Global Soul Limited Company News

Exploring 3D AOI: An Advanced Detection Method to Enhance Circuit Board Quality In today's era of rapid technological development, the application of electronic products is everywhere. As the core component of electronic products, the quality of circuit boards directly affects the performance and stability of the entire product. Today, let's explore 3D AOI together - this advanced detection method that enhances the quality of circuit boards. 3D AOI, namely Automatic Optical Inspection, is an advanced inspection system that integrates optical imaging technology, precise mechanical motion and intelligent algorithms. It is like an "intelligent guardian" in the field of circuit board quality inspection, always maintaining a sharp "insight" to ensure that every circuit board meets high-quality standards. Exploring 3D AOI: An Advanced Detection Method to Enhance Circuit Board Quality The unique advantages of 3D AOI Precise detection, leaving no detail unchecked3D AOI employs high-resolution optical imaging equipment, which can clearly capture every detail on the surface of the circuit board. Whether it is the tiny solder joints, component pins, or the connection conditions of the circuits, they can all be accurately imaged and analyzed. Its detection accuracy can reach the micrometer level or even smaller, which enables it to easily identify subtle defects that are difficult to detect with the naked eye, such as voids at solder joints, short circuits, and open circuits, providing a reliable guarantee for the quality of circuit boards. Exploring 3D AOI: An Advanced Detection Method to Enhance Circuit Board Quality Fast and efficient, enhancing production efficiencyIn the rapidly developing electronics manufacturing industry, production efficiency is of vital importance. 3D AOI has high-speed detection capabilities and can complete the detection tasks of large-area circuit boards in a short time. Through an automated scanning system, it can conduct a comprehensive inspection of circuit boards quickly and orderly, eliminating the need for manual individual checks. This significantly shortens the inspection time, enhances production efficiency, and provides strong support for the production progress of enterprises. Non-contact detection to protect the integrity of the circuit boardTraditional circuit board inspection methods may cause certain damage to the circuit boards, while 3D AOI adopts a non-contact optical inspection method, avoiding the damage to the circuit boards caused by physical contact. This non-contact detection method not only protects the integrity of the circuit board but also ensures the accuracy of the detection results, avoiding misjudgments caused by possible human factors introduced during the contact process. The Application of 3D AOI in Circuit Board Quality Inspection Defect detection and identification3D AOI can detect various common defects on circuit boards in real time, such as solder joint defects, missed component placement, and misalignment. By analyzing and comparing the detected images, the system can quickly and accurately identify the location, type and size of the defects, and issue an alarm in a timely manner. This enables production personnel to identify and handle problems in the first instance, preventing defective products from flowing into the next process and effectively increasing the one-time pass rate of the products. Exploring 3D AOI: An Advanced Detection Method to Enhance Circuit Board Quality Dimension measurement and tolerance inspectionFor some circuit boards with high requirements for dimensional accuracy, 3D AOI also has powerful dimensional measurement and tolerance detection functions. It can precisely measure the dimensions and positional dimensions of components on the circuit board, compare them with the set tolerance range, and determine whether they meet the requirements. This helps ensure the installation accuracy of each component on the circuit board, improving the reliability and stability of the circuit board. Quality analysis and data statisticsThe 3D AOI system can not only detect the quality of circuit boards, but also has the functions of quality analysis and data statistics. It can record and analyze the detection data in real time and generate detailed detection reports. Through the analysis and statistics of these data, enterprises can understand the quality problems and potential risks existing in the production process, adjust the production technology and parameters in a timely manner, optimize the production process, and thereby continuously improve the quality level of circuit boards. Exploring 3D AOI: An Advanced Detection Method to Enhance Circuit Board Quality The development prospects of 3D AOI With the continuous innovation and development of electronic technology, 3D AOI technology is also constantly upgrading and improving. In the future, 3D AOI is expected to achieve greater breakthroughs in the following aspects: Higher detection accuracy and speedWith the continuous advancement of optical imaging technology and intelligent algorithms, the detection accuracy and speed of 3D AOI will be further improved. This will enable it to adapt to more complex and advanced circuit board inspection requirements, providing more efficient and accurate inspection services for the electronics manufacturing industry. The degree of intelligence and automation is constantly improvingIn the future, 3D AOI will be deeply integrated with advanced technologies such as artificial intelligence and big data to achieve more intelligent detection and analysis. It can automatically learn and identify various complex defect patterns, continuously optimize the detection algorithm and parameters, and improve the accuracy and efficiency of detection. At the same time, seamless integration with automated production lines enables quality inspection and control throughout the fully automated production process. Exploring 3D AOI, we have witnessed the great potential and advantages of this advanced detection method in enhancing the quality of circuit boards. Today, in the electronics manufacturing industry, which is constantly pursuing high quality and high efficiency, 3D AOI is undoubtedly an indispensable technical means. It provides a reliable guarantee for the quality inspection of circuit boards and promotes the development of the electronic manufacturing industry. Let's look forward together to 3D AOI bringing more innovations and breakthroughs to the electronics industry in the future!

148 Inspection Items for PCB Design -PCB checklist I. Data Input StageWhether the materials received in the process are complete (including: schematic diagram, *.brd file, material list, PCB design description, as well as PCB design or change requirements, standardization requirement description, and process design description file)2. Confirm that the PCB template is up to date3. Confirm that the positioning devices of the template are in the correct positions4. Whether the PCB design description, as well as the requirements for PCB design or modification and standardization requirements, are clear5. Confirm that the prohibited devices and wiring areas on the outline drawing have been reflected on the PCB template6. Compare the shape drawing to confirm that the dimensions and tolerances marked on the PCB are correct, and the definitions of metallized and non-metallized holes are accurate7. After confirming that the PCB template is accurate and error-free, it is best to lock the structure file to prevent it from being moved due to accidental operation148 Inspection Items for PCB Design -PCB checklistIi. Post-layout inspection stagea. Device inspection8. Confirm whether all device packages are consistent with the company's unified library and whether the package library has been updated (check the running results with viewlog). If they are not consistent, be sure to Update the Symbols9. Confirm that the main board and the sub-board, as well as the single board and the backboard, have corresponding signals, positions, correct connector directions and silk-screened markings, and that the sub-board has anti-misinsertion measures. The components on the sub-board and the main board should not interfere10. Whether the components are 100% placed11. Open the place-bound of the TOP and BOTTOM layers of the device to check whether the DRC caused by the overlap is allowed12. Mark whether the points are sufficient and necessaryFor heavier components, they should be placed close to the PCB support points or support edges to reduce the warping of the PCBAfter the components related to the structure are laid out, it is best to lock them to prevent accidental movement of positionsWithin a 5mm radius around the crimping socket, there should be no components on the front that exceed the height of the crimping socket, and no components or solder joints on the back16. Confirm whether the component layout meets the process requirements (with particular attention to BGA, PLCC, and surface mount sockets)For components with metal casings, special attention should be paid to not colliding with other components, and sufficient space should be left18. Interface-related devices should be placed as close as possible to the interface, and the backplane bus driver should be placed as close as possible to the backplane connector19. Has the CHIP device with wave soldering surface been converted to wave soldering packaging?20. Whether the number of manual solder joints exceeds 50When installing taller components axially on a PCB, horizontal installation should be considered. Leave room for lying down. And consider the fixation method, such as the fixed pads of the crystal oscillator22. For components that require heat sinks, ensure there is sufficient distance from other components and pay attention to the height of the main components within the range of the heat sinkb. Function Check23. When laying out the digital circuit and analog circuit devices on the digital-analog mixed board, have they been separated? Is the signal flow reasonable24. The A/D converter is placed across analog-to-digital partitions.25. Whether the layout of the clock devices is reasonable26. Whether the layout of high-speed signal devices is reasonable27. Whether the terminal devices have been placed reasonably (the source-end matching serial resistance should be placed at the driving end of the signal; The intermediate matching string resistance is placed in the middle position. Terminal matching serial resistance should be placed at the receiving end of the signal.28. Whether the number and position of decoupling capacitors in IC devices are reasonable29. When the signal lines take planes of different levels as reference planes and cross the plane division area, check whether the connection capacitors between the reference planes are close to the signal trace area.30. Whether the layout of the protection circuit is reasonable and conducive to division31. Is the fuse of the single-board power supply placed near the connector and there are no circuit components in front of it32. Confirm that the circuits for strong signals and weak signals (with a power difference of 30dB) are laid out separately33. Whether the devices that may affect the EMC test are placed in accordance with the design guidelines or by referring to successful experiences. For example: The reset circuit of the panel should be slightly close to the reset buttonc. Fever34. Heat-sensitive components (including liquid dielectric capacitors and crystal oscillators) should be kept as far away as possible from high-power components, heat sinks and other heat sources35. Whether the layout meets the thermal design requirements and the heat dissipation channels (implemented according to the process design documents)d. Power Supply36. Is the IC power supply too far from the IC37. Whether the layout of the LDO and the surrounding circuits is reasonable38. Is the layout of the surrounding circuits such as the module power supply reasonable39. Whether the overall layout of the power supply is reasonablee. Rule Settings40. Have all the simulation constraints been correctly added to Constraint Manager41. Whether the physical and electrical rules are correctly set (pay attention to the constraint Settings of the power network and the ground network)42. Whether the spacing Settings of Test Via and Test Pin are sufficient43. Whether the thickness and scheme of the laminated layer meet the design and processing requirements44. Have the impedances of all differential lines with characteristic impedance requirements been calculated and controlled by rules148 Inspection Items for PCB Design -PCB checklistIii. Inspection stage after wiringe. Digital Modeling45. Have the traces of the digital circuit and the analog circuit been separated? Is the signal flow reasonable46. If A/D, D/A and similar circuits divide the ground, do the signal lines between the circuits run from the bridge points between the two places (except for the differential lines)?47. Signal lines that must cross the gaps between power sources should refer to the complete ground plane.48. If the stratum design zoning without division is adopted, it is necessary to ensure that digital signals and analog signals are routed separately.f. Clock and high-speed section49. Whether the impedance of each layer of the high-speed signal line is consistent50. Are high-speed differential signal lines and similar signal lines of equal length, symmetrical and parallel to each other?51. Make sure the clock line moves as far inside as possible52. Confirm whether the clock line, high-speed line, reset line and other strong radiation or sensitive lines have been laid out as much as possible in accordance with the 3W principle53. Are there no forked test points on clocks, interrupts, reset signals, 100M/gigabit Ethernet, and high-speed signals?54. Are low-level signals such as LVDS and TTL/CMOS signals satisfied as much as possible with 10H (H is the height of the signal line from the reference plane)?55. Do the clock lines and high-speed signal lines avoid passing through dense through-hole and through-hole areas or routing between device pins?56. Has the clock line met the (SI constraint) requirements? (Has the clock signal trace achieved fewer vias, shorter traces, and continuous reference planes? The main reference plane should be GND as much as possible?) If the GND main reference plane layer is changed during layering, is there a GND via within 200mil from the via? If the main reference plane of different levels is changed during layering, is there a decoupling capacitor within 200mil from the via?57. Whether the differential pairs, high-speed signal lines, and various types of buses have met the (SI constraint) requirementsG. EMC and Reliability58. For the crystal oscillator, is a layer of ground laid beneath it? Has the signal line been avoided crossing between the device pins? For high-speed sensitive devices, is it possible to avoid signal lines passing through the pins of the devices?59. There should be no sharp angles or right angles on the single-board signal path (generally, it should make continuous turns at a 135-degree Angle. For RF signal lines, it is best to use arc-shaped or calculated beveled copper foil).60. For double-sided boards, check whether the high-speed signal lines are routed closely next to their return ground wires. For multi-layer boards, check whether the high-speed signal lines are routed as close to the ground plane as possibleFor the adjacent two layers of signal traces, try to trace them vertically as much as possible62. Avoid signal lines passing through power modules, common mode inductors, transformers, and filters63. Try to avoid long-distance parallel routing of high-speed signals on the same layer64. Are there any shielding vias at the edge of the board where the digital ground, analog ground and protected ground are divided? Are multiple ground planes connected by vias? Is the through-hole distance less than 1/20 of the wavelength of the highest frequency signal?65. Is the signal trace corresponding to the surge suppression device short and thick on the surface layer?66. Confirm that there are no isolated islands in the power supply and stratum, no overly large grooves, no long ground surface cracks caused by overly large or dense through-hole isolation plates, and no slender strips or narrow channels67. Have ground vias (at least two ground planes are required) been placed in areas where signal lines cross more floors?h. Power supply and ground68. If the power/ground plane is divided, try to avoid the crossing of high-speed signals on the divided reference plane.69. Confirm that the power supply and ground can carry sufficient current. Whether the number of vias meets the load-bearing requirements. (Estimation method: When the outer copper thickness is 1oz, the line width is 1A/mm; when the inner layer is 0.5A/mm, the current of the short line is doubled.)70. For power supplies with special requirements, has the voltage drop requirement been met71. To reduce the edge radiation effect of the plane, the 20-hour principle should be satisfied as much as possible between the power source layer and the stratum. If conditions permit, the more the power layer is indented, the better.72. If there is a ground division, does the divided ground not form a loop?73. Did the different power supply planes of adjacent layers avoid overlapping placement?74. Is the isolation of the protective ground, -48V ground and GND greater than 2mm?75. Is the -48V area only a -48V signal backflow and not connected to other areas? If it cannot be done, please explain the reason in the remarks column.76. Is a protective ground of 10 to 20mm placed near the panel with the connector, and are the layers connected by double rows of interlaced holes?77. Does the distance between the power line and other signal lines meet the safety regulations?i. No-cloth AreaUnder metal housing devices and heat dissipation devices, there should be no traces, copper sheets or vias that may cause short circuitsThere should be no traces, copper sheets or through holes around the installation screws or washers that may cause short circuits80. Is there any wiring at the reserved positions in the design requirementsThe distance between the inner layer of the non-metallic hole and the circuit and copper foil should be greater than 0.5mm (20mil), and the outer layer should be 0.3mm (12mil). The distance between the inner layer of the shaft hole of the single-board pull-out wrench and the circuit and copper foil should be greater than 2mm (80mil).82. The copper sheet and wire to the edge of the board are recommended to be more than 2mm and at least 0.5mm83. The copper skin of the inner stratum is 1 to 2 mm from the edge of the plate, with a minimum of 0.5mmj. Solder pad lead-outFor CHIP components (0805 and below packages) with two pad mounts, such as resistors and capacitors, the printed lines connected to the pad should preferably be symmetrically led out from the center of the pad, and the printed lines connected to the pad must have the same width. This regulation does not need to be considered for lead lines with a width less than 0.3mm(12mil)85. For the pads connected to the wider printing line, is it best to pass through a narrow printing line in the middle? (0805 and below packages)86. The circuits should be led out from both ends of the pads of devices such as SOIC, PLCC, QFP, and SOT as much as possiblek. Screen printing87. Check if the device bit number is missing and if the position can correctly identify the device88. Whether the device bit number complies with the company's standard requirements89. Confirm the correctness of the pin arrangement sequence of the device, the marking of pin 1, the polarity marking of the device, and the direction marking of the connector90. Whether the insertion direction markings of the master board and the sub-board correspond91. Has the backplane correctly marked the slot name, slot number, port name and sheath direction92. Confirm whether the silk-screen printing addition as required by the design is correct93. Confirm that anti-static and RF board labels have been placed (for RF board use).l. Coding/Barcode94. Confirm that the PCB code is correct and complies with the company's specifications95. Confirm that the PCB code position and layer of the single board are correct (it should be in the upper left corner of the A side, the silk-screen layer).96. Confirm that the PCB coding position and layer of the backplane are correct (it should be in the upper right corner of B, with the outer copper foil surface).97. Confirm that there is a barcode laser printed white silk-screen marking area98. Confirm that there are no wires or through holes larger than 0.5mm under the barcode frame99. Confirm that within a 20mm range outside the white silk-screened area of the barcode, there should be no components with a height exceeding 25mmm. Through hole100. On the reflow soldering surface, the vias cannot be designed on the pads. The distance between the normally opened via and the pad should be greater than 0.5mm (20mil), and the distance between the green oil-covered via and the pad should be greater than 0.1mm (4mil). Method: Open Same Net DRC, check DRC, and then close Same Net DRC.101. The arrangement of the vias should not be too dense to avoid large-scale fractures of the power supply and the ground plane102. The through-hole diameter for drilling is preferably no less than 1/10 of the plate thicknessn. Technology103. Is the device deployment rate 100%? Is the conduction rate 100%? (If it does not reach 100%, it needs to be noted in the remarks.)104. Has the Dangling line been adjusted to the minimum? The remaining Dangling lines have been confirmed one by one.105. Have the process issues fed back by the Process department been carefully checkedo. Large-area copper foil106. For large areas of copper foil on the Top and bottom, unless there are special requirements, grid copper should be applied [use diagonal mesh for single plates and orthogonal mesh for backplates, with a line width of 0.3mm (12 mil) and a spacing of 0.5mm (20mil].107. For component pads with large copper foil areas, they should be designed as patterned pads to avoid false soldering. When there is a current requirement, first consider widening the ribs of the flower pad, and then consider full connectionWhen large-scale copper distribution is carried out, it is advisable to avoid dead copper (isolated islands) without network connections as much as possible.109. For large-area copper foil, it is also necessary to pay attention to whether there are illegal connections or unreported DRCp. Test points110. Are there sufficient test points for various power supplies and ground (at least one test point for every 2A current)?111. It is confirmed that all networks without test points have been confirmed to be streamlined112. Confirm that no test points have been set on the plugins that were not installed during production113. Have the Test Via and Test Pin been fixed? (Applicable to the modified board where the test pin bed remains unchanged)q.DRC114. The Spacing Rule of Test via and Test pin should first be set to the recommended distance to check DRC. If DRC still exists, the minimum distance setting should then be used to check DRC115. Open the constraint setting to the open state, update DRC, and check if there are any prohibited errors in DRC116. Confirm that DRC has been adjusted to the minimum. For those that cannot eliminate DRC, confirm one by one.r. Optical positioning point117. Confirm that the PCB surface with surface mount components already has optical positioning symbols118. Confirm that the optical positioning symbols are not embossed (silk-screened and copper foil routed).119. The background of the optical positioning points must be the same. Confirm that the center of the optical points used on the entire board is ≥5mm away from the edge120. Confirm that the optical positioning reference symbol of the entire board has been assigned coordinate values (it is recommended to place the optical positioning reference symbol in the form of a device), and it is an integer value in millimeters.For ics with a pin center distance of less than 0.5mm and BGA devices with a center distance of less than 0.8mm (31 mil), optical positioning points should be set near the diagonal of the componentss. Solder mask inspection

Several major trends in the development and innovation of PCB technology in circuit board factories The development of electronic technology is advancing at an unprecedented pace. Only by recognizing the development trend of PCB technology and actively developing and innovating production techniques can circuit board manufacturers find a way out in the highly competitive PCB industry. Circuit board manufacturers should always maintain a sense of development. The following are several views on the development of PCB production and processing technology:1. Develop component embedding technologyComponent embedding technology is a huge transformation of PCB functional integrated circuits. The formation of semiconductor devices (referred to as active components), electronic components (referred to as passive components) or passive component functions in the inner layer of PCBS, known as "component embedded PCBS", has begun mass production. However, for the development of circuit board manufacturers, it is also an urgent task to first solve the problems of analog design methods, production technology, as well as quality inspection and reliability guarantee. PCB factories need to increase resource investment in systems including design, equipment, testing and simulation in order to maintain strong vitality.Several major trends in the development and innovation of PCB technology in circuit board factories2. HDI technology remains the mainstream development directionHDI technology has promoted the development of mobile phones, driven the growth of LSI and CSP chips (packages) for information processing and basic frequency control functions, as well as template substrates for circuit board packaging. It has also facilitated the development of PCBS. Therefore, circuit board manufacturers need to innovate PCB production and processing technologies along the HDI path. As HDI embodies the most advanced technologies of contemporary PCBS, it brings fine conductors and tiny hole diameters to PCB boards. The application of HDI multi-layer boards in terminal electronic products - mobile phones (mobile phones) are a model of the cutting-edge development technology of HDI. In mobile phones, micro-fine wires (50μm - 75μm/50μm - 75μm, wire width/spacing) on PCB motherboards have become mainstream. In addition, the conductive layer and the thickness of the board have become thinner. The miniaturization of conductive patterns brings about high-density and high-performance electronic devices.3. Continuously introduce advanced production equipment and update the circuit board manufacturing processHDI manufacturing has matured and become increasingly sophisticated. With the development of PCB technology, although the subtractive manufacturing method, which was commonly used in the past, still dominates, low-cost processes such as addition and semi-addition methods have begun to emerge. A new manufacturing process method for flexible boards that uses nanotechnology to metallize holes and simultaneously form conductive patterns on PCBS. High-reliability and high-quality printing methods, inkjet PCB technology. Produce fine wires, new high-resolution photomasks and exposure devices, as well as laser direct exposure devices. Uniform and consistent plating equipment. Production component embedding (passive and active components) manufacturing and installation equipment and facilities.Several major trends in the development and innovation of PCB technology in circuit board factories4. Develop PCB raw materials with higher performanceWhether it is rigid PCB circuit board or flexible PCB circuit board materials, with the global lead-free electronic products, there is a demand for these materials to have higher heat resistance. Therefore, new types of materials with high Tg, small thermal expansion coefficient, small dielectric constant, and excellent dielectric loss tangent are constantly emerging.5. The prospects for photoelectric PCBS are broadThe photoelectric PCB circuit board transmits signals by using the optical path layer and the circuit layer. The key to this new technology lies in manufacturing the optical path layer (optical waveguide layer). It is an organic polymer formed by methods such as lithography, laser ablation, and reactive ion etching. At present, this technology has been industrialized in Japan, the United States and other countries. As a major manufacturing country, Chinese circuit board manufacturers should also actively respond and keep pace with the development of science and technology.

AOI short-circuit algorithm The short-circuit algorithm is an image processing algorithm for detecting whether there is a link between ROI regions. The detection of short-circuit algorithms in AOI can be divided into two types: one is to eliminate the background, and the other is to retain the background. Aleader AOI adopts the background elimination method to detect whether pathways occur in the two detection point areas. As follows: AOI short-circuit algorithm There was no short circuit between ① and ②. A short circuit occurred between ③ and ④. The flag for the short-circuit algorithm in algorithm selection is "Short2".

How can pre-furnace AOI become a key tool for improving SMT yield? In SMT (Surface Mount Technology) production lines, the quality of the surface mount process directly determines the reliability of the final product and production efficiency. However, the defect rate in the screen printing and component surface mount processes remains high, becoming a key factor restricting manufacturing efficiency. How can the defect rate be reduced and the return on investment (ROI) be improved through intelligent detection equipment? This article takes ALeader Shenzhou Vision's furnace front AOI (Automatic Optical Inspection) equipment as an example to deeply analyze its investment returns and explore how to achieve cost reduction and efficiency improvement through scientific selection.How can pre-furnace AOI become a key tool for improving SMT yield? Defect distribution and loss in SMT process According to industry data, when the process quality reaches the world-class level, the defects of the SMT production line mainly come from the following links: Screen print-related issues: accounting for as high as 51%, including defects such as uneven solder paste thickness, offset, and bridging. Component surface mount issues: accounting for 38%, such as incorrect components, missing components, reverse polarity, offset, etc. These defects not only cause direct waste of materials and manpower, but also trigger the following hidden costs: Non-direct manufacturing costs: such as rework hours, equipment downtime. After-sales and warranty costs: Customer complaints and repair costs caused by defective products entering the market. Opportunity cost: Loss of orders or damage to brand reputation due to quality issues. The benefits of AOI in front of the furnace: From "Post-event Remediation" to "Pre-event Prevention" Traditional inspection relies on post-furnace AOI or manual visual inspection, but at this point, defects have caused irreversible losses. The intervention of the pre-furnace AOI can: Real-time interception of defective products: Detect and repair defects before reflow soldering to prevent their amplification. Process optimization feedback: Quickly identify problems in the printing or surface mount technology (SMT) process through data statistics to enhance the overall process stability. Cost savings Direct cost: Reduce material waste and rework labor. Hidden costs: Reducing after-sales risks and opportunity losses. The investment cost of the furnace front AOI and the core advantages of ALeaderWhen choosing a pre-furnace AOI, it is necessary to comprehensively evaluate the equipment performance and the full life cycle cost. ALeader Shenzhou Vision has become the preferred choice in the industry with the following advantages: 1. High cost-performance equipment cost ALeader's AOI equipment (such as the ALD87 series) adopts a modular design, supports flexible configuration, has an initial investment lower than that of similar imported brands, and is compatible with various complex PCB board inspection requirements.How can pre-furnace AOI become a key tool for improving SMT yield? 2. Low operating costs Troubleshooting: The intelligent diagnostic system can quickly locate faults and reduce downtime. Maintenance and Training: We offer localized service teams and standardized training to lower the maintenance threshold. Programming efficiency: Equipped with AI algorithms, it supports "one-click learning" to quickly adapt to new models, significantly reducing programming time. 3. High precision and low false alarm rate The ALeader device adopts a self-developed structured light Moire fringe PMP vision system, combined with deep learning algorithms, featuring a low false alarm rate and significantly reducing the labor cost for re-inspection. Key selection factors: How to maximize the Return on Investment (ROI)?Match the production line requirements: Select the appropriate model based on the PCB board size, component density and detection speedEvaluate long-term costs: Focus on equipment stability, consumable costs and the service capabilities of suppliers.Data integration capability: ALeader devices support MES system integration, enabling real-time analysis of inspection data and facilitating the upgrade of intelligent manufacturing. The AOI in front of the furnace is a key tool for improving quality and reducing costs in SMT production lines, and the equipment selection directly determines the return on investment. ALeader China Vision, with its high cost performance, low operating costs and intelligent detection technology, helps customers achieve significant returns in a short period of time. For manufacturing enterprises that pursue efficient production, choosing ALeader's furnace front AOI is not only a technological upgrade but also a strategic investment that is sure to make a profit.

Key Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and Efficiency In the electronics manufacturing industry, surface mount technology (SMT), as a core production process, plays a decisive role in the quality and performance of electronic products. The 3D DAOI (3D Automated Optical Inspection) and 3DSPI (3D Solder Paste Inspection) technologies, with their high precision and high efficiency, It has become the "precision guardian" in the SMT process. I. What is SMT process? The SMT process, namely Surface Mounted Technology (SMT), is a popular technology and process in the electronic assembly industry. It refers to a series of technological processes carried out on the basis of the Printed Circuit Board (PCB for short). SMT, or surface Mount technology, is used to install leadless or short-lead surface mount components (referred to as SMC/SMD, also known as chip components in Chinese) on the surface of printed circuit boards or other substrates, and then assemble them into circuit connections through methods such as reflow soldering or dip soldering. SMT patch processing has many advantages: 1. High assembly density, small size and light weight of electronic products. The volume and weight of surface mount components are approximately one-tenth of those of traditional through-hole components. After adopting SMT, the volume of electronic products is usually reduced by 40% to 60%, and the weight is reduced by 60% to 80%.2. High reliability, strong vibration resistance and low defect rate of solder joints.3. It has excellent high-frequency characteristics and can reduce electromagnetic and radio frequency interference.4. It is easy to achieve automation, which can improve production efficiency, reduce costs by 30% to 50%, and also save materials, energy, equipment, labor and time, etc. Ii. The Crucial Role of 3DSPI in the solder paste printing Process - Controlling quality from the sourceKey Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and EfficiencyPrecisely monitor the quality of solder paste printingSolder paste printing is the crucial first step in SMT. 3DSPI, like quality inspectors, provides comprehensive and real-time monitoring. With the help of a high-precision optical imaging system, it accurately captures the distribution of solder paste on the PCB board, such as height, volume, shape and other parameters. Once there is a deviation, it can be promptly fed back to prompt personnel or system adjustments and ensure the quality of solder paste printing. Realize the closed-loop control of the printing process3DSPI can transmit data to printing equipment to achieve closed-loop control. If uneven thickness of solder paste is detected, the printing equipment will automatically adjust parameters such as speed and pressure to stabilize the quality of solder paste printing, improve efficiency and reduce rework waste. The third-generation 3DSPI - ALD67 series of ALeader from Shenzhou Vision is equipped with bidirectional ejector light system technology, which can completely solve the shadow and diffuse reflection problems during the detection process, making the three-dimensional detection accuracy of solder paste higher. It is also equipped with a 12-megapixel high-speed camera, which offers faster detection speed and more detailed and rich images. It can effectively detect whether there are defects such as volume, area, height, offset, insufficient solder, excessive solder, continuous solder, solder tips, and contamination in solder paste printing, effectively helping SMT production lines in electronic manufacturing achieve higher automation, improve quality and efficiency, and reduce costs. 5-minute rapid programming supports Gerber-free automatic programming. Standard dual gratings solve shadow problems. Supports mixed detection of solder paste and red glue. Powerful SPC system (multiple real-time monitoring modes). Remote control system (one person controlling multiple machines). Real-time three/two-point lighting function (data sharing with AO|). Supports closed-loop feedback with printing machines. Supports MES control system. High detection rate. High direct pass rate and fast testing speed. Key Applications of 3DAOI/SPI in SMT Process: Technical Analysis for Enhancing Production Quality and Efficiency Iii. Core Functions of 3DAOI in the Mounting and Soldering ProcessesKey Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and EfficiencyDetection of component mounting accuracy 3DAOI acquires three-dimensional topography data of PCBS and components through structured light or laser scanning technology to detect defects such as missing parts, offsets, tilting, standing stones, side standing, overturning parts, wrong parts, damage, reverse direction, component height measurement, warping, excessive or insufficient solder, false soldering, and short circuits. Solder joint quality analysis and defect classification After reflow soldering, 3DAOI quantitatively analyzes the mounting of components and the height, volume and area of solder joints to determine soldering defects such as false soldering. Its detection data can be connected to the MES system to achieve SPC statistical process control and facilitate process optimization. The 3DAOl developed by ALeader of Shenzhou Vision features a unique technology of high precision and wide range, capable of simultaneously obtaining high-quality 2D images and shadowless 3D measurements. It covers the inspection requirements of the smallest components and solder joints in current production. Under the "sharp eyes", difficult problems such as warping, false soldering, and false soldering will have no trace. It effectively helps SMT production lines in electronic manufacturing achieve higher levels of automation, improve quality, enhance efficiency and reduce costs.Product Features:Intelligent automatic programming technology enables rapid program creation, leading the industry2. Multi-directional surround full-coverage projection technology ensures the best 3D detection capability3. With over 40 years of AI deep learning, the system automatically matches the best 3D detection algorithm4. 3D digitalization can optimize the entire SMT process and achieve higher levels of automation5. A complete IPC standard public library and a simple operation interface make programming effortless Iv. 3DAOI/SPI Collaboration and Data Integration - Shenzhou Vision Builds an Efficient Quality Assurance System In the SMT production line, 3DSPI and 3DAOI form a double closed loop of "prevention - detection" : 3DSPI pre-controls the quality of solder paste printing and reduces the risks of subsequent processes.The 3DAOI post-verification of the mounting and soldering results ensures the final yield. Shenzhou Vision's unique two-point/three-point integration platform has a powerful data integration capability and can integrate the data resources of 3DSPI (3D Solder paste Inspection Machine) and 3DAOI (3D Automatic Optical Inspection equipment). Through in-depth mining and precise analysis of massive data, the platform can not only provide comprehensive and in-depth analysis of the root causes of defects, but also make trend predictions based on historical and real-time data. This series of functions provides strong support for customers on the road to pursuing zero-defect production, helping them truly achieve the high-standard goal of zero-defect production. Key Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and Efficiency V. Industry Applications and Trends With the growth in demand for miniaturization of electronic components and high-mix assembly lines, 3DAOI/SPI technology is developing towards higher speed, higher precision, and AI-driven directions.As a leading enterprise in the industry, Shenzhou Vision, with its advanced technology and innovative solutions, provides high-quality 3DAOI/SPI inspection products and services for enterprises through deep learning algorithms and modular hardware design. This helps electronic manufacturing enterprises stand out in the fierce market competition and achieve a dual improvement in product quality and production efficiency.

Why is 3D SPI indispensable for high-precision solder paste inspection? Introduction: The "Achilles' heel" in SMT manufacturing - solder paste printing process In today's booming modern electronic manufacturing industry, surface mount technology (SMT) has become the core process of PCB assembly. With its characteristics of high efficiency and precision, it supports the vast system of large-scale production of electronic products. However, a shocking figure is like a heavy hammer sounding the alarm: According to the Global Surface Mount Association, as many as 74% of the defects generated throughout the SMT process originate from the solder paste printing stage. This step is like the ankle of Achilles in Greek mythology. It may seem insignificant, but it has become the most vulnerable and problem-prone key point in the entire SMT process. With the continuous upgrading and replacement of electronic products, high density and miniaturization have become significant trends in their development. Traditional 2D detection technology has become inadequate in the face of this new trend and is unable to meet the strict detection requirements of today. Against such a background, this paper will deeply analyze the technical shortcomings of 2D SPI, elaborate in detail the revolutionary breakthroughs brought by 3D SPI, focus on introducing the five core technical advantages of ALeader 3D SPI of Shenzhou Vision, and conduct analysis in combination with practical application cases to understand the key technologies of high-precision solder paste detection. The fatal flaw of 2D SPI: The limitation of plane detection The basic principle of 2D detectionTraditional 2D SPI (Solder Paste Inspection), or Solder paste printing inspection, relies mainly on top lighting and camera imaging technology. It is like a "flat detective", only able to observe the state of the solder paste from above, mainly checking whether the area size of the solder paste meets the standard, whether there is any deviation in position, whether there is any missed printing, and whether there is any obvious bridging phenomenon. However, this detection method is like looking at the world through a thin veil, only revealing partial information on the plane, but being powerless against three-dimensional issues such as height and volume. Undetectable key defectsWhy is 3D SPI indispensable for high-precision solder paste inspection? Take the actual case of a certain automotive electronics manufacturer as an example. After using 2D SPI for detection, the manufacturer considered the product qualified. However, in the subsequent reliability test, a false soldering problem of up to 10% occurred. After in-depth analysis, it was ultimately found that the root cause of the problem was actually the insufficient height of solder paste. This case fully exposes the limitations of 2D SPI in detecting critical defects. It is like an inspector with "visual defects", unable to accurately capture the hidden dangers beneath the plane. The Technological Revolution of 3D SPI: The Leap from Planar to Three-dimensional Why is 3D SPI indispensable for high-precision solder paste inspection? The core parameters of 3D detection 3D SPI technology is like an expert proficient in stereoscopic detection. It can conduct comprehensive and precise detection of solder paste from multiple dimensions. Its core parameters are astonishing: Height: It features ultra-high resolution and can precisely measure the minute height changes of solder paste, just like using an extremely fine ruler to measure the height of an object.Volume: It features high measurement accuracy and can accurately calculate the volume of solder paste, ensuring that the amount of solder paste used is just right.Three-dimensional shape: It can completely reconstruct the three-dimensional outline of the solder paste, allowing us to clearly see the shape and distribution of the solder paste, just like taking a comprehensive "photo" of the solder paste.Coplanarity: It can precisely measure the height difference of multiple weld points, ensuring the flatness of the welding surface and avoiding welding problems caused by inconsistent heights. Comparison of Key TechnologiesWhy is 3D SPI indispensable for high-precision solder paste inspection? It can be clearly seen from the comparison that 3D SPI has made a qualitative leap in the detection dimension and measurement parameters. It can detect many key defects that 2D SPI cannot detect, and the defect detection rate has also been significantly improved. Meanwhile, it can also adapt to the detection of smaller and more complex micro-components, providing a reliable guarantee for the production of high-density and miniaturized electronic products. The five core technologies of ALeader 3D SPI of Shenzhou Vision Dual projection grating technologyThis technology employs orthogonal bidirectional grating projection, as if illuminating an object simultaneously from two different directions, effectively eliminating the shadow effect of a single light source. This unique design significantly enhances the measurement accuracy, as if adding a layer of "precision filter" to the measurement results, enabling us to obtain the information of solder paste more accurately.Why is 3D SPI indispensable for high-precision solder paste inspection? Adaptive optical systemThis system has a strong adaptability and can automatically compensate for the warping of PCBS, just like a considerate "restorer", keeping the PCBS flat during the inspection process. Meanwhile, it can also automatically identify multi-color PCBS. Whether it's green, black or blue PCBS, it can handle them with ease. In addition, its anti-reflective algorithm can avoid sandblasting treatment, which greatly improves the detection efficiency and reduces the production cost. Why is 3D SPI indispensable for high-precision solder paste inspection? Intelligent algorithm engineThe defect classification technology based on deep learning endows 3D SPI with a "smart brain", which can classify and identify various defects quickly and accurately. The real-time 3D modeling function can construct an accurate 3D model of solder paste, providing strong support for subsequent analysis and processing. The processing capacity of millions of point cloud data ensures that the system can still operate efficiently when dealing with a large amount of data, without any lag or errors. Full-process data traceabilityThe complete 3D data of each PCB will be archived, just like establishing a detailed "growth file" for each PCB. These data can be seamlessly integrated with the MES system to achieve information-based management of the production process. Meanwhile, it supports the IPC-CFX standard, ensuring the universality and compatibility of data and facilitating data sharing and analysis for enterprises. Intelligent closed-loop control3D SPI can be linked with the printing press in real time, just like a tacit "partner". When problems are detected in solder paste printing, it can automatically adjust the parameters of the printing machine to achieve preventive quality control. In addition, it can also provide preventive maintenance tips to detect potential hazards of the equipment in advance and avoid production disruptions caused by equipment failures.Why is 3D SPI indispensable for high-precision solder paste inspection? ALeader 3D SPI - A must-have for high-quality SMT production With the continuous development of electronic products towards miniaturization and high density, the requirements for SMT quality control are also getting higher and higher. Due to its technical limitations, 2D SPI has been unable to meet the current production demands. With its leapfrog development from planar to three-dimensional, 3D SPI has advantages such as three-dimensional full-parameter detection, intelligent early warning system and process optimization capabilities. It can completely solve the blind spots of 2D detection, achieve preventive quality control and continuously improve the process level. As an outstanding representative of 3D SPI technology, ALeader 3D SPI of Shenzhou Vision has helped customers achieve remarkable effects such as reduced defect rate, reduced rework cost and increased straight-through rate through its five core technical advantages. In the future field of electronic manufacturing, 3D SPI will undoubtedly become a must-have for high-quality SMT production, providing strong technical support for the development of the electronic industry.

How far are the "dark factories" in the SMT industry? From science fiction concepts to industrial blueprints "Dark Factory", as one of the highest forms of intelligent manufacturing, represents a fully automated production environment that requires no human intervention. Its name comes from the characteristic that it can continue to operate even when the lights are turned off. In the field of SMT (Surface Mount Technology), this concept is no longer confined to science fiction imagination but is steadily moving from concept to implementation. With the continuous and in-depth advancement of the "Made in China 2025" strategy and the deep integration of Industry 4.0 technologies like the gentle spring rain, the SMT industry is accelerating towards the grand goal of becoming a "dark factory" at an unprecedented speed. Strong technical support for the SMT industry to achieve "dark factories" 1. Highly automated production equipment: precise and efficient manufacturing engines Modern SMT production lines have achieved a high degree of automation in core processes such as printing, surface mount technology, and reflow soldering. Among them, the 3D SPI (solder paste Detector) and 3D AOI (Automatic Optical Inspection) devices of ALeader from Shenzhou Vision performed outstandingly: 100% online inspection: Just like a sharp quality inspector, it conducts real-time monitoring of every production link to ensure that the product quality is impeccable.Real-time data feedback: It can promptly and accurately feed back various types of data during the production process, providing a strong basis for production decisions.Automatic sorting of defective products: Efficiently and accurately identify and sort out defective products, preventing them from flowing into the next process, which greatly improves production efficiency and product quality.Process parameter adjustment: Based on the actual production situation, optimize and adjust the process parameters to ensure the stability and consistency of the production process. Intelligent material management System: A precise and efficient material delivery manager The material distribution system combining AGV and intelligent warehousing provides efficient and precise material guarantee for SMT production: Automatic identification of material requirements: Based on advanced information technology, it can accurately identify the demands for various materials in the production process in real time.Precise delivery to designated workstations: Just like well-trained delivery personnel, materials are accurately and error-free delivered to the corresponding production workstations.Achieve timely material supply: Strictly follow the production schedule, provide the required materials on time, avoid material overstock and shortage, and effectively reduce inventory costs.Automatic inventory shortage warning: When the inventory drops below the safety threshold, the system will automatically issue a warning to remind you to replenish goods in time and ensure the continuity of production.Digital Twin and Remote Monitoring: The intelligent hub of the production process Based on the digital twin technology of the MES system, a highly intelligent production management platform has been built for SMT production: Virtual mapping of the entire production process: Precisely replicate the entire production process, enabling managers to have a comprehensive understanding of the production situation in a virtual environment, identify problems in advance and make timely adjustments.Predict equipment maintenance requirements: By analyzing the operation data of the equipment, the maintenance requirements of the equipment can be predicted in advance, effectively avoiding the impact of equipment failures on production.Remote diagnosis and debugging: Even when in a different location, remote diagnosis and debugging of production equipment can be carried out through the network, which greatly improves the efficiency and timeliness of equipment maintenance.Optimize production scheduling: Based on multiple factors such as production orders, equipment status, and personnel arrangements, intelligently optimize production scheduling to enhance production efficiency and resource utilization. The severe challenges currently faced Although the SMT industry has made remarkable progress at the technical level, achieving a true "dark factory" still faces many challenges. The issue of device heterogeneity: The predicament of communication barriers and the lack of unified interface standardsDevices of different brands have differences in communication protocols and interface standards, which makes the interconnection and interoperability among devices extremely difficult. Just like when people of different languages communicate, due to the lack of a unified standard, obstacles are prone to occur in information transmission, which affects the overall coordination of the production system. Exception handling capability: A weak point in dealing with complex and sudden problemsAlthough automated equipment can handle routine production tasks, its autonomous decision-making ability is still limited when it comes to sudden and complex problems. When confronted with some extreme situations or special problems, manual intervention is often required to solve them, which to some extent restricts the realization process of "dark factories". Initial investment cost: A huge capital threshold for automation transformationThe full automation transformation requires a huge investment, including equipment procurement, system integration, personnel training and other aspects. For many enterprises, this is a considerable expense that may have a significant impact on their financial situation, thereby hindering the pace of automation transformation. The shortage of technical talents: The scarcity of professionals in intelligent manufacturingThe insufficient number of professionals with the ability to operate and maintain intelligent manufacturing systems has become another challenge for enterprises to achieve "dark factories". Such talents not only need to master advanced technical knowledge but also possess rich practical experience. However, at present, such talents are relatively scarce in the market. ALeader's breakthrough strategy of Shenzhou Vision: Implement the blueprint in stages In response to the above challenges, ALeader of Shenzhou Vision has proposed an innovative solution to achieve a "dark factory" in phases. Device interconnection stage: Build communication Bridges to achieve device collaborationSupporting the IPC-CFX standard, it enables all-round data collection and interaction from equipment, production lines to enterprise-level systems, and realizes real-time monitoring of equipment status. This is like building a communication bridge, allowing devices of different brands to communicate smoothly and form an organic whole. Intelligent optimization stage: Inject a smart brain to enhance production efficiencyDeploy AI-driven process optimization algorithms, continuously optimize production processes through data analysis and learning, and achieve predictive maintenance. At this point, the production system is like having a smart brain, capable of making precise decisions based on the actual situation and preventing problems in advance. Autonomous decision-making stage: Grant autonomous decision-making power to achieve intelligent productionDevelop an adaptive control system and build a digital twin platform. When encountering production abnormalities, the system can handle them independently, achieving a high degree of automation and intelligence in the production process. At this point, the "dark factory" truly possesses independent decision-making capabilities and can flexibly adjust production strategies according to various situations. Future Outlook: The Trilogy of SMT "Dark Factories" According to the industry development trend forecast, the "dark factory" in the SMT industry will be gradually realized in the following three stages. Key production lines take the lead and light up the "dark lights" for demonstrationAt this stage, key production lines will be the first to achieve "production with lights off". The fully automated production of a single product line has become a reality, unmanned operations in key processes have been applied, and local "dark light" demonstration workshops have been built. These demonstration workshops will become benchmarks in the industry, leading the SMT industry to take a solid first step towards becoming a "dark factory". The entire factory is undergoing intelligent upgrading to enhance its comprehensive strengthWith the continuous development of technology and the accumulation of experience, the entire factory will achieve intelligent upgrading. Multiple product lines can be produced in coordination, intelligent logistics achieves full coverage, and over 80% of the processes are operated unmanned. At this point, the production efficiency, product quality and cost control ability of the SMT factory will all be significantly enhanced. The true "dark factory" has emerged, reshaping the industrial landscapeThe entire production process is fully autonomous in decision-making, with 7× 24-hour unattended operation and the ability to adapt to multi-variety production. This will have a profound impact on the electronics manufacturing industry, completely transforming the face of electronics manufacturing and redefining the production methods and competitiveness standards of the manufacturing industry. Seize the opportunity and embark on a new journey in the SMT industry The "dark factory" in the SMT industry is not an unattainable dream but a gradually becoming industrial upgrading goal. With the deep integration of cutting-edge technologies such as 5G, AI and the Internet of Things, as well as the continuous innovation of professional manufacturers like ALeader of Shenzhou Vision, more and more SMT "dark factories" will be put into operation in the future. This is not only a major transformation in the SMT industry, but also will bring new development opportunities to the entire manufacturing industry. Enterprises should start from now on to actively plan their intelligent transformation routes, invest resources in phases and steps, and gradually build their own "dark" production capabilities. Only in this way can we gain the upper hand in the future industrial competition and lead the trend of industry development.

"Record of Huangshan" Huangshan Mountain, formerly known as Yishan, was renamed to its current name during the Tianbao period of the Tang Dynasty. Everyone says, "After visiting the Five Great Mountains, no other mountains are worth seeing; after visiting Mount Huang, no other mountains are worth seeing." Although this statement was made by Xu Xiake, it is no more than a common saying among scholars and literati. Today when I climbed Mount Huangshan, I saw a throng of tourists, shoulder to shoulder, no different from a bustling market. At the foot of the mountain, the porters crouched by the path, their faces dark and their veins bulging from their necks. Their eyes are like hooks, specifically targeting those plump tourists. "Three hundred for going up the mountain, two hundred and fifty for going down." The price was squeezed out from the gaps between their sallow teeth. There was a fat merchant, accompanied by his beautiful wife, who hired two sedan chairs. The porters carried this heavy burden, their calf muscles tensed up like bowstrings, and their sweat dripping onto the stone steps was immediately evaporated by the scorching sun. The merchant in the sedan chair, however, was only focused on holding up his mobile phone, taking pictures of the "strange pines and rocks" that had long been worn out by the pictures. The pine trees on the mountain are indeed peculiar. They are rooted in the crevices of the rocks, and their branches are twisted like dragons and snakes. Tourists surrounded the "Welcoming Pine" to take pictures, pushing and shoving each other, and even started to quarrel. A young man wearing glasses stood for half an hour in an attempt to secure the best shooting position, and the people queuing behind him had already glared angrily. Finally, he finished taking the photo, but it was just another one no different from others. Those stones have been given various names: "Monkey Watching the Sea", "Immortal Guiding the Way", "Dream Pen Blooming"... In fact, they are just ordinary stones. Through people's forced interpretation, they have become "famous scenic spots". The tour guides were salivary as they explained those absurd legends, while the tourists nodded frequently, pretending to be completely absorbed. I think if these stones were casually thrown by the roadside, probably no one would give them a second look. The mountains are shrouded in mist, sometimes enveloping the peaks and sometimes scattering a thin line. This is rather ethereal, but unfortunately it is always disrupted by the noise of tourists. Look! Sea of clouds! Someone exclaimed. So everyone rushed in, raising their cameras and mobile phones, clicking non-stop. Are they really looking at the sea of clouds? No, they are just looking through the camera, just taking photos to show off on social networks. A fashionable girl, with her back to the sea of clouds, took a selfie for over twenty minutes, but was still not satisfied. Her boyfriend was already impatient, but could only force a smile. The hotel on the top of the mountain is astonishingly expensive. An ordinary room costs over a thousand yuan. The tourists complained while obediently paying. At night, I heard the couple in the next room quarrelling, seemingly about the itinerary for tomorrow. Their child was crying non-stop, and the sound pierced through the thin wall. The next morning, everyone got up in the dark to watch the "sunrise over Mount Huangshan". People crowded on the viewing platform, shivering with cold. The sky was gradually brightening, but the sun was reluctant to show itself. Finally, a red sun emerged from the sea of clouds, and a burst of cheers erupted among the crowd. However, within just five minutes, people scattered and went back to the hotel to have the expensive and unappetizing breakfast. On the way down the mountain, I saw a cliff with the four big characters "Great Rivers and Mountains" engraved on it, painted in a dazzling red. Beside it, however, there were piles of mineral water bottles and snack packaging bags. The cleaner hung on the rope and struggled to clear the garbage. His figure was swaying above the bottomless abyss, which was terrifying. However, the tourists turned a blind eye to this and just kept hurrying along. Back at the foot of the mountain, I saw those sedan chair bearers again. Their business doesn't seem to be doing well today. They are squatting and smoking in groups of three or five. A porter tried to sell me a "specialty of Huangshan", saying it was a Ganoderma lucidum picked by his own family. On closer inspection, I found that they were just some common mushrooms coated with a layer of bright oil. The beauty of Mount Huangshan has been renowned since ancient times. Nowadays, tourists are like ants and business is like a tide. Even the mountain spirit, knowing this, should be tired of it. People travel thousands of miles just to prove their "visit" in photos. As for the beauty of the mountains themselves, no one has truly appreciated it. The mountain remains the same mountain; what has changed are only the people who view it.

Huangshan, or Yellow Mountain, is one of China's most iconic and breathtaking natural landscapes. Located in Anhui Province, this UNESCO World Heritage Site is a destination of unparalleled beauty, steeped in history, and rich in cultural significance. Known for its dramatic peaks, ethereal cloud seas, and ancient pine trees, Huangshan has long inspired poets, painters, and travelers from around the world. A Natural Masterpiece Huangshan is famed for its "Four Wonders": peculiar rock formations, ancient pine trees, seas of clouds, and hot springs. Its rugged granite peaks, many of which rise over 1,000 meters, have been sculpted by nature into extraordinary shapes, resembling animals, humans, or mythical creatures. Notable peaks include Lotus Peak, Celestial Capital Peak, and Bright Summit, each offering panoramic views that leave visitors in awe. The pine trees of Huangshan, some of which are over 1,000 years old, grow precariously on cliffs and rocks. These resilient trees, such as the famous Guest-Greeting Pine, have become symbols of endurance and strength, embodying the spirit of the mountain. A Photographer's Paradise One of the most enchanting features of Huangshan is the ever-changing "sea of clouds" that envelops the mountain peaks. The clouds create an otherworldly atmosphere, giving the impression of floating islands in the sky. Photographers and nature lovers flock to Huangshan to capture its surreal beauty during sunrise and sunset, when the interplay of light and mist creates unforgettable moments. Cultural and Historical Significance Huangshan has been a source of inspiration for centuries, immortalized in traditional Chinese art and literature. It is often depicted in traditional ink paintings, symbolizing the harmony between humanity and nature. The mountain has also influenced Taoist and Buddhist philosophies, with ancient temples and inscriptions scattered across its terrain. In addition to its artistic legacy, Huangshan has played a significant role in Chinese history. The mountain's hot springs, once visited by emperors, were believed to have healing properties. Today, they remain a popular attraction for visitors seeking relaxation and rejuvenation. A Modern Visitor Experience Modern infrastructure has made Huangshan more accessible than ever. Visitors can take cable cars to reach the higher peaks, saving time and energy for exploration. Well-maintained hiking trails of varying difficulty levels cater to both casual tourists and avid adventurers. Nearby, the ancient villages of Hongcun and Xidi, also UNESCO-listed, offer a glimpse into traditional Anhui culture with their charming architecture and serene landscapes. Plan Your Visit Huangshan is a year-round destination, with each season offering unique views and experiences. Spring brings blooming flowers and lush greenery, summer offers cool mountain breezes, autumn showcases vibrant foliage, and winter transforms the peaks into a snowy wonderland. Whether you're seeking natural beauty, cultural immersion, or a moment of serenity, Huangshan is a destination that promises to leave a lasting impression. No wonder it has been called "the loveliest mountain of China."

To Children Author: Gija Kahlil Gibran Your children are not your children. They are the sons and daughters of Life's longing for itself. They come through you but not from you, And though they are with you, yet they belong not to you. You may give them your love but not your thoughts. For they have their own thoughts. You may house their bodies but not their souls, For their souls dwell in the house of tomorrow, which you cannot visit, not even in your dreams. You may strive to be like them, but seek not to make them like you. For life goes not backward nor tarries with yesterday. You are the bows from which your children as living arrows are sent forth. The archer sees the mark upon the path of the infinite, and He bends you with His might that His arrows may go swift and far. Let your bending in the archer's hand be for gladness; For even as he loves the arrow that flies, so He loves also the bow that is stable.

Vacuum reflow Furnace: The "Flawless Guardian" of Precision Electronic Soldering In the modern electronic manufacturing field that pursues ultimate performance and reliability, especially in demanding applications such as aerospace, high-end medical equipment, and automotive electronics, a key link determines the "lifeline" of microelectronic devices - soldering quality. The vacuum reflow furnace is precisely the core equipment that ensures the flawless welding points in this process. Core function: Precise welding in a vacuum environment The core value of the vacuum reflux furnace lies in the low-pressure environment it creates: Powerful bubble expulsion: Under vacuum conditions, the gas inside the molten solder and on the surface of the solder pad is forcibly extracted, significantly reducing or eliminating solder Voids. Voids are small air bubbles inside the solder joint, which can weaken the electrical and thermal conductivity and are the main cause of solder joint fatigue failure. Eliminate oxidation pollution: The vacuum environment isolates active gases such as oxygen. Solder, component pins, and PCB pads are protected from oxidation at high temperatures, ensuring the excellent wetting and spreading ability of molten solder and forming a strong metallurgical bond. Precise temperature control: The furnace chamber is equipped with multi-zone precise temperature control capabilities (typically ±1°C), strictly adhering to the reflow temperature curve required for specific solder paste or solder alloy (preheating, holding, reflow, cooling) to ensure uniform and consistent formation of solder joints. Core advantage: Creating "zero-defect" solder joints Vacuum technology has brought about a qualitative leap: Ultra-low porosity: Significantly reduce the internal porosity of the solder joint from a few percent or even higher in traditional air/nitrogen reflow soldering to below 1%, and even reach a level close to 0% (the specific value depends on the material, process parameters and vacuum degree). For instance, in the packaging of automotive power modules or high-reliability chips, an ultra-low void ratio is crucial for heat dissipation and long-term stability. Ultra-high reliability: The solder joints without voids or oxidation have stronger mechanical strength, better electrical/thermal conductivity and outstanding resistance to thermal fatigue, greatly extending the service life of electronic products. Perfect wettability: In a vacuum "pure" environment, the solder can fully wet the surface to be soldered, forming a smooth and full solder joint profile (Fillet), reducing the risk of false soldering and cold soldering. Compatible with complex packages: Perfectly meets the strict requirements for soldering quality in advanced packages such as bottom-soldered components (such as QFN, LGA, BGA), stacked chips (PoP), large-sized chips, and copper pillar bumps. Key application fields: indispensable high-end manufacturing Vacuum reflow soldering has become an essential process in the following high-end electronic manufacturing scenarios: Aerospace and defense electronics: Satellites, radars, flight control systems, etc. have almost "zero tolerance" requirements for the extreme environmental tolerance (temperature cycling, vibration) of components. Automotive electronics (especially new energy) : Core components such as power control modules (IGBT/SiC), advanced driver assistance system (ADAS) controllers, and battery management systems (BMS) rely on perfect solder joints for their high power density and long-term reliable operation. High-end medical electronics: implantable devices, vital sign monitors, etc. Any welding failure may endanger life safety. High-performance computing and communication: Large-scale BGA packaging in server cpus/Gpus and high-speed network devices, vacuum reflow ensures high signal integrity for tens of thousands of solder joints. Advanced packaging: Cutting-edge technologies such as wafer-level packaging (WLP), 2.5D/3D IC integration, and fan-out packaging have extremely high requirements for the uniformity and low porosity of micro-bump soldering. Technical core and challenges The technical essence of the vacuum reflux furnace lies in: Vacuum system: High-speed vacuum pump sets (such as Roots pump + dry pump/scroll pump combination) achieve rapid vacuuming and maintain the low pressure required by the process (usually adjustable within the range of 1-100 mbar). Precise temperature control: Independent PID control in multiple temperature zones ensures excellent uniformity of furnace temperature, guaranteeing that all solder joints on large-sized PCBS or carriers undergo precise temperature processes simultaneously. Atmosphere management: High-purity nitrogen (N2) can be filled after vacuuming for cooling or through specific process steps to further prevent oxidation. Some of the equipment also has a combined mode of vacuum + inert atmosphere (Forming Gas). Challenges: High equipment cost, relatively long process cycle, and the optimization of process parameters (vacuum degree, vacuuming timing, temperature curve) requires professional knowledge. Market prospect: The cornerstone of precision manufacturing As electronic products continue to evolve towards high performance, miniaturization and high reliability, especially with the explosive growth of electric vehicles, 5G/6G communications, artificial intelligence hardware and advanced packaging, the demand for vacuum reflow soldering technology will remain strong. Domestic manufacturers have been making continuous breakthroughs in core technologies such as high-efficiency vacuum systems and precise temperature control algorithms. The performance and reliability of their equipment are increasingly approaching the international advanced level, providing strong support for the localization of high-end electronic manufacturing. Conclusion The vacuum reflow oven, with its unique ability to create a vacuum environment, has become a key driver for pursuing "zero-defect" soldering in modern high-end electronic manufacturing. It is not only a powerful tool for eliminating solder joint voids, but also a precise "guardian angel" that ensures the long-term stable operation of cutting-edge electronic products in extreme environments. In the continuous journey of electronic technology challenging the physical limits, vacuum reflow soldering technology will continue to play an indispensable core role, laying a solid foundation for the reliability of connecting the microscopic world. Note: The actual improvement effect of the void ratio depends on the specific solder paste (alloy composition, flux type), component /PCB design, vacuum process parameters (vacuum degree, vacuuming timing and duration), and the optimized matching of the temperature curve.