Key Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and Efficiency

Key Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and Efficiency

In the electronics manufacturing industry, surface mount technology (SMT), as a core production process, plays a decisive role in the quality and performance of electronic products. The 3D DAOI (3D Automated Optical Inspection) and 3DSPI (3D Solder Paste Inspection) technologies, with their high precision and high efficiency, It has become the "precision guardian" in the SMT process.

I. What is SMT process?

The SMT process, namely Surface Mounted Technology (SMT), is a popular technology and process in the electronic assembly industry. It refers to a series of technological processes carried out on the basis of the Printed Circuit Board (PCB for short).

SMT, or surface Mount technology, is used to install leadless or short-lead surface mount components (referred to as SMC/SMD, also known as chip components in Chinese) on the surface of printed circuit boards or other substrates, and then assemble them into circuit connections through methods such as reflow soldering or dip soldering.

SMT patch processing has many advantages:

1. High assembly density, small size and light weight of electronic products. The volume and weight of surface mount components are approximately one-tenth of those of traditional through-hole components. After adopting SMT, the volume of electronic products is usually reduced by 40% to 60%, and the weight is reduced by 60% to 80%.
2. High reliability, strong vibration resistance and low defect rate of solder joints.
3. It has excellent high-frequency characteristics and can reduce electromagnetic and radio frequency interference.
4. It is easy to achieve automation, which can improve production efficiency, reduce costs by 30% to 50%, and also save materials, energy, equipment, labor and time, etc.

Ii. The Crucial Role of 3DSPI in the solder paste printing Process - Controlling quality from the source
Key Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and Efficiency
Precisely monitor the quality of solder paste printing
Solder paste printing is the crucial first step in SMT. 3DSPI, like quality inspectors, provides comprehensive and real-time monitoring. With the help of a high-precision optical imaging system, it accurately captures the distribution of solder paste on the PCB board, such as height, volume, shape and other parameters. Once there is a deviation, it can be promptly fed back to prompt personnel or system adjustments and ensure the quality of solder paste printing.

Realize the closed-loop control of the printing process
3DSPI can transmit data to printing equipment to achieve closed-loop control. If uneven thickness of solder paste is detected, the printing equipment will automatically adjust parameters such as speed and pressure to stabilize the quality of solder paste printing, improve efficiency and reduce rework waste.

The third-generation 3DSPI - ALD67 series of ALeader from Shenzhou Vision is equipped with bidirectional ejector light system technology, which can completely solve the shadow and diffuse reflection problems during the detection process, making the three-dimensional detection accuracy of solder paste higher. It is also equipped with a 12-megapixel high-speed camera, which offers faster detection speed and more detailed and rich images. It can effectively detect whether there are defects such as volume, area, height, offset, insufficient solder, excessive solder, continuous solder, solder tips, and contamination in solder paste printing, effectively helping SMT production lines in electronic manufacturing achieve higher automation, improve quality and efficiency, and reduce costs. 5-minute rapid programming supports Gerber-free automatic programming. Standard dual gratings solve shadow problems. Supports mixed detection of solder paste and red glue. Powerful SPC system (multiple real-time monitoring modes). Remote control system (one person controlling multiple machines). Real-time three/two-point lighting function (data sharing with AO|). Supports closed-loop feedback with printing machines. Supports MES control system. High detection rate. High direct pass rate and fast testing speed.

Key Applications of 3DAOI/SPI in SMT Process: Technical Analysis for Enhancing Production Quality and Efficiency

Iii. Core Functions of 3DAOI in the Mounting and Soldering Processes
Key Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and Efficiency
Detection of component mounting accuracy

3DAOI acquires three-dimensional topography data of PCBS and components through structured light or laser scanning technology to detect defects such as missing parts, offsets, tilting, standing stones, side standing, overturning parts, wrong parts, damage, reverse direction, component height measurement, warping, excessive or insufficient solder, false soldering, and short circuits.

Solder joint quality analysis and defect classification

After reflow soldering, 3DAOI quantitatively analyzes the mounting of components and the height, volume and area of solder joints to determine soldering defects such as false soldering. Its detection data can be connected to the MES system to achieve SPC statistical process control and facilitate process optimization.

The 3DAOl developed by ALeader of Shenzhou Vision features a unique technology of high precision and wide range, capable of simultaneously obtaining high-quality 2D images and shadowless 3D measurements. It covers the inspection requirements of the smallest components and solder joints in current production. Under the "sharp eyes", difficult problems such as warping, false soldering, and false soldering will have no trace. It effectively helps SMT production lines in electronic manufacturing achieve higher levels of automation, improve quality, enhance efficiency and reduce costs.
Product Features:
Intelligent automatic programming technology enables rapid program creation, leading the industry
2. Multi-directional surround full-coverage projection technology ensures the best 3D detection capability
3. With over 40 years of AI deep learning, the system automatically matches the best 3D detection algorithm
4. 3D digitalization can optimize the entire SMT process and achieve higher levels of automation
5. A complete IPC standard public library and a simple operation interface make programming effortless

Iv. 3DAOI/SPI Collaboration and Data Integration - Shenzhou Vision Builds an Efficient Quality Assurance System

In the SMT production line, 3DSPI and 3DAOI form a double closed loop of "prevention - detection" :

3DSPI pre-controls the quality of solder paste printing and reduces the risks of subsequent processes.
The 3DAOI post-verification of the mounting and soldering results ensures the final yield.

Shenzhou Vision's unique two-point/three-point integration platform has a powerful data integration capability and can integrate the data resources of 3DSPI (3D Solder paste Inspection Machine) and 3DAOI (3D Automatic Optical Inspection equipment). Through in-depth mining and precise analysis of massive data, the platform can not only provide comprehensive and in-depth analysis of the root causes of defects, but also make trend predictions based on historical and real-time data. This series of functions provides strong support for customers on the road to pursuing zero-defect production, helping them truly achieve the high-standard goal of zero-defect production.

Key Applications of 3DAOI/SPI in SMT Processes: Technical Analysis for Enhancing Production Quality and Efficiency

V. Industry Applications and Trends

With the growth in demand for miniaturization of electronic components and high-mix assembly lines, 3DAOI/SPI technology is developing towards higher speed, higher precision, and AI-driven directions.
As a leading enterprise in the industry, Shenzhou Vision, with its advanced technology and innovative solutions, provides high-quality 3DAOI/SPI inspection products and services for enterprises through deep learning algorithms and modular hardware design. This helps electronic manufacturing enterprises stand out in the fierce market competition and achieve a dual improvement in product quality and production efficiency.