Product Details
Place of Origin: Japan
Brand Name: Samsung
Model Number: SM471
Document: Product Brochure PDF
Payment & Shipping Terms
Minimum Order Quantity: 1 PCS
Price: USD+negotiable+pcs
Packaging Details: 1750*1800*1550mm
Delivery Time: 1-7 days
Payment Terms: T/T
Supply Ability: 1+pcs+per days
Alignment: |
Flying Vision |
Number Of Spindles: |
2 Gantry X 10 Spindles/Head |
Gantry Placement Speed: |
75,000 CPH (Optimum) |
Placement Accuracy: |
Chip ± 50μm (Cpk ≥1.0) (Based On The Standard Chips) |
Component Range 1: |
Chip 0402( 01005)- £14mm (H12mm) |
Component Range 2: |
IC, Connector (Lead Pitch 0.4mm) |
Component Range 3: |
BGA, CSP (Ball Pitch 0.4mm) |
Board Dimension (mm) 1: |
Minimum Order: 50(L) X 40(W) |
Board Dimension (mm) 2: |
Single Tool: 510(L) X 460(W) |
Board Dimension (mm) 3: |
Dual Tool: 460(L) X250(W) |
PCB Thickness: |
0.38 – 4.2mm |
Utility-Power: |
AC200/ 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase) Max. 5.0kVA |
Air Consumption: |
0.5 -0.7MPa (5-7kgf/cm2) 50Nl /min50Nl /min |
Mass: |
Approx. 1,820kg |
Alignment: |
Flying Vision |
Number Of Spindles: |
2 Gantry X 10 Spindles/Head |
Gantry Placement Speed: |
75,000 CPH (Optimum) |
Placement Accuracy: |
Chip ± 50μm (Cpk ≥1.0) (Based On The Standard Chips) |
Component Range 1: |
Chip 0402( 01005)- £14mm (H12mm) |
Component Range 2: |
IC, Connector (Lead Pitch 0.4mm) |
Component Range 3: |
BGA, CSP (Ball Pitch 0.4mm) |
Board Dimension (mm) 1: |
Minimum Order: 50(L) X 40(W) |
Board Dimension (mm) 2: |
Single Tool: 510(L) X 460(W) |
Board Dimension (mm) 3: |
Dual Tool: 460(L) X250(W) |
PCB Thickness: |
0.38 – 4.2mm |
Utility-Power: |
AC200/ 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase) Max. 5.0kVA |
Air Consumption: |
0.5 -0.7MPa (5-7kgf/cm2) 50Nl /min50Nl /min |
Mass: |
Approx. 1,820kg |
Attribute | Value |
---|---|
Alignment | Flying Vision |
Number of Spindles | 2 Gantry x 10 Spindles/Head |
Gantry Placement Speed | 75,000 CPH (Optimum) |
Placement Accuracy | Chip ± 50μm (Cpk ≥1.0) (Based on the Standard Chips) |
Component Range 1 | Chip 0402( 01005)- £14mm (H12mm) |
Component Range 2 | IC, connector (Lead Pitch 0.4mm) |
Component Range 3 | BGA, CSP (Ball Pitch 0.4mm) |
Board Dimension (mm) 1 | Minimum order: 50(L) x 40(W) |
Board Dimension (mm) 2 | Single tool: 510(L) x 460(W) |
Board Dimension (mm) 3 | dual tool: 460(L) x250(W) |
PCB Thickness | 0.38 – 4.2mm |
Utility-Power | AC200/ 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase) Max. 5.0kVA |
Air Consumption | 0.5 -0.7MPa (5-7kgf/cm2) 50Nl /min50Nl /min |
Mass | Approx. 1,820kg |
The Samsung SM471 Flexible High Speed Chip Shooter delivers exceptional performance with its dual gantry design featuring 10 spindles per head and advanced flying vision technology. This innovative configuration achieves a remarkable chip mounting speed of 75,000 CPH, setting the industry standard for chip shooters in its class.
The machine incorporates proprietary On-the-Fly image recognition technology that enables component identification without stopping after pickup. This breakthrough significantly reduces movement time between pickup and placement positions while virtually eliminating recognition time, maximizing placement efficiency.