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Home > Products > SMT Pick And Place Machines > MagicRay 3D SPI-VSP3000 Series 3D Solder Paste Inspection System with 12MP Industrial Camera 15μm Resolution and 60*45mm FOV

MagicRay 3D SPI-VSP3000 Series 3D Solder Paste Inspection System with 12MP Industrial Camera 15μm Resolution and 60*45mm FOV

Product Details

Brand Name: MagicRay

Model Number: VSP3000

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 PCS

Price: USD+negotiable+pcs

Packaging Details: 1000*1500*1700mm

Delivery Time: 1-7 days

Payment Terms: T/T

Supply Ability: 1+pcs+per days

Get Best Price
Product Details
Highlight:

SMT screen printing

,

3D solder paste inspection

,

3D SPI-VSP3000 series

Equipment Model:
VSP3000
Image System Camera:
12MP Industrialcamera
Resolution:
15μm,12μm,10μm
FOV:
60*45mm(12MP,15μm)
Height Resolution:
0.37μm
Lighting:
3color Ring ShapeLED(RGB)
Height Measurement Method:
Projectors
Movement Structure:
X/Y Movement
Platform:
Granite
Width Adjustment:
Automatic
Transport Type:
Belt
Board Loading Direction:
Lefttoright Or Right To Left(Select At Point Of Order)
Fixed Rail:
Front Rail
Equipment Model:
VSP3000
Image System Camera:
12MP Industrialcamera
Resolution:
15μm,12μm,10μm
FOV:
60*45mm(12MP,15μm)
Height Resolution:
0.37μm
Lighting:
3color Ring ShapeLED(RGB)
Height Measurement Method:
Projectors
Movement Structure:
X/Y Movement
Platform:
Granite
Width Adjustment:
Automatic
Transport Type:
Belt
Board Loading Direction:
Lefttoright Or Right To Left(Select At Point Of Order)
Fixed Rail:
Front Rail
Product Description
MagicRay 3D SPI-VSP3000 Series Solder Paste Inspection System
Product Overview

The MagicRay 3D SPI-VSP3000 series provides advanced 3D solder paste inspection capabilities for post-SMT screen printing processes, ensuring superior quality control in PCB assembly.

Key Features
  • Intelligent zero reference point technology ensures precise height measurement accuracy
  • Effective detection of solder defects including bridging, breakage, and icicles
  • Reliable performance across PCBs with varying color variations
  • Automatic solder pad compensation enhances measurement accuracy for both height and volume
  • SPC data analysis capabilities for continuous process quality improvement
  • Three Point Checks software quickly identifies root causes of solder paste issues including excess, insufficient application, and smearing
MagicRay 3D SPI-VSP3000 Series 3D Solder Paste Inspection System with 12MP Industrial Camera 15μm Resolution and 60*45mm FOV 0