is that repeated puncturing may cause scratches on the inner wall, resulting in a permanent decline of 89 in the vacuum value. The hidden damage of ultrasonic cleaningAlthough its batch processing capacity attracts production lines (40-60 pieces can be washed at a time), the ultrasonic cavitation effect generates uneven bubbles, causing the black matte coating on the surface to peel off during the collision of the suction nozzles. The maintenance manual of Panasonic standard machine CM402 particularly warns: The qualification rate of Holder vacuum value drops by more than 30% after ultrasonic cleaning. 17. More importantly, for the 01005 suction nozzle (with a hole diameter of ≤0.1mm), ultrasonic waves create an "air lock effect" within the micro-holes, and the dirt is actually locked in. Tests in a certain SMT workshop show that the average lifespan of the suction nozzles after ultrasonic cleaning has been shortened from 8 months to 5 months, and the annual wear and tear cost has increased by 120,000 yuan. Ii. Technological Breakthrough: A Precise Revolution in High-pressure Water Mist CleaningTo break through the cleaning bottleneck, the new generation of cleaning machines integrates fluid mechanics and automatic control technology: Pulsed water mist jet technologyThe core lies in atomizing deionized water into particles of 3-10μm and forming a pulsed kinetic energy field at a supersonic speed of 360m/s (close to the cruising speed of fighter jets). The high-frequency impact at 30 times per second directly peels off the adhering substances on the inner wall of the micro-pores. Meanwhile, the 304 stainless steel nozzle is adjustable in height to adapt to different nozzle sizes 46. Dynamic swing cleaning architectureAdvanced equipment is equipped with articulated placement racks in the cleaning tank, which drive the suction nozzles to swing back and forth by 15°-30° through a CAM mechanism. During the movement, multi-angle spraying ensures full coverage of the blind spots of complex-structured suction nozzles (such as V-shaped, J-shaped, and back-blowing types). Closed-loop drying systemThree-stage drying is triggered immediately after cleaning:1) Centrifugal water flinging: The swing mechanism rotates at 200rpm to remove the surface water film2) Hot air scanning: A temperature-controlled (40-60℃) air knife blows back and forth along the track3) Vacuum dehumidification: The negative pressure environment accelerates water evaporation and eliminates water residue 810 Performance comparison of mainstream cleaning technologies Cleaning method, applicable aperture, cleaning cycle, damage risk, vacuum qualification rate *Alcohol + air gun >0.5mm, 15 minutes per piece, height 90%* Note: The vacuum qualification rate refers to the proportion of CM602 nozzles reaching -85 kpa. 37*Iii. Exclusive Adaptation and Specifications for Panasonic EquipmentPanasonic has formulated differentiated maintenance standards for different models: Weekly maintenance for the CM402/CM602 series After removing the Holder, a special poke needle (with a diameter of 0.03-0.1mm) must be used to pass through the inner hole three times The reflector should be wiped in one direction with a non-static cotton swab dipped in alcohol The vacuum test value needs to be stable at > -65 kpa (CM402) or -85 kpa (CM602) 37 Deep cleaning of the MSHIII modelThe nozzle should be soaked in a mixture of pure water and isopropyl alcohol (in a ratio of 5:1) for 10 minutes to dissolve the stubborn flux. Then, it should be blown clean with a 0.3MPa air gun, and the airflow should be continuous for 3 seconds without interruption. The Jingkechuang C710 cleaning machine is specially optimized for Panasonic production lines: the tray supports a 10×3 matrix arrangement, capable of simultaneously processing 30 CM402 suction nozzles (110/115/120 models), and is preset with "Panasonic Ultra-Fine Aperture Mode", with the pressure automatically adjusted to 0.4MPa to prevent splashing 46. Iv. Benefit Reconstruction: From Cost Center to Value EngineThe benefits brought by precision cleaning far exceed the investment in equipment: Yield improvementAfter a certain mobile phone mainboard factory in Shenzhen introduced water mist cleaning, the material rejection rate caused by clogged suction nozzles dropped from 0.12% to 0.03%, reducing component losses by 2.3 million pieces annually. Equipment efficiency releaseThe increase in the vacuum value of the suction nozzle has optimized the simultaneous suction rate of CM602 to over 85%. With the rearrangement of the feed stations (such as splitting the large-usage resistors into three adjacent stations), the production line balance rate has risen from 69% to 76%, and the single board cycle time has been shortened by 6.5 seconds. Life cycle doublingThe unit price of the original suction nozzle (such as the 205A model of CM402) exceeds 2,000 yuan. After standardized cleaning, the average lifespan was extended from 1.2 years to 2.1 years, saving 370,000 yuan in consumable costs for 10 line bodies annually. V. Future Trends: Integration of Intelligence and GreennessThe new generation of cleaning technology is undergoing multi-dimensional upgrades: IoT remote monitoringThe device is equipped with a built-in vacuum sensor. After cleaning, it automatically generates a vacuum curve graph, which is compared with historical data in the cloud to predict the remaining lifespan. When the vacuum of the CM602 suction nozzle decays to -82 kpa, an automatic replacement alarm is triggered. Zero wastewater regeneration systemThe first-generation model of Jingke Innovation integrates reverse osmosis modules. The wastewater is recycled through ceramic filter cores, and the deionized water recycling rate reaches 95%. Compared with traditional cleaning machines, it saves 80 tons of water annually. AI visual quality inspectionDeep learning algorithms identify scratches on the end face of the suction nozzle and deformation of the aperture. If the edge defect of the 0201 suction nozzle is detected to be greater than 5μm, it is determined to be scrapped, eliminating manual misjudgment. ConclusionThe evolution of Panasonic's cleaning technology for the suction nozzles of surface mount technology (SMT) machines reflects the process of electronic manufacturing's leap towards micro-precision and intelligent control. When a 01005 resistor (with a size of only 0.4×0.2mm) is precisely mounted by a vacuum suction nozzle, behind it is the precise maintenance of a pore diameter of one ten-thousandth of a meter by a water mist of 3 to 10 microns. This is not only a victory of clean technology, but also the ultimate taming of high-end manufacturing against the saying "a miss by a hair can lead to a mistake by a thousand miles". In the future, with the development of 2μm aperture suction nozzles (compatible with component 008004), cleaning technology will face a new round of innovation - and each breakthrough at the micrometer level is reshaping the precision boundaries of the electronic world.

Furnace Temperature Tester: Principle, Application and Maintenance Guide I. Overview of Furnace Temperature TesterThe furnace temperature tester (also known as the furnace temperature tracker or temperature curve tester) is a precision instrument used to measure and analyze the temperature distribution of industrial furnaces, reflow soldering furnaces, wave soldering furnaces, heat treatment furnaces and other equipment. It helps optimize process parameters and ensure product quality by recording the temperature changes at different positions inside the furnace. 1. Main application fieldsElectronic manufacturing: Temperature curve testing for reflow soldering, wave soldering, and curing ovens Automotive industry: Monitoring of coating drying furnaces and heat treatment furnaces Food processing: Verification of baking and sterilization process temperatures Aerospace: Temperature monitoring of composite material curing furnaces 2. Core components of the furnace temperature testerThermocouple sensors (K-type, T-type, etc.) Data logger (high-precision acquisition module) Heat insulation protective box (high-temperature resistant shell) Analysis software (for curve plotting and data analysis) Ii. Working Principle of the Furnace Temperature TesterThermocouple temperature measurement: Thermocouples convert temperature signals into electrical signals based on the Seebeck effect. Data acquisition: The recorder collects temperature data at a high frequency (such as 1-10Hz) and stores it. Heat insulation protection: The tester's casing must be able to withstand high temperatures (typically above 300°C) to ensure that the internal electronic components are not damaged. Data analysis: Import data through the supporting software, generate temperature curves, and compare them with the standard process requirements. Iii. How to Use the Furnace Temperature TesterPreparation before the testSelect the appropriate type of thermocouple (Type K is the most commonly used) Make sure the thermocouple is firmly fixed to avoid loosening and affecting the accuracy of the data Set the sampling frequency (usually 1-10Hz, depending on the process requirements) Check the battery power to avoid power outages during the test 2. Testing processArrange the thermocouples at key temperature measurement points (such as different positions on the PCB board and in the furnace cavity). Start the recorder and place it in the furnace to pass through the heating zone together with the product. After the test is completed, take it out and export the data to the analysis software. 3. Data AnalysisTemperature curve: Observe the temperature changes during the heating, constant temperature, and cooling stages Key parameters: peak temperature, heating slope, reflux time, temperature uniformity Process optimization: Adjust the furnace temperature setting to ensure compliance with product requirements (such as IPC standards) Iv. Maintenance and Care of the Furnace Temperature Tester1. Daily maintenanceClean the thermocouple: Remove any residual flux or contaminants after the test Check the heat insulation box: Make sure there is no damage to avoid high temperature damaging the recorder Calibrate thermocouples: Regularly calibrate with a standard temperature source to ensure accuracy 2. Common Faults and Their HandlingPossible causes and solutions for fault phenomenaAbnormal data fluctuations and poor contact of the thermocouple. Re-fix or replace the thermocoupleThe recorder cannot be turned on. The battery is exhausted. Charge or replace the batteryThe software fails to read data. The interface is damaged or the software malfunctions. Check the USB connection or reinstall the softwareIf the temperature deviation is large and the thermocouple ages, replace the thermocouple and recalibrate it3. Long-term storage suggestionsStore in a dry environment free of corrosive gases Regular charging (Lithium batteries should be kept at 50% charge if not used for a long time) Avoid severe vibration or high-temperature environments V. How to Choose the Right Furnace Temperature TesterTemperature range: Select based on process requirements (for example, reflow soldering requires a temperature above 300°C). Number of channels: Select based on the requirements of the temperature measurement points (commonly 6 to 12 channels). Sampling rate: High-frequency sampling (above 10Hz) is suitable for rapid temperature change processes. Software functions: Whether it supports automatic analysis, report export, and multi-device management. Brand and after-sales service: Choose reliable brands (such as KIC, DATAPAQ, Agilent, etc.). Vi. SummaryThe furnace temperature tester is a key tool for optimizing the production process and ensuring product quality. Correct use and regular maintenance can ensure long-term stable operation. Enterprises should select appropriate equipment based on their own needs and establish standardized testing procedures to enhance production yield and efficiency. For a more detailed furnace temperature test plan, you can consult a professional supplier or equipment manufacturer.

Panasonic Feeder Maintenance and Care Guide I. Daily MaintenanceCleaning work Clean the dust and stains on the surface of the feeder with a lint-free cloth every day Use compressed air to blow away the residual components and debris inside the feeder Special attention should be paid to cleaning the suction nozzle and the feeding channel Lubrication inspection Check the lubrication of each moving part every week Use special lubricating oil to lubricate the guide rails, bearings and other parts in an appropriate amount Avoid lubricating oil contaminating the feeding area Gas line inspection Check whether the gas line connection is firm and whether there is any gas leakage Regularly drain the accumulated water in the gas source treatment unit Ensure that the air pressure is within the range required by the equipment (usually 0.4-0.6MPa). Second, regular maintenanceMonthly maintenance Disassemble and thoroughly clean the feeding mechanism Check the wear conditions of transmission components such as belts and gears Calibrate the feeding accuracy to ensure the accurate position of the components Quarterly maintenance Check whether the electrical connections are loose Test whether the functions of each sensor are normal Replace severely worn parts such as suction nozzles and feeding wheels Annual maintenance Conduct a comprehensive inspection and performance test Replace all vulnerable parts Carry out professional calibration and parameter adjustment Iii. Common Fault HandlingThe feeding is not smooth Check whether there are any foreign objects blocking the material tape channel Confirm whether the feeding gear is worn or loose Adjust the feeding tension setting Malabsorption Clean or replace the suction nozzle Check whether the vacuum pipeline is leaking Adjust the suction height and position False operation alarm Check whether the sensor is dirty or damaged Confirm whether the parameter Settings are correct Check for electrical connection problems Iv. PrecautionsMaintenance is carried out using original factory parts and special tools Be sure to cut off the power supply and gas source before maintenance Record the content and time of each maintenance and establish equipment files Non-professionals are not allowed to disassemble the core components without authorization Regularly participate in the technical training organized by the manufacturer Through standardized maintenance and care, the service life of Panasonic feeders can be significantly prolonged, production efficiency and product quality can be enhanced, and downtime due to faults can be reduced. It is recommended to formulate a personalized maintenance plan based on the actual usage situation.

FUJI Nozzle Daily Maintenance Guide As a key component of the surface mount technology (SMT) machine, the performance of the FUJI nozzle directly affects the placement quality and production efficiency. Good daily maintenance can extend the service life of the suction nozzle and reduce production failures. The following are the key points for daily maintenance of FUJI nozzles: I. Daily Cleaning and maintenanceDaily cleaning Use a dedicated nozzle cleaning stick or a lint-free cloth dipped in a small amount of isopropyl alcohol (IPA) to clean the surface of the nozzle Focus on cleaning the end face and internal channels of the suction nozzle to remove residual solder paste, glue and other contaminants Dry with compressed air after cleaning Inspection items: Check whether there is any wear, deformation or crack on the end face of the suction nozzle Confirm whether the internal passage of the suction nozzle is unobstructed Check whether the O-ring of the suction nozzle is intact and whether it is aged or damaged Second, regular deep maintenanceWeekly maintenance: Put the suction nozzle into the ultrasonic cleaner and clean it with the dedicated cleaning solution for 5 to 10 minutes After cleaning, rinse with deionized water and then dry thoroughly Conduct an air tightness test on the suction nozzle to ensure there is no air leakage Lubrication and maintenance Apply a small amount of special grease to the moving parts of the suction nozzle every month Pay special attention to the lubrication of O-rings and use silicon-based lubricants Iii. Precautions for UseCorrect operation: When installing the suction nozzle, avoid applying excessive force to prevent damage to the precision components When replacing the suction nozzle, use special tools and avoid directly touching the end face of the suction nozzle with your hands Environmental control Keep the workshop environment clean and control the temperature and humidity within the range required by the equipment Avoid the suction nozzle coming into contact with corrosive substances or being subjected to strong impacts Storage management Unused nozzles should be stored in dedicated nozzle boxes It should be thoroughly cleaned and coated with anti-rust oil before long-term storage Iv. Handling of Common ProblemsClogged suction nozzle Use a 0.3-0.5mm needle to carefully unclog it Stubborn blockages can be treated after soaking in a special cleaning solution Insufficient suction power Check whether the suction nozzle is worn or deformed Confirm whether the vacuum pipeline is leaking air Check whether the O-ring is aged and needs to be replaced Through standardized daily maintenance, the service life of FUJI nozzles can be significantly extended, stable mounting performance can be maintained, downtime during production can be reduced, and overall production efficiency can be improved.

Surface Mount Technology (SMT) : The "Invisible Engineer" of Modern Electronic Manufacturing IntroductionSurface Mount Technology (SMT) is one of the core technologies in the field of electronic manufacturing. By directly mounting microelectronic components on the surface of printed circuit boards (PCBS), it has replaced the traditional through-hole mounting technology and has become a key driver for the miniaturization and high performance of modern electronic products. From smartphones to aerospace equipment, SMT is everywhere and can be called the "invisible engineer" of the electronics industry. I. The Historical Evolution of SMTSMT originated in the 1960s and was first developed by IBM of the United States. It was initially used in small computers and aerospace equipment (such as the navigation computer of the Saturn launch vehicle). In the 1980s: The technology gradually matured, and the market share increased rapidly from 10%. In the late 1990s: It became the mainstream process, with over 90% of electronic products adopting SMT. In the 21st century, with the demand for miniaturization (such as 01005 components, BGA packaging) and environmental protection requirements (lead-free solder), SMT continues to iterate and upgrade 47. Ii. Core Principles and Process Flow of SMTThe core of SMT lies in "mounting" and "soldering". Its process is highly automated and mainly consists of the following steps: Solder paste printing Using a stainless steel template cut by laser (with a thickness of 0.1-0.15mm), solder paste is precisely printed onto the PCB pads through a scraper. Solder paste is made by mixing solder powder and flux. The printing thickness needs to be controlled (usually 0.3-0.6mm) 69. Key equipment: Fully automatic solder paste printer, in conjunction with SPI (solder paste detector) for 3D scanning to ensure print quality 69. Component mounting The surface mount machine grabs components (such as resistors, capacitors, and chips) through vacuum nozzles and achieves an accuracy of ±0.025mm with a visual positioning system. It can mount over 200,000 points per hour. Difficulties: Special nozzles are required for irregular-shaped components (such as flexible connectors), and BGA packaging relies on X-ray detection to check the integrity of the solder balls. Reflow soldering By precisely controlling the temperature curve (preheating, soaking, reflow, cooling), the solder paste is melted and reliable solder joints are formed. The peak temperature of lead-free processes is usually 235-245℃, and the high-temperature zone lasts for 40-60 seconds. Risk control: The cooling rate should be ≤4℃/s to avoid lattice defects at the solder joints. Inspection and repair AOI (Automatic Optical Inspection) : It can identify defects such as missing parts, offsets, and tombstones, with an accuracy of 0.01mm. X-ray inspection: Used for quality verification of hidden solder joints such as BGA; Repair workstation: Locally heat to the melting point of the solder and replace the defective component 89. Iii. Technical Advantages of SMTCompared with traditional through-hole technology, SMT has achieved breakthroughs in multiple dimensions: Volume and weight: The component volume is reduced by 40%-60%, and the weight is decreased by 60%-80%, supporting high-density wiring (such as 0.5mm pitch components) 310; Reliability: The defect rate of solder joints is less than ten parts per million, with strong anti-vibration ability and superior high-frequency circuit performance (reduced parasitic inductance and capacitance). 37 Production efficiency: High degree of automation, with labor costs reduced by more than 50%, supporting double-sided mounting and flexible production. Environmental protection and economy: Reduce drilling and material waste, lead-free process complies with RoHS standard 35. Iv. Application Fields of SMTConsumer electronics: Miniaturization of smart phones and laptops; Automotive electronics: High reliability requirements for ECU control modules and sensors; Medical equipment: Portable monitors, precision assembly of implantable devices; Aerospace and military industry: Anti-vibration design for satellite communication equipment and navigation systems 4710. V. Future Trends and ChallengesIntelligence and flexibility: AI-driven adaptive surface mount technology (SMT) machines and reconfigurable production lines adapt to small-batch customization demands. 56 Three-dimensional integration: Enhance space utilization through 3D stacked packaging technology; Green manufacturing: Promote water-based cleaning agents and biodegradable solders to reduce VOC emissions by 59%; Precision limit: To address the mounting challenges of components below 01005 (such as 008004), develop sub-micron positioning technology 9. ConclusionSurface mount technology is not only the technical cornerstone of electronic manufacturing, but also an invisible force driving humanity towards the intelligent era. From "mounting" to "soldering", from micrometers to nanometers, every advancement of SMT is reshaping the boundaries of electronic products. In the future, with the integration of new materials and intelligent technologies, SMT will continue to write a technological legend of being "small but powerful".

competitiveness Why are SMT consumables the "invisible moat" of quality?In the micron-level precision mounting battlefield, a 1% compromise on consumables equals a 100% yield risk: Does solder paste oxidation cause false soldering? -- High-activity no-cleaning solder paste, with a 40% increase in solder joint gloss and a porosity of less than 0.3%; Is the suction nozzle electrostatic adsorption for material discharge? The lifespan of the ceramic anti-static suction nozzle is extended by three times, and the mounting offset is ≤±25μm. Does the tension attenuation of steel mesh affect printing? The nano-coated steel mesh still has a tensile strength of over 35N/cm² after 100,000 prints. Quality truth: 80% of SMT process defects result from the performance degradation of consumables rather than the equipment itself. 【 Solution 】SMT full-chain Consumables Upgrade Plan1. Innovation of solder materials High-activity solder paste: Suitable for 01005 micro-components, reducing cold soldering and bridging (measured yield increased by 2.5%); Low-temperature solder wire: Solves the thermal damage of LED/ thermosensitive components, and the peak reflow temperature can be reduced by 30℃. 2. Iteration of precision tools Carbon fiber nozzle: Lightweight design, mounting speed increased by 15%, compatible with 0.2mm ultra-dense pitch BGA; Laser-cut steel mesh: Open taper accuracy ±1μm, solder paste release rate > 92%. 3. Upgrade of auxiliary consumables Residual cleaning agent: Rapid evaporation within 3 minutes, ion contamination degree < 1.56μg/cm² (compliant with IPC CH-65B); High-temperature resistant red adhesive: After curing, the shear strength is greater than 15MPa, and there is no shedding during wave soldering. 【 Cooperative Value 】 It's not just about consumables; it's also a "yield insurance".Cost controllability: Does inferior steel mesh lead to solder paste waste? The precise hole-making process saves 8% of the solder paste cost. Risk quantifiable: Share SPC data with suppliers and agree that "if consumables cause DPPM to exceed the standard, compensation will be made by batch." Efficiency visualization: Anti-static suction nozzles reduce the frequency of equipment downtime for cleaning, increasing OEE by 12%.

Introduction to SMT process: What are the Differences from SMD?   Table of Contents: 1, Introduction to SMT process: What are the Differences from SMD?2, What is SMT?3, What are the differences between SMT, SMD, SMA and SME?4, SMT production process5, Advantages of SMT Technology6, Introduction to SMT Equipment 1, Introduction to SMT process: What are the Differences from SMD?As electronic products become increasingly complex in function and thinner and lighter in appearance, the precision of electronic components is also getting higher and higher. Due to cost considerations, many factories are gradually entrusting the soldering of electronic components to professional technical factories. Among them, SMT is currently the most mainstream soldering technology. 2, What is SMT?SMT (Surface Mount Technology), also known as surface mounting technology, refers to a technology that installs electronic components such as resistors, capacitors, transistors, and volume circuits onto the surface of a circuit board (PCB). Surface soldering is mainly done by printing Solder Paste on the circuit board to be soldered, placing electronic components, melting the paste at high temperature, allowing the paste to coat the electronic components, and when the temperature cools and solidifies, surface soldering is completed. 3, What are the differences between SMT, SMD, SMA and SME?These three words are all closely related to SMT. In simple terms, SMT is a soldering technology, SMD and SMA are electronic components to be soldered, and SME is the soldering machine. Abbreviation, full name, Chinese explanationSMT Surface Mount Technology is the technology of installing electronic components on the surface of a circuit boardSMD Surface Mount Device (SMT) is a single electronic component installed on the surface of a circuit board, such as resistors, capacitors, and integrated circuitsSMA Surface Mount Assembly (SMT) is an electronic component installed on the surface of a circuit board, and this component contains one or more combinations of electronic components, such as Bluetooth modules and WIFI modulesSME Surface Mount Equipment is a machine that installs SMDS on the surface of circuit boards 4, SMT production processTo successfully install electronic components on a circuit board through SMT, mainly three processes need to be gone through: Process description: Use the equipmentSolder paste printingPrint solder paste at the positions on the PCB where electronic components need to be installed with a solder paste printer2. Make a patchPlace electronic components at the positions where solder paste is printed on the PCB with a component placement machine3. Re-welding heatingThrough the reflow oven heating, the solder paste on the PCB is melted to connect and fix the electronic components to the PCB in the reflow oven 5, Advantages of SMT TechnologyThe biggest difference between SMT and the previous through-hole mounting technology is that SMT does not require reserving through-holes for the pins of electronic components, thus allowing for the use of smaller electronic components. There are mainly the following three advantages for electronic products to adopt SMT technology: 1. Thinner and lighter in size:By using smaller electronic components, the required circuit board area will also decrease, and the volume of electronic products can become lighter. 2. More high-end products:When electronic components become smaller and thinner, electronic products can be applied to more diverse fields, such as micro-robots, cpus, portable electronic products, etc., and more precise and high-end products can be designed. 3. Easier mass production:SMT uses machinery and equipment to complete surface soldering. Compared with the manual insertion operation in the past, it is more suitable for mass production, and the manufacturing process is also more stable than through-hole insertion. 6, Introduction to SMT Equipment Dispensing machine SMT equipment recommendation - The dispensing machine is used to precisely dot, inject, apply and drip liquid to the correct position of the product. It can be used for dotting, drawing lines, circular or arc-shaped shapes. This model is patented for the Automatic Process Calibration Injection Technology (CPJ), which can automatically compensate for the viscosity of the colloid to maintain a fixed amount of glue. It will also automatically measure the weight of each glue point and adjust the pressure to maintain the consistency of the glue amount for each component Fully automatic solder paste printing machineSMT Equipment Introduction - The fully automatic solder paste printer is a fully automatic model. After setting the relevant parameters, it can automatically feed in the board, align, print solder paste, and discharge the board. It can automatically optically correct the printing position. The printing accuracy is ±12.5. The two-stage waiting mode can reduce the machine's transportation time. It supports multiple printing demolding modes and can select the best printing conditions for different parts. Nitrogen reflow soldering furnaceProfessional SMT equipment - nitrogen reflow ovenUniformly heated gas is provided to melt the solder paste, allowing electronic components to be connected to the circuit board. Compared with the common reflow oven, the nitrogen reflow oven can effectively reduce the bubbles at the solder joints and avoid thermal damage to power devices at a high-quality level. Chip placement machineSMT equipment application - A surface mount technology (SMT) placement machine is a device that accurately places electronic components on a PCB by moving the placement head. It can identify various types of component patterns and place components at high speed and high precision. It is divided into two sections, with each section consisting of two tables for CHIP processing. Each Table is equipped with 12 suction nozzles, capable of simultaneously processing 12 CHIP components. Selective wave solderingSMT product equipment - Selective wave soldering is used in through-hole mounting processes. By taking advantage of the easy movement of small nozzles, the PCB is fixed on the rack, and the nozzles are moved to bring the solder solution into contact with the solder pins of electronic components. The tin pot and tin pump system can move freely in the X/Y/Z axis directions, and the entire process can precisely control the tin eating position through the program. Welding selection machineHigh-quality SMT equipment - adjustable PCB positioning frame of the soldering machine, two tin POTS with independent Z-axis control, increase the flexibility of soldering, and two nozzles of different sizes can be used according to different solder joints. Automatic soldering machineThe automated SMT equipment - the automatic soldering machine is an automated soldering device that can significantly save the time for replacing fixtures. During the soldering process, it can simultaneously position the products to be soldered. It is equipped with a soldering iron thermometer to measure the temperature and make corrections based on the actual temperature. It is also equipped with a built-in temperature check system. If the temperature is abnormal, it cannot act. Automatic pneumatic nozzles and roller brushes can also be used to clean the soldering iron tip. Selective coating/dispensing systemTaiwan SMT equipment - Selective coating/dispensing system is used to precisely spray liquids and colloids onto the correct positions of products, providing a stable amount of adhesive for a wide range of PCBS, BGA, etc. The mechanical drive mechanism with XYZ repeatability accuracy of 25 microns can flexibly perform conformal coating and dispensing.

The grand opening of SMT training center to help cultivate intelligent manufacturing talents 【 March 7, 2023, Zhuhai 】 -- Today, the high-profile SMT Training Center was officially inaugurated in Zhuhai. The center, jointly established by Fulo Trading /Global Soul Limited, aims to train highly qualified SMT (surface mount technology) professionals for the electronics manufacturing industry and contribute to the sustainable development of the intelligent manufacturing industry.Focus on the needs of the industry to create a professional training platformWith the rapid development of the global electronics manufacturing industry, SMT technology as the core process of modern electronic product manufacturing, the demand for highly skilled personnel is growing. The establishment of SMT training center is precisely to cope with this industry challenge, for enterprises to transport SMT technical personnel with a solid theoretical foundation and rich practical experience.The center is equipped with international leading SMT production line equipment, including automatic placement machine, reflow furnace, AOI testing equipment, etc., to provide students with real production environment simulation. At the same time, the center also invited a number of industry experts and senior engineers as instructors, combining theory and practice, to provide students with a full range of training courses. School-enterprise cooperation to promote the deep integration of industry, university and researchThe establishment of SMT training Center is an important practice of school-enterprise cooperation. As a leading Global electronics manufacturing service provider, Global Soul Limited has extensive industry experience and technology accumulation. Fulo Trade has deep teaching resources and scientific research strength in the field of vocational education. The two sides have jointly created this high-level training platform.At the opening ceremony, Fong Wenfeng, Chairman of Fulo Trading, said: "The establishment of the SMT Training Center is an important move for us to fulfill our social responsibility and promote the development of the industry. We hope that through this platform, we can train more high-quality technical talents for the industry and help China's intelligent manufacturing go to the world. Diversified curriculum system to meet the needs of different levelsThe SMT Training Center has designed a diversified curriculum system to meet the needs of students at different levels. Both beginners and experienced practitioners can find a training program that suits them here. The course covers SMT basic theory, equipment operation and maintenance, process optimization, quality management and other aspects to ensure that students can fully master the core skills of SMT technology.In addition, the center also provides customized enterprise training services to help enterprises improve the technical level of employees, optimize production processes, and improve production efficiency.Looking forward to the future, to help the industry high-quality developmentThe establishment of SMT training center not only injected new vitality into the electronic manufacturing industry, but also provided new ideas for the development of vocational education. In the future, the center will continue to deepen school-enterprise cooperation, expand training areas, explore more innovative models, train more high-quality technical talents for the industry, and help the high-quality development of China's intelligent manufacturing. About SMT Training CenterSMT Training Center is a professional training organization of Global Soul Limite and Zhuhai Fulo, dedicated to training highly skilled SMT technical talents for the electronics manufacturing industry. With advanced equipment and professional teachers, the center provides diversified training courses to help students achieve career development and promote technological progress in the industry.Media Contact:Global Soul LimitedAttn:Yi LeeMobile:+86-13662679656Address: Room 3B016,B Block,Hao Yun Lai Bussiness Building , Liutang road ,Bao'an District,Shenzhen,Guangdong,ChinaWebsite: https://www.smtmachine-spareparts.com

In the rapid development of the electronics manufacturing industry The functional application of Jingtuo turntable type selective welding closely matches the market trend Welding parameters personalized Settings   With the diversification of demand for electronic products, electronic manufacturing enterprises small batch, multi-variety production demand gradually increased, different from the traditional batch production mode, rotating disk welding can be set according to different product types and specifications, quickly adjust the process parameters, improve production flexibility.     Precision welding and positioning control   With the increasingly rich functional characteristics in many products, there are higher requirements for the accuracy and stability of welding on PCB, rotary disk welding can achieve welding accuracy of ±0.05mm, spray positioning accuracy of ±0.05mm, rotary disk accuracy of ±0.1mm, to avoid dislocation or deviation in the welding process, reduce welding defects. It plays a vital role in improving the overall performance of the product.       Compared with traditional selective welding What are the advantages of rotating disk selective welding? Under the requirements of electronic manufacturing enterprises to improve production efficiency, reduce costs and improve product quality, rotary type selective welding has more prominent advantages, compared with the traditional selective welding, more efficient, energy saving, flexible and other characteristics. 01   Rotating disk station welding The floor area is reduced by 60%, and the space utilization is high   02   Spray and weld simultaneously The dual-zone movement time is shortened to less than 1.5s, and the efficiency and productivity are high   03   Single point high precision nozzle The amount of solder used is small and the energy consumption is low Reduce the waste of energy and materials and meet environmental requirements   Complete in one step New welding process upgrade   Driven by the continuous deep cultivation and innovation of the R & D team, the product performance has been continuously upgraded, and AOI testing, six stations operating at the same time, spray, welding, and testing integration has been realized.   ▲ Six stations operate at the same time   ▲ Spray & Welding &AOI testing integration     To better meet the needs of customers for production efficiency, to achieve a full range of quality control, to achieve zero discharge of defective products, leading the new direction of welding technology.   We are well aware of the pulse of the market, understand the needs of customers, so the turntable welding can not only meet the high standards of the electronics manufacturing industry, but also adapt to the innovation and development of industry technology; In the future, Jintuo will continue to actively explore new application scenarios and market opportunities, and inject new vitality and momentum into the development of the electronics manufacturing industry.

With the in-depth development of a new round of scientific and technological revolution and industrial change, intelligent manufacturing is leading the direction of global manufacturing development and change, in the field of electronics manufacturing, PCBA circuit board SMT and DIP production equipment intelligence is a key link in the transformation and upgrading of electronic manufacturing enterprises, which is conducive to improving the traditional manufacturing industry model and reducing labor costs. Improve production efficiency and yield of electronic products. The DIP furnace post-inspection and repair process is an important node to improve the production efficiency of the entire production line. Starting from the post-wave welding section, the equipment is followed by the connection station, AOI, selective wave welding, AOI, involving testing, spraying, welding and other processes.   At present, there are several problems in the furnace repair line on the market 1, PCB bad detection of high misjudgment, low straight-through rate   2, the selection of welding using the mechanical origin positioning method, resulting in tooling errors, mechanical errors, so that the tin nozzle can not be accurately positioned to the bad solder joints   3, for different defect categories, need to manually set parameters Especially in the current trend of miniaturization and precision of electronic components, the problems on the market have restricted the improvement of production efficiency, in the new generation of post-furnace repair program, for improving the detection accuracy rate, reducing the defective rate, improving the level of production line automation and other needs to improve, effectively improve the repair efficiency, the repair yield increased to 99.95%.     AOI detection improves accuracy   AOI inspection equipment equipped with high performance industrial cameras, no need to flip over, seamless docking wave soldering production line, to meet the high-speed DIP process capacity.     Combined with a multi-spectral ultra-high-speed programmable optical system, multiple images are captured per detection field, which helps to accurately identify undesirable features. The AOI test has higher detection and lower false positives than the traditional post-furnace repair line.   AOl detects the bad position and type of the product solder joint, and transmits the coordinates of the bad spot to selective wave soldering to realize information interconnection.     Optimization of repair yield by selective wave soldering   Selective wave soldering for spray, preheating, welding integration design, small footprint, low energy consumption, high production efficiency.     Instead of the traditional mechanical origin positioning method, the solder joint positioning is based on the PCB position, and the bad coordinate information transmitted by AOI is read     It can set individual parameters for each solder joint according to the information in the component library, and automatically repair bad solder joints without the use of manual.     Precision spray flux system with spray test function and flow level monitoring, spray speed up to 20mm/s, positioning accuracy of ±0.15mm, accurate target through hole positioning. The spraying of flux helps to remove oxides from metal surfaces and prevent reoxidation, while increasing welding firmness.     The dynamic preheating at the bottom is combined with the hot air preheating at the top, and the preheating division control system gives full play to the maximum energy efficiency ratio, effectively preventing the warping and deformation of the circuit board caused by uneven heating at different positions.   ▲ Blue is the welding preheating temperature curve, the heating speed is fast, the temperature is high The smooth crest can make the soldering effect better, Jingtuo choose welding using electromagnetic drive to control the crest system, to achieve a stable crest state, with 3-axis servo control system, accurate positioning of the need to repair the solder joint area.       AOI secondary inspection maximizes control quality After selective wave soldering, the repaired PCB will be tested twice, and the qualified PCB will be sent to the blanking machine, and the unqualified PCB will be sent to the selective welding again by the defective product distributor.     The AOI responsible for the secondary inspection will also pass the detected bad spot information to the selective welding, and the defective PCB will be repaired twice by the selective welding     The secondary repair provides guarantee for the yield of the product, improves the process of the front section, and achieves the goal of zero defects in the production line.     In the context of intelligent manufacturing enabling manufacturing industry to improve the quality and upgrade, Jinto based on the independent research and development of technical achievements, composed of post-furnace inspection and repair automation solutions, safe and efficient, fully automatic testing, to comprehensively improve the production efficiency of the electronic manufacturing industry; All along, Jintuo has been committed to providing high-quality intelligent solutions for the comprehensive upgrading of PCBA electronic manufacturing industry chain, and achieving quality improvement, cost reduction and efficiency improvement in new energy vehicles, medical devices, communications electronics, aerospace and other industries. Strengthen the basic support capacity of advanced manufacturing, and help the manufacturing industry to transform and upgrade to intelligent manufacturing.