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Samsung SM471 High Speed Chip Shooter 75000 CPH Dual Gantry

Product Details

Place of Origin: Japan

Brand Name: Samsung

Model Number: SM471

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 PCS

Price: USD+negotiable+pcs

Packaging Details: 1750*1800*1550mm

Delivery Time: 1-7 days

Payment Terms: T/T

Supply Ability: 1+pcs+per days

Get Best Price
Product Details
Highlight:

high speed smt pick and place machines

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high speed smt pick and place equipment

Alignment:
Flying Vision
Number Of Spindles:
2 Gantry X 10 Spindles/Head
Gantry Placement Speed:
75,000 CPH (Optimum)
Placement Accuracy:
Chip ± 50μm (Cpk ≥1.0) (Based On The Standard Chips)
Component Range 1:
Chip 0402( 01005)- £14mm (H12mm)
Component Range 2:
IC, Connector (Lead Pitch 0.4mm)
Component Range 3:
BGA, CSP (Ball Pitch 0.4mm)
Board Dimension (mm) 1:
Minimum Order: 50(L) X 40(W)
Board Dimension (mm) 2:
Single Tool: 510(L) X 460(W)
Board Dimension (mm) 3:
Dual Tool: 460(L) X250(W)
PCB Thickness:
0.38 – 4.2mm
Utility-Power:
AC200/ 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase) Max. 5.0kVA
Air Consumption:
0.5 -0.7MPa (5-7kgf/cm2) 50Nl /min50Nl /min
Mass:
Approx. 1,820kg
Alignment:
Flying Vision
Number Of Spindles:
2 Gantry X 10 Spindles/Head
Gantry Placement Speed:
75,000 CPH (Optimum)
Placement Accuracy:
Chip ± 50μm (Cpk ≥1.0) (Based On The Standard Chips)
Component Range 1:
Chip 0402( 01005)- £14mm (H12mm)
Component Range 2:
IC, Connector (Lead Pitch 0.4mm)
Component Range 3:
BGA, CSP (Ball Pitch 0.4mm)
Board Dimension (mm) 1:
Minimum Order: 50(L) X 40(W)
Board Dimension (mm) 2:
Single Tool: 510(L) X 460(W)
Board Dimension (mm) 3:
Dual Tool: 460(L) X250(W)
PCB Thickness:
0.38 – 4.2mm
Utility-Power:
AC200/ 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase) Max. 5.0kVA
Air Consumption:
0.5 -0.7MPa (5-7kgf/cm2) 50Nl /min50Nl /min
Mass:
Approx. 1,820kg
Product Description
Samsung Pick And Place Machines SM471 Flexible High Speed Chip Shooter
Product Specifications
Attribute Value
Alignment Flying Vision
Number of Spindles 2 Gantry x 10 Spindles/Head
Gantry Placement Speed 75,000 CPH (Optimum)
Placement Accuracy Chip ± 50μm (Cpk ≥1.0) (Based on the Standard Chips)
Component Range 1 Chip 0402( 01005)- £14mm (H12mm)
Component Range 2 IC, connector (Lead Pitch 0.4mm)
Component Range 3 BGA, CSP (Ball Pitch 0.4mm)
Board Dimension (mm) 1 Minimum order: 50(L) x 40(W)
Board Dimension (mm) 2 Single tool: 510(L) x 460(W)
Board Dimension (mm) 3 dual tool: 460(L) x250(W)
PCB Thickness 0.38 – 4.2mm
Utility-Power AC200/ 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase) Max. 5.0kVA
Air Consumption 0.5 -0.7MPa (5-7kgf/cm2) 50Nl /min50Nl /min
Mass Approx. 1,820kg
Product Description

The Samsung SM471 Flexible High Speed Chip Shooter delivers exceptional performance with its dual gantry design featuring 10 spindles per head and advanced flying vision technology. This innovative configuration achieves a remarkable chip mounting speed of 75,000 CPH, setting the industry standard for chip shooters in its class.

The machine incorporates proprietary On-the-Fly image recognition technology that enables component identification without stopping after pickup. This breakthrough significantly reduces movement time between pickup and placement positions while virtually eliminating recognition time, maximizing placement efficiency.

  • Automated pickup position alignment between feeders enhances simultaneous pickup rates
  • Electrically Driven Samsung SM Feeder (SME) supports integrated use of 0603/2P/4P components
  • Adjustable part supply speeds improve component handling stability
  • Compatible with both SM electrically driven feeders (SME) and pneumatically driven feeders (SMN) for operational flexibility
Samsung SM471 High Speed Chip Shooter 75000 CPH Dual Gantry 0
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